Abstract: Disclosed is an electronic component packaging sheet including a surface conductive layer formed on the surface of at least one side of a substrate sheet. The substrate sheet includes (A) 80,000 to 220,000 Mw of a styrene-conjugated diene block copolymer; (B) 200,000 to 400,000 Mw of a polystyrene resin; and (C) 150,000 to 210,000 Mw of an impact resistant polystyrene resin. The surface conductive layer includes (D) an acrylic copolymer resin; and (E) a polythiophene type polymer, particularly a polythiophene type polymer/anionic polymer ion complex. The electronic component packaging sheet is a transparent conductive sheet having excellent thermoforming properties, good transparency after thermoforming, and sufficient electrostatic diffusion performance to maintain a low surface resistance value. The electronic component packaging sheet is particularly suited for the manufacture of embossed carrier tape.

Abstract: The present invention discloses a laminated sheet for packaging electronic components comprising a front surface layer, a center core layer and a rear surface layer, wherein the front surface layer and the rear surface layer each contains a rubber-modified styrenic copolymer (A) having a graft ratio of grafted rubber of 30 to 50%, a grafted rubber particle diameter of 0.1 to 0.5 ?m and a butadiene content of 5 to 25% by weight, and polyetheresteramide (B), and the center core layer contains a rubber-modified styrenic copolymer (C) having a graft ratio of grafted rubber of 70 to 90%, a grafted rubber particle diameter of 0.4 to 1.0 ?m, and a butadiene content of 5 to 15% by weight, and 5 to 50% by weight of a recycled material of this laminated sheet.

Abstract: An electronic component packaging sheet formed of a styrene resin composition includes: (A) 29-65 mass parts of a styrene-conjugated diene block copolymer; (B) 51-15 mass parts of a polystyrene resin; and (C) 20-9 mass parts of an impact resistant polystyrene resin. Components (A)-(C) each have a weight average molecular weight (Mw) within a specified range.

Abstract: Disclosed is a surface conductive laminated sheet which comprises a base material layer containing an ABS resin as a main component, and a surface layer laminated on the surface of at least one side of the base material layer. In the laminated sheet, the ABS resin in the base material layer includes a composition made of 5-15 mass % of vinyl cyanide monomer, 45-65 mass % of diene-based rubber, and 50-20 mass % of aromatic vinyl monomer, and includes a graft rubber having a graft rate of 50-80%. The graft rubber has a mass average molecular weight (Mw) of a graft chain of 18,000-56,000, and/or has a volume average particle diameter of 0.3 to 2.0 ?m. By using the laminated sheet, it is possible to obtain an electronic part packaging container, such as carrier tape etc., which has extremely few punch burrs regardless of the type of forming apparatus when punched by means of a slit method or embossing.

Abstract: The present invention discloses a laminated sheet for packaging electronic components comprising a front surface layer, a center core layer and a rear surface layer, wherein the front surface layer and the rear surface layer each contains a rubber-modified styrenic copolymer (A) having a graft ratio of grafted rubber of 30 to 50%, a grafted rubber particle diameter of 0.1 to 0.5 ?m and a butadiene content of 5 to 25% by weight, and polyetheresteramide (B), and the center core layer contains a rubber-modified styrenic copolymer (C) having a graft ratio of grafted rubber of 70 to 90%, a grafted rubber particle diameter of 0.4 to 1.0 ?m, and a butadiene content of 5 to 15% by weight, and 5 to 50% by weight of a recycled material of this laminated sheet.

Abstract: Disclosed is an electronic component packaging sheet including a surface conductive layer formed on the surface of at least one side of a substrate sheet. The substrate sheet includes 80,000 to 220,000 Mw of a styrene-conjugated diene block copolymer; 200,000 to 400,000 Mw of a polystyrene resin; and 150,000 to 210,000 Mw of an impact resistant polystyrene resin. The surface conductive layer includes an acrylic copolymer resin; and carbon nanotubes. The electronic component packaging sheet is a transparent conductive sheet having excellent thermoforming properties, good transparency after thermoforming, and sufficient electrostatic diffusion performance to maintain a low surface resistance value. The electronic component packaging sheet is particularly suited for the manufacture of embossed carrier tape.

Abstract: Provided are a styrene resin composition for use in electronic component packaging such as embossed carrier tape, a sheet which has a large drawing ratio (pocket depth) and in which pockets exhibiting superior transparency and strength and can be thermoformed, and a carrier tape which is thermoformed from the sheet and which allows the verification of letters and the like formed on packaged electronic components from outside the pockets. The electronic component packaging sheet includes: (A) 29-65 mass parts of a styrene-conjugated diene block copolymer; (B) 51-15 mass parts of a polystyrene resin; and (C) 20-9 mass parts of an impact resistant polystyrene resin. Components (A)-(C) each have a weight average molecular weight within a specified range.

