Abstract: This sensor has a probe inserted into a living body, and measures an analyte, wherein the probe has a substrate, an electrode formed on the substrate, a reagent layer formed on the electrode, a first protective film formed on the reagent layer, and a second protective film which is thinner than the first protective film and formed on the first protective film.

Abstract: Electronic spectacles include a spectacle frame; lenses having electric elements; a control unit that generates electric signals for driving the electric elements of the lenses; electric connectors that transmit the signals from the control unit to wiring connector pads; and conductive rubber members sandwiched between the wiring connector pads and lens electrode pads of the lenses.

Abstract: A first recess (102) of a lower substrate (100) is coated with conductive ink to form a first auxiliary electrode layer (104), a lower electrode pattern (105) is formed thereon by vacuum deposition, a second recess (202) of an upper substrate (200) is coated with the conductive ink to form a second auxiliary electrode layer (204), an upper electrode pattern (205) is formed thereon by vacuum deposition, the upper and lower substrates are bonded to each other with an electric element (300) interposed between the lower substrate (100) and the upper substrate (100), and the upper and lower substrates are cut at positions on the overlap portion of the first auxiliary electrode layer (104) and the lower electrode pattern (105) and the overlap portion of the second auxiliary electrode layer (204) and the upper electrode pattern (205) so as to expose the cut surfaces of the substrates.

Abstract: Electronic spectacles include a spectacle frame; lenses having electric elements; a control unit that generates electric signals for driving the electric elements of the lenses; electric connector that transmit the signals from the control unit to wiring connector pads; and the electric connector have one end connected to a control unit for controlling the electric element and an another end extended to the inside of a rim of the spectacle frame. The electric connector passes through rim locks.

Abstract: Electronic spectacles include a spectacle frame; lenses having electric elements; a control unit that generates electric signals for driving the electric elements of the lenses; electric connectors that transmit the signals from the control unit to wiring connector pads; and the electric connector have one end connected to a control unit for controlling the electric element and an another end connected to lens electrode pads. The lens has an inverted V-shaped protrusion.

Abstract: A first recess (102) of a lower substrate (100) is coated with conductive ink to form a first auxiliary electrode layer (104), a lower electrode pattern (105) is formed thereon by vacuum deposition, a second recess (202) of an upper substrate (200) is coated with the conductive ink to form a second auxiliary electrode layer (204), an upper electrode pattern (205) is formed thereon by vacuum deposition, the upper and lower substrates are bonded to each other with an electric element (300) interposed between the lower substrate (100) and the upper substrate (100), and the upper and lower substrates are cut at positions on the overlap portion of the first auxiliary electrode layer (104) and the lower electrode pattern (105) and the overlap portion of the second auxiliary electrode layer (204) and the upper electrode pattern (205) so as to expose the cut surfaces of the substrates.

Abstract: A first recess (102) of a lower substrate (100) is coated with conductive ink to form a first auxiliary electrode layer (104), a lower electrode pattern (105) is formed thereon by vacuum deposition, a second recess (202) of an upper substrate (200) is coated with the conductive ink to form a second auxiliary electrode layer (204), an upper electrode pattern (205) is formed thereon by vacuum deposition, the upper and lower substrates are bonded to each other with an electric element (300) interposed between the lower substrate (100) and the upper substrate (100), and the upper and lower substrates are cut at positions on the overlap portion of the first auxiliary electrode layer (104) and the lower electrode pattern (105) and the overlap portion of the second auxiliary electrode layer (204) and the upper electrode pattern (205) so as to expose the cut surfaces of the substrates.

Abstract: A first recess (102) of a lower substrate (100) is coated with conductive ink to form a first auxiliary electrode layer (104), a lower electrode pattern (105) is formed thereon by vacuum deposition, a second recess (202) of an upper substrate (200) is coated with the conductive ink to form a second auxiliary electrode layer (204), an upper electrode pattern (205) is formed thereon by vacuum deposition, the upper and lower substrates are bonded to each other with an electric element (300) interposed between the lower substrate (100) and the upper substrate (100), and the upper and lower substrates are cut at positions on the overlap portion of the first auxiliary electrode layer (104) and the lower electrode pattern (105) and the overlap portion of the second auxiliary electrode layer (204) and the upper electrode pattern (205) so as to expose the cut surfaces of the substrates.

