Abstract: An information processing system includes one or more vehicles, and a server communicable with the one or more vehicles. The vehicle acquires an image obtained by imaging a road on which a host vehicle is located. The vehicle or the server determines a degree of difficulty in traveling on the road due to snow cover from the image. The server stores the degree of difficulty in traveling for each of one or more roads, and provides information to a client by using the stored degree of difficulty in traveling for each of one or more roads.

Abstract: A curable resin composition for an ink jet printer including: (A) a bis-allyl-nadi-imide compound defined by the following general formula (1): wherein R1 represents an alkyl group having 2 to 18 carbon atoms, an aryl group, or an aralkyl group; (B) a bismaleimide compound defined by the following general formula (2): wherein R2 represents an alkyl group having 2 to 32 carbon atoms, an aryl group, or an aralkyl group; and (C) a diluent including a polymerizable monomer (C-2) having an acryloyl group and/or a methacryloyl group; and having a viscosity of 150 mPa·s or lower at 25° C.

Abstract: An adhesive pattern is formed by applying a photocurable and thermosetting adhesive comprising as indispensable ingredients (A) a carboxyl group-containing photosensitive prepolymer having both a carboxyl group and an ethylenically unsaturated bond in its molecule and an acid value in the range of 30 to 160 mg KOH/g, (B) an epoxy resin, and (C) a photopolymerization initiator onto a surface of a substrate as a member to be bonded to form a coating film; selectively exposing the coating film to an active energy ray through a photomask according to a predetermined pattern, thereafter removing an unexposed portion by development with an aqueous alkaline solution. Then, a sheet member as a joining member is pressed onto the adhesive pattern mentioned above, and the adhesive pattern is thermally cured to obtain a laminated structure.

Abstract: A photocurable and thermosetting composition for an ink jet system comprises (A) a monomer having a (meth)acryloyl group and a thermosetting functional group in its molecule, (B) a photoreactive diluent having a weight-average molecular weight of not more than 700 other than the component (A) mentioned above, and (C) a photopolymerization initiator and has a viscosity of not more than 150 mPa·s at 25° C. A solder resist pattern is directly drawn on a printed circuit board by means of an ink jet printer using the above-mentioned composition, and the pattern is primarily cured by irradiation with an active energy ray and then further cured by heating.

Abstract: An adhesive pattern (4) is formed by applying a photocurable and thermosetting adhesive comprising as indispensable ingredients (A) a carboxyl group-containing photosensitive prepolymer having both a carboxyl group and an ethylenically unsaturated bond in its molecule and an acid value in the range of 30 to 160 mg KOH/g, (B) an epoxy resin, and (C) a photopolymerization initiator onto a surface of a substrate (1) as a member to be bonded to form a coating film; selectively exposing the coating film to an active energy ray through a photomask (3) according to a predetermined pattern, thereafter removing an unexposed portion by development with an aqueous alkaline solution. Then, a sheet member (5) as a joining member is pressed onto the adhesive pattern mentioned above, and the adhesive pattern is thermally cured to obtain a laminated structure.

Abstract: A curable resin composition for an ink jet printer containing: (A) a bis-allyl-nadi-imide compound defined by the following general formula (1): wherein R1 represents an alkyl group having 2 to 18 carbon atoms, an aryl group, or an aralkyl group; (B) a bismaleimide compound defined by the following general formula (2): wherein R2 represents an alkyl group having 2 to 32 carbon atoms, an aryl group, or an aralkyl group, and (C) a diluent, and having a viscosity of 150 mPa·s or lower at 25° C.

Abstract: An unsaturated monocarboxylic ester compound has at least two structures represented by the following general formula (1): wherein R1 represents a hydrogen atom or an alkyl group of 1 to 6 carbon atoms, and R2, R3 and R4 independently represent a hydrogen atom, an alkyl group of 1 to 6 carbon atoms, an aryl group, an aralkyl group, a cyano group, a fluorine atom, or a furyl group. A curable composition comprises (A) the unsaturated monocarboxylic ester compound having two or more structures represented by the general formula (1) mentioned above, (B) a polymerization initiator, and optionally (C) a diluent.

