Abstract: A liquid epoxy resin composition comprising (A) a liquid epoxy resin, (B) an amine curing agent, and (C) an inorganic filler in an amount of from 50 to 900 parts by weight per 100 parts by weight of the component (A), wherein the component (B) is contained in such an amount that a molar ratio of epoxy groups of the component (A) to amino groups of the component (B), ranges from 0.6 to less than 1.0, provided that, if the component (B) includes an amine curing agent which is solid in the composition at a temperature of from room temperature to 150° C., a content of such an amine is 30 mol % or less, based on the component (B).

Abstract: A liquid epoxy resin composition comprising (A) a liquid epoxy resin; (B) an amine curing agent; (C) a nitrogen compound selected from the group consisting of organic acids salts of tertiary amines, amino acids, imino acids, and monoamine compounds having an alcoholic hydroxyl group in an amount of from 0.1 to 20 parts by weight per total 100 parts by weight of the components (A) and (B); and (D) an inorganic filler in an amount of from 50 to 900 parts by weight per 100 parts by weight of the component (A).

Abstract: A liquid epoxy resin composition comprising: (A) a liquid epoxy resin; (B) an amine type curing agent; (C) a sulfur-containing phenol compound in an amount of from 1 to 20 parts by weight per total 100 parts by weight of the components (A) and (B); and (D) an inorganic filler in an amount of from 50 to 900 parts by weight per 100 parts by weight of the component (A).

Abstract: A liquid epoxy resin composition comprising (A) a liquid epoxy resin, (B) a curing agent, (C) an inorganic filler, (D) a hygroscopic agent, and optionally, (E) a fluxing agent has the advantages of void-free fill, shelf stability and solder connection, and is thus advantageously used in the fabrication of flip chip semiconductor devices by the no-flow method.

Abstract: The invention relates to a process for producing a semiconductor device in which a circuit substrate and a semiconductor chip are connected through a plurality of solder bump electrodes, said process comprising applying a non-cleaning type flux to at least a portion of a bonding pad in the circuit substrate and a semiconductor chip; applying an under-fill material to the circuit substrate or the semiconductor chip; positioning the semiconductor chip and the circuit substrate; and bonding the semiconductor chip and the circuit substrate through a thermocompression bonding, and a semiconductor device produced by the process. By using the process, since it is not necessary to add a flux component deteriorating the reliability of an under-fill material as the sealant to the under-fill material, reliability of the semiconductor device is not deteriorated. Further, since the intrusion step of thin film is not used, mounting can be conducted in a relatively short time.

Abstract: A liquid epoxy resin composition comprising: (A) a liquid epoxy resin; (B) an amine type curing agent; (C) a sulfur-containing phenol compound in an amount of from 1 to 20 parts by weight per total 100 parts by weight of the components (A) and (B); and (D) an inorganic filler in an amount of from 50 to 900 parts by weight per 100 parts by weight of the component (A).

Abstract: A liquid epoxy resin composition comprising (A) a liquid epoxy resin (B) an amine curing agent (C) a nitrogen compound selected from the group consisting of organic acids salts of tertiary amines, amino acids, imino acids, and monoamine compounds having an alcoholic hydroxyl group in an amount of from 0.1 to 20 parts by weight per total 100 parts by weight of the components (A) and (B), and (D) an inorganic filler in an amount of from 50 to 900 parts by weight per 100 parts by weight of the component (A).

Abstract: A liquid epoxy resin composition comprising (A) a liquid epoxy resin (B) an amine curing agent and (C) an inorganic filler in an amount of from 50 to 900 parts by weight per 100 parts by weight of the component (A), wherein the component (B) is contained in such an amount that a molar ratio of epoxy groups of the component (A) to amino groups of the component (B), ranges from 0.6 to less than 1.0, provided that, if the component (B) includes an amine curing agent which is solid in the composition at a temperature of from room temperature to 150° C., a content of such an amine is 30 mol % or less, based on the component (B).

