Abstract: A knit fabric production method includes a step of producing a knit fabric K1 from an untwisted yarn Y0 while producing the untwisted yarn Y0 by disposing a fiber bundle FB around a linear core member CP formed of a soluble polymer, falsely twisting the fiber bundle FB by using an air flow swirling in a predetermined first direction and simultaneously causing open end fibers OF to adhere to an outer circumferential surface of the falsely twisted fiber bundle FB by using an air flow swirling in a second direction opposite the first direction, and untwisting the falsely twisted fiber bundle FB.

Abstract: In a plasma processing apparatus, an additional viewing window is disposed between an infrared temperature sensor and a view window, and the additional viewing window is cooled to be retained at room temperature (20° C. to 25° C.), to reduce and to stabilize electromagnetic waves emitted from the viewing window. By correcting the value of the electromagnetic waves, the measurement precision of the temperature monitor is increased and it is possible to measure and to control the dielectric window temperature in a stable state.

Abstract: A plasma processing method for efficiently processing a wafer using plasma which includes two processing steps and a bridging step between the two processing steps. The plasma processing method includes: supplying a processing-use gas into a processing chamber during a processing step; supplying a bridging-use gas into the processing chamber during a bridging step; switching the supply of the processing-use gas from a first gas supply unit and the bridging-use gas from a second gas supply unit to the processing chamber in transition between the two processing steps and the bridging step; and regulating a flow rate of the bridging-use gas to be supplied during the bridging step to a flow rate regarded equal to a supply amount of the processing-use gas to be supplied during a succeeding processing step out of the two processing steps.

Abstract: A knit fabric production method includes a step of producing a knit fabric K1 from an untwisted yarn Y0 while producing the untwisted yarn Y0 by disposing a fiber bundle FB around a linear core member CP formed of a soluble polymer, falsely twisting the fiber bundle FB by using an air flow swirling in a predetermined first direction and simultaneously causing open end fibers OF to adhere to an outer circumferential surface of the falsely twisted fiber bundle FB by using an air flow swirling in a second direction opposite the first direction, and untwisting the falsely twisted fiber bundle FB.

Abstract: In a plasma processing apparatus, an additional viewing window is disposed between an infrared temperature sensor and a view window, and the additional viewing window is cooled to be retained at room temperature (20° C. to 25° C.), to reduce and to stabilize electromagnetic waves emitted from the viewing window. By correcting the value of the electromagnetic waves, the measurement precision of the temperature monitor is increased and it is possible to measure and to control the dielectric window temperature in a stable state.

Abstract: There is provided a plasma processing apparatus and a plasma processing method for efficiently processing a wafer using plasma. The plasma processing apparatus includes two processing steps and a bridging step between the two processing steps.

Abstract: Provided is a plasma processing apparatus or method in which a procedure containing processing steps of supplying a predetermined amount of processing gas into a processing chamber disposed in a vacuum vessel through a gas supply unit, and processing a wafer placed on a sample table disposed in the processing chamber by generating plasma in the processing chamber using the processing gas supplied on each different condition. The procedure includes a first transition step of adjusting and supplying the rare gas to make a pressure of the rare gas equal to a condition of the processing gas used in the former processing step, and a second transition step of adjusting and supplying the rare gas after the first transition step such that a pressure and a flow rate of the rare gas come to be equal to a condition of the processing gas used in the later processing step.

Abstract: A plasma processing apparatus includes a sample stage in a processing chamber in a vacuum container having a placement surface on which a wafer to be processed by using the plasma is placed, a discharge pump connected to a discharge port disposed below the sample stage, and an adjuster that adjusts the amount of discharged gas, in which a first process step of supplying a first processing gas from above the placement surface into the processing chamber and supplying a second processing gas from below the placement surface into the processing chamber to process the wafer by using the first processing gas and a second process step where the first processing gas and the second processing gas are reversed are repeatedly switched over therebetween, and the adjuster adjusts a pressure in the processing chamber to a predetermined value during the processing.

Abstract: In a plasma processing apparatus, an additional viewing window is disposed between an infrared temperature sensor and a view window, and the additional viewing window is cooled to be retained at room temperature (20° C. to 25° C.), to reduce and to stabilize electromagnetic waves emitted from the viewing window. By correcting the value of the electromagnetic waves, the measurement precision of the temperature monitor is increased and it is possible to measure and to control the dielectric window temperature in a stable state.

Abstract: In a plasma processing apparatus including a vacuum chamber, a sample table for mounting a member to be processed thereon, the sample table having a coolant path to control a temperature of the member to be processed, an electrostatic chuck power supply for electrostatically adsorbing the member to be processed on the sample table, and a plurality of gas hole parts provided in the sample table to supply heat transfer gas between the member to be processed and the sample table and thereby control a temperature of the member to be processed, each of the gas hole parts includes a boss formed of a dielectric, a sleeve, and a plurality of small tubes, and the small tubes are arranged in a range of 10 to 50% of a radius when measured from a center of the gas hole part toward outside.

Abstract: A plasma etching apparatus in which discharge instability due to insufficient DC grounding is prevented. A grounded circular conductor is provided as a DC grounding means in a vacuum processing chamber and a control means controls a DC bias power supply according to output value of a current monitor so that the current which flows from the circular conductor to the ground is around 0 A, thereby preventing discharge instability which might be caused by increased plasma space potential.