Patents by Inventor Masatoshi Ohara

Masatoshi Ohara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220242031
    Abstract: A signal acquisition unit of an abnormality detection device for a twin-screw extrusion molding machine, when the twin-screw extrusion molding machine that melts and kneads a fed resin raw material is in operation, acquires an AE output of an AE sensor installed on a surface of a housing of the twin-screw extrusion molding machine. A determination unit determines whether an abnormality occurs in the twin-screw extrusion molding machine, based on a relationship between the AE output and a first threshold and a second threshold.
    Type: Application
    Filed: May 25, 2020
    Publication date: August 4, 2022
    Applicants: Shibaura Machine Co., Ltd., NATIONAL UNIVERSITY CORPORATION KANAZAWA UNIVERSITY
    Inventors: Masatoshi OHARA, Kentaro TAKI, Tsukasa KIDA
  • Patent number: 10532492
    Abstract: One embodiment provides a twin-screw extruder which is used to knead materials and has excellent productivity. The twin-screw extruder includes screws. The screws include double thread screws in which first screw portions engage with each other. Ratio D1/C of external diameter D1 of the first screw portion to a shaft distance C ranges from 1.25 to 1.40. The screws further include triple thread screws in which third screw portions engage with each other. Ratio D3/C of external diameter D3 of the third screw portion to the shaft distance C ranges from 1.05 to 1.10. External diameter D2 of a second screw portion decreases gradually from the first screw portion toward the third screw portion.
    Type: Grant
    Filed: November 13, 2015
    Date of Patent: January 14, 2020
    Assignee: TOSHIBA KIKAI KABUSHIKI KAISHA
    Inventors: Akiyoshi Kobayashi, Toshiki Nakazawa, Masatoshi Ohara, Hiroyuki Saito
  • Patent number: 10434697
    Abstract: A barrel main body, a sleeve, and a fixing mechanism (a fastening hole and a fastening device) are provided. The barrel main body includes a barrel hole having a cylindrical shape and a slit dividing an inner circumferential surface of the barrel hole. The sleeve having a hollow cylindrical shape is removably incorporated into the barrel hole. The slit includes two cutout surfaces facing each other with a space between. The fixing mechanism brings the inner circumferential surface of the barrel hole into close contact with the sleeve without any gap by narrowing the space between the cutout surfaces and deforming the barrel main body.
    Type: Grant
    Filed: November 21, 2017
    Date of Patent: October 8, 2019
    Assignee: Toshiba Kikai Kabushiki Kaisha
    Inventors: Shozo Suzuki, Masatoshi Ohara, Yasuhiro Maekawa
  • Publication number: 20180093407
    Abstract: A barrel main body, a sleeve, and a fixing mechanism (a fastening hole and a fastening device) are provided. The barrel main body includes a barrel hole having a cylindrical shape and a slit dividing an inner circumferential surface of the barrel hole. The sleeve having a hollow cylindrical shape is removably incorporated into the barrel hole. The slit includes two cutout surfaces facing each other with a space between. The fixing mechanism brings the inner circumferential surface of the barrel hole into close contact with the sleeve without any gap by narrowing the space between the cutout surfaces and deforming the barrel main body.
    Type: Application
    Filed: November 21, 2017
    Publication date: April 5, 2018
    Applicant: Toshiba Kikai Kabushiki Kaisha
    Inventors: Shozo Suzuki, Masatoshi Ohara, Yasuhiro Maekawa
  • Publication number: 20160207225
    Abstract: One embodiment provides a twin-screw extruder which is used to knead materials and has excellent productivity. The twin-screw extruder includes screws. The screws include double thread screws in which first screw portions engage with each other. Ratio D1/C of external diameter D1 of the first screw portion to a shaft distance C ranges from 1.25 to 1.40. The screws further include triple thread screws in which third screw portions engage with each other. Ratio D3/C of external diameter D3 of the third screw portion to the shaft distance C ranges from 1.05 to 1.10. External diameter D2 of a second screw portion decreases gradually from the first screw portion toward the third screw portion.