Abstract: Disclosed is an electronic component packaging sheet including a surface conductive layer formed on the surface of at least one side of a substrate sheet. The substrate sheet includes (A) 80,000 to 220,000 Mw of a styrene-conjugated diene block copolymer; (B) 200,000 to 400,000 Mw of a polystyrene resin; and (C) 150,000 to 210,000 Mw of an impact resistant polystyrene resin. The surface conductive layer includes (D) an acrylic copolymer resin; and (E) a polythiophene type polymer, particularly a polythiophene type polymer/anionic polymer ion complex. The electronic component packaging sheet is a transparent conductive sheet having excellent thermoforming properties, good transparency after thermoforming, and sufficient electrostatic diffusion performance to maintain a low surface resistance value. The electronic component packaging sheet is particularly suited for the manufacture of embossed carrier tape.

Abstract: Disclosed is a surface conductive laminated sheet which comprises a base material layer containing an ABS resin as a main component, and a surface layer laminated on the surface of at least one side of the base material layer. In the laminated sheet, the ABS resin in the base material layer includes a composition made of 5-15 mass % of vinyl cyanide monomer, 45-65 mass % of diene-based rubber, and 50-20 mass % of aromatic vinyl monomer, and includes a graft rubber having a graft rate of 50-80%. The graft rubber has a mass average molecular weight (Mw) of a graft chain of 18,000-56,000, and/or has a volume average particle diameter of 0.3 to 2.0 ?m. By using the laminated sheet, it is possible to obtain an electronic part packaging container, such as carrier tape etc., which has extremely few punch burrs regardless of the type of forming apparatus when punched by means of a slit method or embossing.

Abstract: [Problems] Provided is a novel sheet for packaging electronic parts which is excellent in transparency and suitability for thickness reduction. [Means for solving Problems] The sheet for packaging electronic parts is one obtained by biaxially drawing a styrene resin composition comprising 7 to 99.5 mass % of a polystyrene resin (A), 0.5 to 3 mass % of a high-impact polystyrene resin (B) which has a rubber content of 4 to 10 mass %, and 0 to 92.5 mass % styrene-conjugated diene block copolymer (C) wherein the molecular weight of the styrene block part is at least 10,000 and less than 130,000. This sheet has a thickness of 0.1 to 0.7 mm and an orientation release stress value as measured in conformity with ASTM D-1504 of 0.2 to 0.8 MPa.

Abstract: To provide a cover film with which the temperature range of a sealing iron to obtain peel strength is wide and stability of peel strength is good at the time of peeling, and which is excellent in heat sealing properties to a carrier tape. A cover film comprising a substrate layer and a sealant layer, wherein the substrate layer is made of a biaxially oriented polyester and/or a biaxially oriented polypropylene, the sealant layer contains a hydrogenated resin (a) of a block copolymer of an aromatic vinyl compound and a conjugated diene type hydrocarbon compound, the amount of the aromatic vinyl compound in the resin (a) is at least 20 mass % and at most 45 mass %, and the flowability of the resin (a) is from 1 to 20 g/10 min at a temperature of 230° C. under a load of 2.16 kgf by a measurement method stipulated in JIS K 7210.

Abstract: Production of a hyaluronic acid gel, which comprises keeping hyaluronic acid in water at a hyaluronic acid concentration of at least 5 wt % in the presence of an acid component in an amount at least equimolar with the carboxyl groups in the hyaluronic acid.

Abstract: A gel made of hyaluronic acid alone which is hardly soluble in a neutral aqueous solution and which keeps its shape for at least one day in a neutral aqueous solution at 25° C.

Abstract: A gel made of hyaluronic acid alone which is hardly soluble in a neutral aqueous solution.

Abstract: A gel made of hyaluronic acid alone which is hardly soluble in a neutral aqueous solution and which keeps its shape for at least one day in a neutral aqueous solution at 25° C.

Abstract: A ceramic coating bonded to an iron tubular member comprising a bonding layer formed on a surface of the iron tubular member by a reaction of an iron tubular oxide layer of the iron tubular member and a silicate; and an iron oxide diffusion-preventing layer produced from fine metal oxide particles or an organometallic binder by firing on a surface of the bonding layer. The ceramic coating may further comprises an oxidation-preventing layer, a heat-insulating layer, a refractory layer or a thin dense protective layer. It may be produced by coating the surface of the iron tubular member with a silicate binder to form a layer which is then converted to a bonding layer by a heat treatment in a steam atmosphere; coating the surface of the bonding layer with fine metal oxide particles or an organometallic binder to form an iron oxide diffusion-preventing layer; and after curing and drying firing the resulting ceramic coating in an atmosphere having an oxygen partial pressure of 10 mmHg or less.

Abstract: A ceramic coating bonded to a metal member comprising a bonding layer formed by the reaction of an oxide layer formed on a surface of said metal member in advance and a silicated; and an anti-oxidizing first ceramic layer formed on said bonding layer and comprising inorganic flaky particles burned to have a cross-linked laminate structure.