Abstract: In a coated optical fiber comprising a quartz glass fiber, a primary coating and a secondary coating, the secondary coating is formed by curing a resin composition comprising (A) 20-90 wt % of a polyurethane (meth)acrylate oligomer which is synthesized from an alicyclic polyisocyanate, contains 5-90 wt % of a polyurethane (meth)acrylate oligomer having a Mn of up to 1,000, and has an overall Mn of up to 10,000, and (B) 80-10 wt % of an ethylenically unsaturated compound, with electron beams accelerated at 50-125 kV. The coated optical fiber has a minimized transmission loss.

Abstract: An optical fiber coating material is provided in the form of an electron beam-curable resin composition comprising a polyurethane having at least two ethylenically unsaturated groups, a reactive diluent, and a compound having both nitrogen and sulfur atoms. The optical fiber coating material is sufficiently EB curable to minimize the dependency of gel fraction and Young's modulus on an EB dose and to comply with the high-speed drawing of optical fiber. The coating material is cured with EB under specific conditions to achieve a sufficient degree of cure and uniform properties without adversely affecting the transmission loss of the optical fiber.

Abstract: In a coated optical fiber comprising a quartz glass fiber, a primary coating and a secondary coating, the secondary coating is formed by curing a resin composition comprising (A) 20-90 wt % of a polyurethane (meth)acrylate oligomer which is synthesized from an alicyclic polyisocyanate, contains 5-90 wt % of a polyurethane (meth)acrylate oligomer having a Mn of up to 1,000, and has an overall Mn of up to 10,000, and (B) 80-10 wt % of an ethylenically unsaturated compound, with electron beams accelerated at 50-125 kV. The coated optical fiber has a minimized transmission loss.

Abstract: In a coated optical fiber comprising a quartz glass fiber, a primary coating, and a secondary coating, the secondary coating is formed by curing a resin composition comprising (A) 20-90 wt % of polyurethane (meth)acrylate oligomer having a Mn of up to 20,000 and (B) 80-10 wt % of a mono-ethylenically unsaturated compound containing at least one N-vinyl compound, whose homopolymer has a Tg of at least 50° C., with electron beams accelerated at a low voltage of 50-125 kV. The coated optical fiber has a minimized transmission loss.

Abstract: The invention provides a photocurable resin composition which inhibits the deactivation of a bisacylphosphine oxide-series photopolymerization initiator and is useful for coating optical fibers. The photocurable resin composition comprises (A) a polyurethane (meth)acrylate oligomer, (B) an ethylenically unsaturated compound, (C) a bisacylphosphine oxide-series photopolymerization initiator, and (D) a tertiary amine and no tin component. Incorporation of the component (D) inhibits the decomposition and deactivation of the component (C). The component (A) may contain an aliphatic C.sub.14-40 polyol (hydrogenated dimerdiol, 12-hydroxystearyl alcohol) as a polyol component. This resin composition is used for a primary coating of a glass fiber or an indirect coating of an optical fiber through the primary layer, the coating layer being cured by light irradiation to provide an optical fiber coated with the resin composition.

Abstract: In the coating composition for a optical fiber of the present invention, a polyurethane (meth)acrylate oligomer (A), which is based on a urethane prepolymer having an equivalent ratio of NCO group in a polyisocyanate (a) to OH group in a polyol (b) of more than 3.0, is used and the oligomer (A) has a mixing weight ratio of an oligomer (d) having a number average molecular weight of 800 or less to an oligomer (e) having a number average molecular weight of 1,000 or more of 30/70-70/30.The coating composition of this invention has a low viscosity, and therefore, is suitable for a rapid fiber-drawing in a production of an optical fiber. Further, a cured material obtained from the coating composition of the present invention has both a high elastic modulus and a high elongation, which properties are required for a hard material, and has a slight change of elastic modulus with a change of temperature to improve a long-term reliability of an optical fiber.