    Type: Application
    Filed: November 13, 2015
    Publication date: July 21, 2016
    Inventors: Akiyoshi KOBAYASHI, Toshiki NAKAZAWA, Masatoshi OHARA, Hiroyuki SAITO
  • Patent number: 6011303
    Abstract: An electronic component includes a substrate portion, a bank portion, a plurality of lead members, an anchor hole, and at least a pair of notches. A chip is supported on the substrate portion. The bank portion is formed on a periphery of the substrate portion to surround the chip. The plurality of lead members are made of conductive strip pieces, and each lead member has an inner lead electrically connected to the chip and an outer lead extending to an outside. The substrate portion and the bank portion are integrally molded with a resin to include the lead members, so that the inner and outer leads are fixed to a connecting portion between the substrate portion and the bank portion. The anchor hole is formed in a portion where each of the lead members is in contact with the bank portion, and is filled with a resin. The pair of notches are formed in two ends of each of the lead members to sandwich the anchor hole.
    Type: Grant
    Filed: November 26, 1997
    Date of Patent: January 4, 2000
    Assignee: NEC Corporation
    Inventors: Junichi Tanaka, Seiji Ichikawa, Tomoaki Hirokawa, Tomoaki Kimura, Taku Sato, Kenji Watanabe, Kenji Utida, Masatoshi Ohara, Takeo Ogihara, Satoshi Murata, Tsutomu Kubota
  • Patent number: 5970322
    Abstract: An ultrahigh-frequency electronic component has an ultrahigh-frequency chip encased in a molded-resin package. The ultrahigh-frequency electronic component includes a first sealing layer encasing the ultrahigh-frequency chip therein and a second sealing layer encasing the first sealing layer therein. The first sealing layer contains a number of voids or minute air bubbles therein which are effective in reducing the permittivity of the first sealing layer. A method of manufacturing the ultrahigh-frequency electronic component is also disclosed.
    Type: Grant
    Filed: January 8, 1998
    Date of Patent: October 19, 1999
    Assignee: NEC Corporation
    Inventors: Seiji Ichikawa, Tomoaki Hirokawa, Tomoaki Kimura, Taku Sato, Junichi Tanaka, Kenji Uchida, Masatoshi Ohara, Takeo Ogihara, Satoshi Murata, Tsutomu Kubota
  • Patent number: 5904501
    Abstract: A hollow package manufacturing method includes the adhesive spreading step, the adhesive applying step, and the cap adhering step. In the adhesive spreading step, an adhesive is spread on a circular table to a uniform thickness. In the adhesive applying step, an open end face of a cylindrical cap having a bottom is urged against the circular table to apply the adhesive to the cap. In the cap adhering step, the cap applied with the adhesive is adhered to a case. A hollow package manufacturing apparatus is also disclosed.
    Type: Grant
    Filed: March 26, 1997
    Date of Patent: May 18, 1999
    Assignee: NEC Corporation
    Inventors: Masatoshi Ohara, Takeo Ogihara, Satoshi Murata, Kenji Uchida, Tsutomu Kubota, Seiji Ichikawa, Tomoaki Hirokawa, Tomoaki Kimura, Taku Sato, Junichi Tanaka
  • Patent number: 5889232
    Abstract: An ultrahigh-frequency electronic component has an ultrahigh-frequency chip encased in a molded-resin package. The ultrahigh-frequency electronic component includes a first sealing layer encasing the ultrahigh-frequency chip therein and a second sealing layer encasing the first sealing layer therein. The first sealing layer contains a number of voids or minute air bubbles therein which are effective in reducing the permittivity of the first sealing layer. A method of manufacturing the ultrahigh-frequency electronic component is also disclosed.
    Type: Grant
    Filed: May 13, 1997
    Date of Patent: March 30, 1999
    Assignee: NEC Corporation
    Inventors: Seiji Ichikawa, Tomoaki Hirokawa, Tomoaki Kimura, Taku Sato, Junichi Tanaka, Kenji Uchida, Masatoshi Ohara, Takeo Ogihara, Satoshi Murata, Tsutomu Kubota