Patents by Inventor Masatoshi Nakasone

Masatoshi Nakasone has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wire harness manufacturing method
    Patent number: 5918365
    Abstract: A wire harness consists of electrical wires, a first resin sheet and a second resin sheet. The first resin sheet includes a recess formed so as to extend along a predetermined "three-dimensional" wiring route of the electrical wires. In order to manufacture the wire harness, at first, the recess is formed in the first resin sheet. Then, the electrical wires are arranged in the recess. Next, the second resin sheet is arranged on the first resin sheet so as to cover the recess and air contained in a space defined between the first resin sheet and the second resin sheet is sucked to the outside. Finally, the first resin sheet and the second resin sheet are joined to each other. Owing to the provision of the three-dimensional recess, it is possible to realize the wire harness having a three-dimensional configuration following to the actual wiring route of the electrical wires, so that the assembling property can be improved.
    Type: Grant
    Filed: November 19, 1997
    Date of Patent: July 6, 1999
    Assignee: Yazaki Corporation
    Inventors: Kiyoshi Uchida, Makoto Nakayama, Masatoshi Nakasone, Hiroshi Suzuki, Takayuki Kato, Toshio Inada
  • Wire harness and method of manufacturing same
    Patent number: 5895889
    Abstract: A wire harness having of electrical wires, a first resin sheet and a second resin sheet. The first resin sheet includes a recess formed so as to extend along a predetermined "three-dimensional" wiring route of the electrical wires. In order to manufacture the wire harness, at first, the recess is formed in the first resin sheet. Then, the electrical wires are arranged in the recess. Next, the second resin sheet is arranged on the first resin sheet so as to cover the recess and air contained in a space defined between the first resin sheet and the second resin sheet is sucked to the outside. Finally, the first resin sheet and the second resin sheet are joined to each other. Owing to the provision of the three-dimensional recess, it is possible to realize the wire harness having a three-dimensional configuration which follows the path actual wiring route of the electrical wires, so that the ease of assembly can be improved.
    Type: Grant
    Filed: July 10, 1996
    Date of Patent: April 20, 1999
    Assignee: Yazaki Corporation
    Inventors: Kiyoshi Uchida, Makoto Nakayama, Masatoshi Nakasone, Hiroshi Suzuki, Takayuki Kato, Toshio Inada