Patents by Inventor Masatomo Mishima

Masatomo Mishima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD AND APPARATUS FOR MANUFACTURING WOUND ELECTRODE ASSEMBLY FOR BATTERY
    Publication number: 20120318462
    Abstract: The present invention aims to provide a method for bonding protective tapes to the cut edges of an electrode plate within a short period to prevent short circuit in an electrode assembly. An electrode plate cutting & tape bonding process includes (1) cutting an electrode plate into pieces 100a and 100b, (2) forming a gap W between edges 106 and 107 of the pieces 100a and 100b, (3) bonding protective tapes 51 and 52 to both sides of the pieces 100a and 100b, covering the edges and the gap, and (4) conveying the pieces 100a and 100b connected together. Next, the tapes 51 and 52 are cut into pieces 51a & 52a and 51b & 52b. Then, the electrode plate piece 100a with the tape pieces 51a & 52a and 51b & 52b is wound together with a negative electrode plate, with a separator sandwiched therebetween.
    Type: Application
    Filed: August 30, 2012
    Publication date: December 20, 2012
    Applicant: SANYO Electric Co., Ltd.
    Inventors: Tatsuya NAGARE, Masatomo MISHIMA, Souichirou UENO
  • Method and apparatus for manufacturing wound electrode assembly for battery
    Patent number: 8313606
    Abstract: The present invention aims to provide a method for bonding protective tapes to the cut edges of an electrode plate within a short period to prevent short circuit in an electrode assembly. An electrode plate cutting & tape bonding process includes (1) cutting an electrode plate into pieces 100a and 100b, (2) forming a gap W between edges 106 and 107 of the pieces 100a and 100b, (3) bonding protective tapes 51 and 52 to both sides of the pieces 100a and 100b, covering the edges and the gap, and (4) conveying the pieces 100a and 100b connected together. Next, the tapes 51 and 52 are cut into pieces 51a & 52a and 51b & 52b. Then, the electrode plate piece 100a with the tape pieces 51a & 52a and 51b & 52b is wound together with a negative electrode plate, with a separator sandwiched therebetween.
    Type: Grant
    Filed: February 23, 2010
    Date of Patent: November 20, 2012
    Assignee: SANYO Electric Co., Ltd.
    Inventors: Tatsuya Nagare, Masatomo Mishima, Souichirou Ueno
  • METHOD AND APPARATUS FOR MANUFACTURING WOUND ELECTRODE ASSEMBLY FOR BATTERY
    Publication number: 20100212817
    Abstract: The present invention aims to provide a method for bonding protective tapes to the cut edges of an electrode plate within a short period to prevent short circuit in an electrode assembly. An electrode plate cutting & tape bonding process includes (1) cutting an electrode plate into pieces 100a and 100b, (2) forming a gap W between edges 106 and 107 of the pieces 100a and 100b, (3) bonding protective tapes 51 and 52 to both sides of the pieces 100a and 100b, covering the edges and the gap, and (4) conveying the pieces 100a and 100b connected together. Next, the tapes 51 and 52 are cut into pieces 51a & 52a and 51b & 52b. Then, the electrode plate piece 100a with the tape pieces 51a & 52a and 51b & 52b is wound together with a negative electrode plate, with a separator sandwiched therebetween.
    Type: Application
    Filed: February 23, 2010
    Publication date: August 26, 2010
    Applicant: SANYO ELECTRIC CO., LTD.
    Inventors: Tatsuya Nagare, Masatomo Mishima, Souichirou Ueno