Patents by Inventor Masato TOKUDA

Masato TOKUDA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240178399
    Abstract: Composite binder materials for energy storage applications are disclosed. The composite binder materials include a fluoropolymer, such as polytetrafluoroethylene (PTFE), integrated with a conductive additive and a low-melting point thermoplastic. Methods of making the composite binder materials are also disclosed. The methods include providing an emulsion of the fluoropolymer, mixing the low-melting point thermoplastic and the particulate conductive additive into the emulsion of the fluoropolymer to form a mixture, and coagulating the mixture to produce a coagulum including the composite binder material. The disclosure also provides a binder powder for an electrochemical device capable of providing an electrode mixture sheet having excellent uniformity of tensile strength. The disclosure relates to a binder powder for an electrochemical device, containing a non-fibrillated fibrillatable resin and a thermoplastic polymer.
    Type: Application
    Filed: January 12, 2024
    Publication date: May 30, 2024
    Applicants: DAIKIN AMERICA, INC., DAIKIN INDUSTRIES, LTD.
    Inventors: Alec FALZONE, Emily Grumbles, Wade Simpson, Joseph Sunstrom, Ronald Hendershot, Taku Yamanaka, Taketo Kato, Takaya Yamada, Junpei Terada, Masato Tokuda, Kenta Nishimura
  • Publication number: 20230183450
    Abstract: A foam molding composition from which a foam molded body and a foamed electric wire can be produced having excellent heat resistance, a small average cell size, a high foaming ratio, and good outer diameter stability. The foam molding composition includes a resin (A) having a pyrolysis temperature of 330° C. or higher and at least one compound (B) selected from phosphoric acid esters and salts thereof and phosphoric acid ester complex compounds. Also disclosed is a foam molded body obtained from the foam molding composition, an electric wire including a core wire and a covering material covering the core wire obtained from the foam molding composition, and a method for producing the foam molded body.
    Type: Application
    Filed: February 2, 2023
    Publication date: June 15, 2023
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Hideki KOUNO, Kenji ISHII, Masato TOKUDA, Takahiro KITAHARA
  • Publication number: 20230167258
    Abstract: A foam molding composition containing a fluororesin (A) and a compound (B) having a pyrolysis temperature of 300° C. or higher and a solubility parameter (SP value) of 8 to 15. Also disclosed is a foamed electric wire including a core wire, and a fluororesin layer or a fluororesin composition layer covering the core wire, a foam molded body, a method for producing a foam molded body, and a method for producing an electric wire.
    Type: Application
    Filed: January 24, 2023
    Publication date: June 1, 2023
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Kenji ISHII, Masato TOKUDA