Patents by Inventor Masatoshi Kasahara
Masatoshi Kasahara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240136204Abstract: A processing liquid supply system includes a tank that stores a processing liquid supplied from a processing liquid supply, a circulation passage that is connected to the tank, a plurality of supply passages that is connected to the circulation passage and supplies the processing liquid to each of a plurality of liquid processing units that perform a liquid processing on a substrate, a first pump filter set that is a combination of a first pump and a plurality of first filters provided downstream of the first pump, and a second pump filter set that is a combination of a second pump and a plurality of second filters provided downstream of the second pump. The first pump filter set and the second pump filter set are arranged in series in the circulation passage such that the first pump filter set is located upstream of the second pump filter set.Type: ApplicationFiled: October 16, 2023Publication date: April 25, 2024Inventors: Masatoshi KASAHARA, Keiichiro UCHINO, Sadamichi MORI, Naohiro IWANAGA
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Publication number: 20240096654Abstract: A substrate processing method includes: increasing a temperature of a substrate by heating the substrate; after the increasing the temperature of the substrate, forming a liquid film of a pre-wetting liquid on a first surface of the substrate by supplying the pre-wetting liquid to the first surface of the substrate while heating and rotating the substrate at a first rotational speed; after the forming the liquid film, processing the first surface of the substrate with a chemical liquid by supplying the chemical liquid to the first surface of the substrate while heating and rotating the substrate at a second rotational speed that is lower than the second rotational speed; and after the processing the first surface of the substrate, decreasing the temperature of the substrate.Type: ApplicationFiled: November 27, 2023Publication date: March 21, 2024Inventors: Fumihiro KAMIMURA, Masatoshi KASAHARA, Teruomi MINAMI, Ikuo SUNAKA
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Patent number: 11869777Abstract: A substrate processing method includes: increasing a temperature of a substrate by heating the substrate; after the increasing the temperature of the substrate, forming a liquid film of a pre-wetting liquid on a first surface of the substrate by supplying the pre-wetting liquid to the first surface of the substrate while heating and rotating the substrate at a first rotational speed; after the forming the liquid film, processing the first surface of the substrate with a chemical liquid by supplying the chemical liquid to the first surface of the substrate while heating and rotating the substrate at a second rotational speed that is lower than the second rotational speed; and after the processing the first surface of the substrate, decreasing the temperature of the substrate.Type: GrantFiled: September 24, 2020Date of Patent: January 9, 2024Assignee: TOKYO ELECTRON LIMITEDInventors: Fumihiro Kamimura, Masatoshi Kasahara, Teruomi Minami, Ikuo Sunaka
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Publication number: 20220037167Abstract: A substrate processing apparatus includes: at least one processing part for etching a polysilicon film or an amorphous silicon film formed on a substrate using an alkaline chemical liquid; a reservoir configured to recover and store the chemical liquid used in the at least one processing part; processing lines configured to supply the chemical liquid stored in the reservoir to the at least one processing part; a circulation line configured to take out the chemical liquid from the reservoir and to return the same to the reservoir; and a first gas supply line connected to the circulation line and configured to supply an inert gas to the circulation line. The circulation line includes an ejection port configured to eject a mixed fluid of the inert gas supplied by the first gas supply line and the chemical liquid taken out from the reservoir into the chemical liquid stored in the reservoir.Type: ApplicationFiled: July 26, 2021Publication date: February 3, 2022Inventors: Takashi YABUTA, Hidetoshi NAKAO, Masatoshi KASAHARA, Daisuke SAIKI
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Publication number: 20210098271Abstract: A substrate processing method includes: increasing a temperature of a substrate by heating the substrate; after the increasing the temperature of the substrate, forming a liquid film of a pre-wetting liquid on a first surface of the substrate by supplying the pre-wetting liquid to the first surface of the substrate while heating and rotating the substrate at a first rotational speed; after the forming the liquid film, processing the first surface of the substrate with a chemical liquid by supplying the chemical liquid to the first surface of the substrate while heating and rotating the substrate at a second rotational speed that is lower than the second rotational speed; and after the processing the first surface of the substrate, decreasing the temperature of the substrate.Type: ApplicationFiled: September 24, 2020Publication date: April 1, 2021Inventors: Fumihiro KAMIMURA, Masatoshi KASAHARA, Teruomi MINAMI, Ikuo SUNAKA
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Patent number: 9278768Abstract: A process liquid changing method is provided for changing process liquids in a substrate processing apparatus including storage tank, a circulation line with a circulation pump, and a process liquid supply nozzle connected to the circulation line through a branch line. The method includes: discharging the process liquid in the storage tank; discharging a process liquid remaining in the circulation line from a drain connected to the circulation line at a second position of the circulation line, while supplying a purge gas to the circulation line at a first position of the circulation line, wherein the first position is located upstream of a junction area where the branch line is connected to the circulation line, and the second position is located downstream of the junction area and upstream of the storage tank; and supplying a process liquid into the storage tank.Type: GrantFiled: February 22, 2013Date of Patent: March 8, 2016Assignee: Tokyo Electron LimitedInventors: Masatoshi Kasahara, Shinichiro Shimomura
