Abstract: A light emitting device includes an LED chip to emit light, and a light emitting element holding member that includes a base on which the LED chip is disposed and a wall standing from the base such that the wall has an inner surface that faces the LED chip. The wall includes inner surfaces that are formed in black, and inner surfaces that are formed in white. The inner surfaces that are formed in black mutually oppose each other. The inner surfaces that are formed in white mutually oppose each other in a direction orthogonal to the direction in which the inner surfaces that are formed in black mutually oppose each other.

Abstract: A light-emitting element includes a casing including a recess, an LED chip disposed within the recess of the casing, and a sealing member permitting passage of light emitted by the LED chip and including a raised curved surface that is curved outward from the casing at an interface with a space external to the casing.

Abstract: A light emitting device includes an LED chip to emit light, and a light emitting element holding member that includes a base on which the LED chip is disposed and a wall standing from the base such that the wall has an inner surface that faces the LED chip. The wall includes inner surfaces that are formed in black, and inner surfaces that are formed in white. The inner surfaces that are formed in black mutually oppose each other. The inner surfaces that are formed in white mutually oppose each other in a direction orthogonal to the direction in which the inner surfaces that are formed in black mutually oppose each other.

Abstract: A light-emitting element includes a casing that includes a recess, an LED chip disposed on a bottom surface of the recess of the casing, a sealing member to close the recess and permit passage of light emitted by the LED chip. The sealing member includes an interface with a space external to the casing, the interface includes an inclined portion at least at a peripheral edge portion of the sealing member, and the inclined portion gradually approaches a bottom surface of the recess as the inclined portion gets farther away from an optical axis of the LED chip.