Abstract: An optical wiring substrate provides a slab optical waveguide having a refractive index different from a refractive index of other surrounding portions and a planar convex lens being provided continuously to a tip portion of an optical path of an optical wave guide including a core and cladding and formed on a substrate. The optical path of light passing through the planar convex lens is converted approximately by 90° with a mirror. The light reflected with the mirror is made as parallel light rays by use of a cylindrical lens.

Abstract: Provided is a highly efficient method for manufacturing preferably a small diameter substrate for a magnetic recording medium. More specifically, provided is a method for manufacturing a substrate for a magnetic recording medium, comprising a step of coring for obtaining a plurality of doughnut-shaped substrates having a diameter at most 65 mm from a monocrystalline silicon wafer having a diameter at least 150 mm and at most 300 mm, wherein coring of an inner diameter and an outer diameter are carried out by different means. In said step of coring said coring of the inner diameter is preferably carried out by water jet cutting or laser cutting.

Abstract: Provided is a substrate for a magnetic recording medium, preferably a substrate having a small diameter of not more than 65 mm, which is advantageous in respect of physical properties and cost. More specifically, provided is a substrate for a magnetic recording medium, using a monocrystalline silicon wafer which has been heated and/or etched at least once before. Moreover, provided is a method for manufacturing a substrate for a magnetic recording medium, the method comprising a step of coring for obtaining a plurality of doughnut-shaped substrates having an outer diameter of not more than 65 mm from a monocrystalline silicon wafer having a diameter of at least 150 mm and at most 300 mm which has undergone heating and/or etching at least once. The method may preferably further comprise a step of chamfering for removing edges of inner and outer circumferential faces of said doughnut-shaped substrate; and a step of circumferential face-polishing for polishing the chamfered inner and outer circumferential faces.

Abstract: Provided is a method for improving the productivity of a coring step. More specifically, provided is a method for manufacturing a substrate for a magnetic recording medium substrate, comprising a step of coring for obtaining a plurality of doughnut-shaped substrates having a diameter of at most 55 mm from a monocrystalline silicon wafer of a diameter having at least 150 mm and at most 300 mm, wherein the coring is performed such that a leftover wafer excluding the plurality of substrates remains in one piece. In said step of coring, the coring is preferably performed using a laser cutting or a water jet cutting such that said minimum width of said surface of said leftover wafer is 1.5 to 2.5 times the thickness of the wafer.

Abstract: Provided are a surface-treated substrate for a magnetic recording medium which has uniform properties with regards to film formation above a non-magnetic substrate and can contain thick film, and the magnetic recoding medium comprising a recording layer. More specifically, it has been found that it is effective that the surface-treated substrate for the magnetic recording medium comprises a non-magnetic substrate and a primer plating layer disposed on the non-magnetic substrate wherein the non-magnetic substrate has been subjected to hydrophilic treatment. It has been also found that a magnetic recording medium comprising the surface-treated substrate for a magnetic recording medium, a soft magnetic layer and a recording layer is preferable as a perpendicular magnetic recording medium.

Abstract: The present invention provides a surface-treated substrate for a magnetic recording medium, and a magnetic recording medium comprising a recording layer, wherein the surface-treated substrate can contain thick film which has adhesion strong enough to withstand leveling process such as polishing in the formation of film on the Si substrate. More specifically, the present invention provides a surface-treated substrate for a magnetic recording medium, comprising a Si substrate and a primer plating layer on the Si substrate, wherein the primer plating layer is film which comprises a metal and a Si oxide. Furthermore, the present invention provides a surface-treated substrate for a magnetic recording medium, comprising a Si substrate and a primer plating layer on the Si substrate, wherein at least 5 and at most 50 protrusions of a height of at least 100 nm per 100 &mgr;m2 are present on a surface of the primer plating layer.

Abstract: An optical wiring substrate provides a slab optical waveguide having a refractive index different from a refractive index of other surrounding portions and a planar convex lens being provided continuously to a tip portion of an optical path of an optical wave guide including a core and cladding and formed on a substrate. The optical path of light passing through the planar convex lens is converted approximately by 90° with a mirror. The light reflected with the mirror is made as parallel light rays by use of a cylindrical lens.

Abstract: There is provided A method for producing an optical device by bonding optical elements each other without using adhesive wherein the optical elements are bonded each other by using optical elements in which the relation between linear expansion coefficients &agr;1 and &agr;2 (/° C.) of each of the optical elements to be bonded and thickness t2 (m) of one of the optical elements satisfies the following formula: |(&agr;1−&agr;2)×t2|≦10−9 and t2≧2×10−5; and/or, by sticking the optical elements each other in the state of being heated, and then subjecting them to a heat treatment. There can be provided a small size and highly reliable optical devise by bonding optical elements each other without using an adhesive at a low cost.

Abstract: In plating on an Si substrate, it has been strongly demanded to apply a treatment for providing an excellent adhesion so as to resist a post-processing such as polishing and for facilitating plating. Then, provided is a plated substrate adapted for hard disk medium comprising an Si single crystal; an amorphous layer on the substrate, the amorphous layer having thickness of 2 to 200 nm and containing Si and one or more metals selected from a group consisting of Ni, Cu and Ag; a multicrystal layer on the amorphous layer, the multicrystal layer having thickness of 5 to 1000 nm and containing Si and one or more metals selected from a group consisting of Ni, Cu and Ag.