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Patent number: 5324411Abstract: A disc-shaped electrode plate body is made of high-purity glassy carbon and has a large number of very-small-diameter through holes each of which has a plurality of spherical recesses in its internal wall surface.Type: GrantFiled: September 18, 1992Date of Patent: June 28, 1994Assignee: Toshiba Ceramics Co., Ltd.Inventors: Masahiko Ichishima, Yasumi Sasaki, Eiichi Toya, Masatoshi Kasahara, Ritsurou Makita
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Patent number: 4672398Abstract: Disclosed is an ink droplet expelling apparatus for expelling an ink droplet in response to an electric signal, compising a printing head provided with one or more ink chambers, electro-mechanical transducers disposed on the printing head corresponding to the ink chambers, and a driving signal generating circuit for producing electric signals for driving the electro-mechanical transducers. The elector-mechanical transducers are distorted by three different driving signals to reduce the volumes of the ink chambers to raise the pressure therein to thereby expel an ink droplet out of a nozzle formed at the front end of the head.Type: GrantFiled: October 31, 1985Date of Patent: June 9, 1987Assignees: Hitachi Ltd., Hitachi Koki Co., Ltd.Inventors: Tadashi Kuwabara, Yasumasa Matsuda, Masatoshi Kasahara, Kyoji Mukumoto, Kazuyoshi Tokunaga
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Patent number: 4424520Abstract: An ink jet printing apparatus comprises a nozzle head including, orifices for ejecting ink particles, pressure chambers each having a piezoelectric element for applying a pressure wave to ink in the chamber and each communicating with corresponding one of the orifices and an ink chamber communicating with the pressure chambers, and electrical signal applying device for applying an electrical signal to selected one or ones of the piezoelectric elements to produce the pressure waves. The electrical signal applying device applies a main electrical signal pulse to the selected one or ones of the piezoelectric elements for inducing rises of the pressure waves and applies a sub-electrical signal pulse for suppressing the pulsations of the pressure waves a predetermined time interval after the main electrical signal.Type: GrantFiled: October 15, 1981Date of Patent: January 3, 1984Assignees: Hitachi, Ltd., Hitachi Koki Co., Ltd.Inventors: Yasumasa Matsuda, Syoji Sagae, Masatoshi Kasahara
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Patent number: 4393388Abstract: A liquid droplet projection apparatus is disclosed which comprises a nozzle arranged at a liquid droplet ejection head, a liquid droplet supply tank, and an electro-mechanical transducer section interposed on the head between the nozzle and the tank. The volume of the electro-mechanical converter means changes in volume in response to an electrical signal pulse applied thereto to cause the nozzle to eject liquid droplets in accordance with the electrical signal. When the pattern of the electrical signal applied to the electromechanical transducer section has an interruption period longer than a predetermined width and three or more successive electrical signals following the interruption period, the amplitude and/or width of the second one of the successive electrical signals is enlarged as compared with the amplitude and/or width of the other electrical signals, thus preventing the diameter of the second liquid droplet ejected following the interruption from being reduced.Type: GrantFiled: March 10, 1981Date of Patent: July 12, 1983Assignees: Hitachi Koki Co., Ltd., Hitachi, Ltd.Inventors: Yasumasa Matsuda, Kyoji Mukumoto, Syoji Sagae, Masatoshi Kasahara
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Patent number: 4364070Abstract: A drop jet apparatus has a nozzle head which defines a pressure chamber, a nozzle, and passages. Part of the pressure chamber is defined by a thin diaphragm which is made thick at the central and at a surrounding portion spaced from the central portion. A piezoelectric plate is adhered to the thick portions so as to bridge the thin portion between the projections.Type: GrantFiled: July 6, 1981Date of Patent: December 14, 1982Assignees: Hitachi, Ltd., Hitachi Koki Co., Ltd.Inventors: Yasumasa Matsuda, Syoji Sagae, Masatoshi Kasahara, Hiroyasu Uchida
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Patent number: 4350989Abstract: An ink-jet printing apparatus having a plurality of nozzles for projecting ink droplets which are selectively deposited on a printing medium in accordance with an information signal so as to form a printed pattern, such ink-jet printing apparatus comprising means for causing ink droplets used for printing to project from each nozzle in accordance with an information signal, a common power source for supplying a desired voltage to the ink-drop forming means provided at each nozzle thereby operating them, and switching means connected between the ink-drop forming means and the common power source and controlled by the information signal, the output of the power source being selectively supplied through the switching means to the ink-drop forming means, so that the driving system for driving the ink-drop forming means and the control system therefor can be separately provided, thus enabling a number of nozzles to be effectively controlled by a lowest control voltage.Type: GrantFiled: March 13, 1980Date of Patent: September 21, 1982Assignees: Hitachi, Ltd., Hitachi Koki Co., Ltd.Inventors: Syoji Sagae, Yasumasa Matsuda, Masatoshi Kasahara, Masayoshi Suzuki