Abstract: A photocurable and thermosetting resin composition comprising (A) a photosensitive prepolymer having a carboxyl group in combination with at least two ethylenically unsaturated double bonds in its molecule, (B) a polymerization initiator, (C) a diluent, (D) an oxetane compound having at least two oxetanyl groups in its molecule, and (E) a curing promotor is developable with an alkaline solution and can be formulated as a one package preparation. Such a photocurable and thermosetting resin composition and a photosensitive dry film prepared by the use thereof are useful as various resist materials and electrical insulating materials, particularly as solder resists for printed circuit boards, interlaminar insulating materials for build-up multi-layer printed circuit boards, and the like.

Abstract: A photocurable and thermosetting resin composition comprises (A) an actinic energy ray-curable resin having at least one structure represented by the following general formula (1), (B) a-polymerization initiator, (C) a diluent, and (D) a polyfunctional oxetane compound. The actinic energy ray-curable resin mentioned above can be produced by causing the reaction of (a) a polyfunctional oxetane compound with (b) an unsaturated monocarboxylic acid and the subsequent reaction of (c) a polybasic acid anhydride with a primary hydroxyl group of the resultant modified oxetane resin (a?). wherein R1 represents a hydrogen atom or an alkyl group of 1 to 6 carbon atoms, R2, R3 and R4 independently represent a hydrogen atom, an alkyl group of 1 to 6 carbon atoms, an aryl group, an aralkyl group, a cyano group, a fluorine atom, or a furyl group, and X represents a polybasic acid anhydride residue.

Abstract: A printed circuit board that includes a solder resist has a photocurable and thermosetting resin composition which comprises (A) an actinic energy ray-curable resin having at least one structure represented by the following general formula (1), (B) a polymerization initiator, (C) a diluent, and (D) a polyfunctional oxetane compound. The actinic energy ray-curable resin mentioned above can be produced by causing the reaction of (a) a polyfunctional oxetane compound with (b) an unsaturated monocarboxylic acid and the subsequent reaction of (c) a polybasic acid anhydride with a primary hydroxyl group of the resultant modified oxetane resin (a?). wherein R1 represents a hydrogen atom or an alkyl group of 1 to 6 carbon atoms, R2, R3 and R4 independently represent a hydrogen atom, an alkyl group of 1 to 6 carbon atoms, an aryl group, an aralkyl group, a cyano group, a fluorine atom, or a furyl group, and X represents a polybasic acid anhydride residue.

Abstract: An unsaturated monocarboxylic ester compound has at least two structures represented by the following general formula (1): wherein R1 represents a hydrogen atom or an alkyl group of 1 to 6 carbon atoms, and R2, R3 and R4 independently represent a hydrogen atom, an alkyl group of 1 to 6 carbon atoms, an aryl group, an aralkyl group, a cyano group, a fluorine atom, or a furyl group. A curable composition comprises (A) the unsaturated carboxylic ester compound having two or more structures represented by the general formula (1) mentioned above, (B) a polymerization initiator, and optionally (C) a diluent.

Abstract: A photocurable and thermosetting composition for an ink jet system comprises (A) a monomer having a (meth)acryloyl group and a thermosetting functional group in its molecule, (B) a photoreactive diluent having a weight-average molecular weight of not more than 700 other than the component (A) mentioned above, and (C) a photopolymerization initiator and has a viscosity of not more than 150 mPa.s at 25° C. A solder resist pattern is directly drawn on a printed circuit board by means of an ink jet printer using the above-mentioned composition, and the pattern is primarily cured by irradiation with an active energy ray and then further cured by heating.

Abstract: An unsaturated monocarboxylic ester compound has at least two structures represented by the following general formula (1): wherein R1 represents a hydrogen atom or an alkyl group of 1 to 6 carbon atoms, and R2, R3 and R4 independently represent a hydrogen atom, an alkyl group of 1 to 6 carbon atoms, an aryl group, an aralkyl group, a cyano group, a fluorine atom, or a furyl group. A curable composition comprises (A) the unsaturated monocarboxylic ester compound having two or more structures represented by the general formula (1) mentioned above, (B) a polymerization initiator, and optionally (C) a diluent.

Abstract: An unsaturated polyester compound having an ethylenically unsatureated group in its terminal and hydroxymethyl group in its side chain is obtained by the reaction of (a) a compound containing at least two oxetane rings in its molecule with (b) a compound containing at least two carboxyl groups in its molecule and (c) an unsaturated monocarboxylic acid in the presence of a reaction promotor in such a proportion that the ratio of said compound (b) to said compound (a) falls in the range of 0.1<(b)/(a)<1. BY further reacting (d) a polybasic acid anhydride with the resultant unsaturated polyester compound (A?), there is obtained an actinic energy ray-curable resin which is soluble in an aqueous alkaline solution. A photocurable and/or thermosetting composition is obtained by mixing the unsaturated polyester compound (A?) and/or the actinic energy ray-curable resin with a polymerization initiator (B).