Abstract: A modular computer system includes a core unit comprising a processor and a memory; a removable modular accessory; a docking connector for connecting the accessory to the core unit; and one or more subsystems contained within the accessory. The system is partitioned such that any of the cooling, power or input/output subsystems can be disposed within the modular accessory such that these subsystems can be removed from the system by removing the accessory. The core unit by itself is not useful to a user because it lacks power, cooling, or a user interface. The core unit can be connected into any of a variety of accessories and it adapts its functions to the system resources provided by each type of accessory.

Abstract: The present invention provides An optical device, which is formed by bonding two polarizers to both surfaces of a magnetic garnet crystal directly or through a transparent optical material without using an adhesive and which functions when light is transmitted through its bonded surface, wherein the optical device is formed with a sufficient bonding strength on either condition that at least one or more of each linear expansion coefficient and thickness of the magnetic garnet crystal, the transparent optical material and the polarizer is controlled; or that a bonded body, which is formed by bonding them directly or through the transparent optical material without using an adhesive, is fixed on a base. Thus, there is provided a small size, highly reliable, and, low cost optical devise formed by bonding each optical element without using an adhesive.

Abstract: There is provided A method for producing an optical device by bonding optical elements each other without using adhesive wherein the optical elements are bonded each other by using optical elements in which the relation between linear expansion coefficients &agr;1 and &agr;2 (/° C.) of each of the optical elements to be bonded and thickness t2 (m) of one of the optical elements satisfies the following formula: |(&agr;1−&agr;2)×t2|≦10−9 and t2≧2×10−5; and/or, by sticking the optical elements each other in the state of being heated, and then subjecting them to a heat treatment. There can be provided a small size and highly reliable optical devise by bonding optical elements each other without using an adhesive at a low cost.

Abstract: An optical waveguide comprising an MgO substrate 10, and a slab waveguide layer 24 formed on the MgO substrate 10 and including a core layer 18 of a ferroelectric or an antiferroelectric, further comprises a stress alleviating layer 12 which substantially lattice-matches with the MgO substrate and the slab waveguide layer 24 and has an average thermal expansion coefficient in the range of 7.0×10−6-14.0×10−6/° C. at the room temperature to 700° C. Accordingly, the optical waveguide device utilizing the magnesium oxide substrate can be formed without breaking the optical waveguide layer and the magnesium oxide substrate itself.

Abstract: The optical deflector comprises: an optical waveguide 12 of a dielectric material having electrooptical effect; and a pair of electrodes 10, 14 opposed to each other across the optical waveguide, an electric field is applied between the opposed electrodes to change a refractive index of the dielectric material to thereby control a propagating direction of signal light propagating in the optical waveguide 12, wherein the dielectric material has a first refractive index in its initial state, has a second refractive index by application of an electric field of a first polarity, and retains as a third refractive index a refractive index obtained after the electric field has been removed. The dielectric material has the third refractive index has the first refractive index by the application of an electric field of a second polarity different from the first polarity and removal of the electric field.

Abstract: A prism pair is employed as an optical deflecting element. The prism pair is constructed by a slab waveguide, and first and second upper electrodes and first and second lower electrodes arranged on and under the slab waveguide. These electrodes are shaped into a wedge shape (e.g., triangular shape), and change the refractive index of a part of the slab waveguide by utilizing the electrooptic effect to change the propagation direction of light.

Abstract: An optical wiring substrate provides a slab optical waveguide having a refractive index different from a refractive index of other surrounding portions and a planar convex lens being provided continuously to a tip portion of an optical path of an optical wave guide including a core and cladding and formed on a substrate. The optical path of light passing through the planar convex lens is converted approximately by 90° with a mirror. The light reflected with the mirror is made as parallel light rays by use of a cylindrical lens.

Abstract: A prism pair is employed as an optical deflecting element. The prism pair is constructed by a slab waveguide, and first and second upper electrodes and first and second lower electrodes arranged on and under the slab waveguide. These electrodes are shaped into a wedge shape (e.g., triangular shape), and change the refractive index of a part of the slab waveguide by utilizing the electrooptic effect to change the propagation direction of light.

Abstract: Provided is an inexpensive process for producing hydrogen absorbing alloy powder suitable for a nickel-metal hydride storage battery having a high rate discharge property, a high capacity and a long cycle life for repetition of charge and discharge. The process comprises a step of an addition of a rare earth metal oxide and/or hydroxide to a hydrogen absorbing alloy powder, a wet or dry mixing step and a thermal treatment step in an inert atmosphere or in a vacuum.

Abstract: Provided is a hydrogen absorbing alloy powder for use in nickel-metal hydride storage batteries having a high capacity, excellent initial characteristics and a long life. Specifically provided is a process for the production of a hydrogen absorbing alloy powder which includes the steps of treating a hydrogen absorbing alloy powder with an acid solution, and subsequently treating the hydrogen absorbing alloy powder with a solution containing a condensed phosphoric acid having 2 to 20 phosphorus atoms per molecule and/or phytic acid, as well as an electrode formed of the hydrogen absorbing alloy powder produced by the above process.

Abstract: Provided is an inexpensive process for producing hydrogen absorbing alloy powder suitable for a nickel-metal hydride storage battery having a high rate discharge property, a high capacity and a long cycle life for repetition of charge and discharge. The process comprises a step of an addition of a rare earth metal oxide and/or hydroxide to a hydrogen absorbing alloy powder, a wet or dry mixing step and a thermal treatment step in an inert atmosphere or in a vacuum.