Abstract: A first recess (102) of a lower substrate (100) is coated with conductive ink to form a first auxiliary electrode layer (104), a lower electrode pattern (105) is formed thereon by vacuum deposition, a second recess (202) of an upper substrate (200) is coated with the conductive ink to form a second auxiliary electrode layer (204), an upper electrode pattern (205) is formed thereon by vacuum deposition, the upper and lower substrates are bonded to each other with an electric element (300) interposed between the lower substrate (100) and the upper substrate (100), and the upper and lower substrates are cut at positions on the overlap portion of the first auxiliary electrode layer (104) and the lower electrode pattern (105) and the overlap portion of the second auxiliary electrode layer (204) and the upper electrode pattern (205) so as to expose the cut surfaces of the substrates.

Abstract: A first recess (102) of a lower substrate (100) is coated with conductive ink to form a first auxiliary electrode layer (104), a lower electrode pattern (105) is formed thereon by vacuum deposition, a second recess (202) of an upper substrate (200) is coated with the conductive ink to form a second auxiliary electrode layer (204), an upper electrode pattern (205) is formed thereon by vacuum deposition, the upper and lower substrates are bonded to each other with an electric element (300) interposed between the lower substrate (100) and the upper substrate (100), and the upper and lower substrates are cut at positions on the overlap portion of the first auxiliary electrode layer (104) and the lower electrode pattern (105) and the overlap portion of the second auxiliary electrode layer (204) and the upper electrode pattern (205) so as to expose the cut surfaces of the substrates.

Abstract: A first recess (102) of a lower substrate (100) is coated with conductive ink to form a first auxiliary electrode layer (104), a lower electrode pattern (105) is formed thereon by vacuum deposition, a second recess (202) of an upper substrate (200) is coated with the conductive ink to form a second auxiliary electrode layer (204), an upper electrode pattern (205) is formed thereon by vacuum deposition, the upper and lower substrates are bonded to each other with an electric element (300) interposed between the lower substrate (100) and the upper substrate (100), and the upper and lower substrates are cut at positions on the overlap portion of the first auxiliary electrode layer (104) and the lower electrode pattern (105) and the overlap portion of the second auxiliary electrode layer (204) and the upper electrode pattern (205) so as to expose the cut surfaces of the substrates.

Abstract: The invention provides a method capable of manufacturing a micropump check valve, inexpensively and without much trouble or time, which does not cause disadvantages even if a material that dissolves an adhesive is contained in the fluid, and which allows bonding with high accuracy. After a valve forming member and a valve receiving member are bonded, a valve receptor is projected towards a valve part and pretension is applied. Thus, the valve forming member and the valve receiving member can be satisfactorily bonded through a solid phase diffusion bonding method and the like using a relatively inexpensive material, such as stainless steel, without using an adhesive, and the pretension is not reduced when in the annealing state.

Abstract: The invention provides a method capable of manufacturing a micropump check valve, inexpensively and without much trouble or time, which does not cause disadvantages even if a material that dissolves an adhesive is contained in the fluid, and which allows bonding with high accuracy. After a valve forming member and a valve receiving member are bonded, a valve receptor is projected towards a valve part and pretension is applied. Thus, the valve forming member and the valve receiving member can be satisfactorily bonded through a solid phase diffusion bonding method and the like using a relatively inexpensive material, such as stainless steel, without using an adhesive, and the pretension is not reduced when in the annealing state.

Abstract: A first recess (102) of a lower substrate (100) is coated with conductive ink to form a first auxiliary electrode layer (104), a lower electrode pattern (105) is formed thereon by vacuum deposition, a second recess (202) of an upper substrate (200) is coated with the conductive ink to form a second auxiliary electrode layer (204), an upper electrode pattern (205) is formed thereon by vacuum deposition, the upper and lower substrates are bonded to each other with an electric element (300) interposed between the lower substrate (100) and the upper substrate (100), and the upper and lower substrates are cut at positions on the overlap portion of the first auxiliary electrode layer (104) and the lower electrode pattern (105) and the overlap portion of the second auxiliary electrode layer (204) and the upper electrode pattern (205) so as to expose the cut surfaces of the substrates.