Abstract: A photocurable and thermosetting resin composition comprising (A) a photosensitive prepolymer having a carboxyl group in combination with at least two ethylenically unsaturated double bonds in its molecule, (B) a polymerization initiator, (C) a diluent, (D) an oxetane compound having at least two oxetanyl groups in its molecule, and (E) a curing promotor is developable with an alkaline solution and can be formulated as a one package preparation. Such a photocurable and thermosetting resin composition and a photosensitive dry film prepared by the use thereof are useful as various resist materials and electrical insulating materials, particularly as solder resists for printed circuit boards, interlaminar insulating materials for build-up multi-layer printed circuit boards, and the like.

Abstract: The photocurable and thermosetting resin composition of the present invention includes (A) an actinic energy ray-curable resin having at least one structure represented by the following general formula (1), (B) a photopolymerization initiator, (C) a diluent, and (D) a thermosetting component. In the general formula (1), R1 represents a hydrogen atom or an alkyl group of 1 to 6 carbon atoms, R2, R3 and R4 independently represent a hydrogen atom, an alkyl group of 1 to 6 carbon atoms, an aryl group, an aralkyl group, a cyano group, a fluorine atom, or a furyl group, and X represents a polybasic acid anhydride residue.

Abstract: A photocurable and thermosetting resin composition comprises (A) an actinic energy ray-curable resin having at least one structure represented by the following general formula (1), (B) a polymerization initiator, (C) a diluent, and (D) a polyfunctional oxetane compound. The actinic energy ray-curable resin mentioned above can be produced by causing the reaction of (a) a polyfunctional oxetane compound with (b) an unsaturated monocarboxylic acid and the subsequent reaction of (c) a polybasic acid anhydride with a primary hydroxyl group of the resultant modified oxetane resin (a?). wherein R1 represents a hydrogen atom or an alkyl group of 1 to 6 carbon atoms, R2, R3 and R4 independently represent a hydrogen atom, an alkyl group of 1 to 6 carbon atoms, an aryl group, an aralkyl group, a cyano group, a fluorine atom, or a furyl group, and X represents a polybasic acid anhydride residue.

Abstract: A photocurable and thermosetting resin composition comprising (A) a photosensitive prepolymer having a carboxyl group in combination with at least two ethylenically unsaturated double bonds in its molecule, (B) a polymerization initiator, (C) a diluent, (D) an oxetane compound having at least two oxetanyl groups in its molecule, and (E) a curing promotor is developable with an alkaline solution and can be formulated as a one package preparation. Such a photocurable and thermosetting resin composition and a photosensitive dry film prepared by the use thereof are useful as various resist materials and electrical insulating materials, particularly as solder resists for printed circuit boards, interlaminar insulating materials for build-up multi-layer printed circuit boards, and the like.

Abstract: An unsaturated polyester compound having an ethylenically unsatureated group in its terminal and hydroxymethyl group in its side chain is obtained by the reaction of (a) a compound containing at least two oxetane rings in its molecule with (b) a compound containing at least two carboxyl groups in its molecule and (c) an unsaturated monocarboxylic acid in the presence of a reaction promotor in such a proportion that the ratio of said compound (b) to said compound (a) falls in the range of 0.1<(b)/(a)<1. BY further reacting (d) a polybasic acid anhydride with the resultant unsaturated polyester compound (A′), there is obtained an actinic energy ray-curable resin which is soluble in an aqueous alkaline solution. A photocurable and/or thermosetting composition is obtained by mixing the unsaturated polyester compound (A′) and/or the actinic energy ray-curable resin with a polymerization initiator (B).

Abstract: A photocurable and thermosetting resin composition comprising (A) a photosensitive prepolymer having a carboxyl group in combination with at least two ethylenically unsaturated double bonds in its molecule, (B) a polymerization initiator, (C) a diluent, (D) an oxetane compound having at least two oxetanyl groups in its molecule, and (E) a curing promotor is developable with an alkaline solution and can be formulated as a one package preparation. Such a photocurable and thermosetting resin composition and a photosensitive dry film prepared by the use thereof are useful as various resist materials and electrical insulating materials, particularly as solder resists for printed circuit boards, interlaminar insulating materials for build-up multi-layer printed circuit boards, and the like.