Abstract: A kneading state detection device includes an acquisition unit that, when an extrusion molding machine that kneads a raw material or kneads a raw material and an additive is in operation, acquires an output of an AE sensor installed on a housing of the extrusion molding machine, and a determination unit that determines a kneading state of the raw material, based on a comparison between a change in intensity of the output of the AE sensor acquired by the acquisition unit and a threshold.

Abstract: A signal acquisition unit of an abnormality detection device for a twin-screw extrusion molding machine, when the twin-screw extrusion molding machine that melts and kneads a fed resin raw material is in operation, acquires an AE output of an AE sensor installed on a surface of a housing of the twin-screw extrusion molding machine. A determination unit determines whether an abnormality occurs in the twin-screw extrusion molding machine, based on a relationship between the AE output and a first threshold and a second threshold.

Abstract: One embodiment provides a twin-screw extruder which is used to knead materials and has excellent productivity. The twin-screw extruder includes screws. The screws include double thread screws in which first screw portions engage with each other. Ratio D1/C of external diameter D1 of the first screw portion to a shaft distance C ranges from 1.25 to 1.40. The screws further include triple thread screws in which third screw portions engage with each other. Ratio D3/C of external diameter D3 of the third screw portion to the shaft distance C ranges from 1.05 to 1.10. External diameter D2 of a second screw portion decreases gradually from the first screw portion toward the third screw portion.

Abstract: A barrel main body, a sleeve, and a fixing mechanism (a fastening hole and a fastening device) are provided. The barrel main body includes a barrel hole having a cylindrical shape and a slit dividing an inner circumferential surface of the barrel hole. The sleeve having a hollow cylindrical shape is removably incorporated into the barrel hole. The slit includes two cutout surfaces facing each other with a space between. The fixing mechanism brings the inner circumferential surface of the barrel hole into close contact with the sleeve without any gap by narrowing the space between the cutout surfaces and deforming the barrel main body.

Abstract: A barrel main body, a sleeve, and a fixing mechanism (a fastening hole and a fastening device) are provided. The barrel main body includes a barrel hole having a cylindrical shape and a slit dividing an inner circumferential surface of the barrel hole. The sleeve having a hollow cylindrical shape is removably incorporated into the barrel hole. The slit includes two cutout surfaces facing each other with a space between. The fixing mechanism brings the inner circumferential surface of the barrel hole into close contact with the sleeve without any gap by narrowing the space between the cutout surfaces and deforming the barrel main body.

Abstract: One embodiment provides a twin-screw extruder which is used to knead materials and has excellent productivity. The twin-screw extruder includes screws. The screws include double thread screws in which first screw portions engage with each other. Ratio D1/C of external diameter D1 of the first screw portion to a shaft distance C ranges from 1.25 to 1.40. The screws further include triple thread screws in which third screw portions engage with each other. Ratio D3/C of external diameter D3 of the third screw portion to the shaft distance C ranges from 1.05 to 1.10. External diameter D2 of a second screw portion decreases gradually from the first screw portion toward the third screw portion.

Abstract: An electronic component includes a substrate portion, a bank portion, a plurality of lead members, an anchor hole, and at least a pair of notches. A chip is supported on the substrate portion. The bank portion is formed on a periphery of the substrate portion to surround the chip. The plurality of lead members are made of conductive strip pieces, and each lead member has an inner lead electrically connected to the chip and an outer lead extending to an outside. The substrate portion and the bank portion are integrally molded with a resin to include the lead members, so that the inner and outer leads are fixed to a connecting portion between the substrate portion and the bank portion. The anchor hole is formed in a portion where each of the lead members is in contact with the bank portion, and is filled with a resin. The pair of notches are formed in two ends of each of the lead members to sandwich the anchor hole.

Abstract: An ultrahigh-frequency electronic component has an ultrahigh-frequency chip encased in a molded-resin package. The ultrahigh-frequency electronic component includes a first sealing layer encasing the ultrahigh-frequency chip therein and a second sealing layer encasing the first sealing layer therein. The first sealing layer contains a number of voids or minute air bubbles therein which are effective in reducing the permittivity of the first sealing layer. A method of manufacturing the ultrahigh-frequency electronic component is also disclosed.

Abstract: A hollow package manufacturing method includes the adhesive spreading step, the adhesive applying step, and the cap adhering step. In the adhesive spreading step, an adhesive is spread on a circular table to a uniform thickness. In the adhesive applying step, an open end face of a cylindrical cap having a bottom is urged against the circular table to apply the adhesive to the cap. In the cap adhering step, the cap applied with the adhesive is adhered to a case. A hollow package manufacturing apparatus is also disclosed.

Abstract: An ultrahigh-frequency electronic component has an ultrahigh-frequency chip encased in a molded-resin package. The ultrahigh-frequency electronic component includes a first sealing layer encasing the ultrahigh-frequency chip therein and a second sealing layer encasing the first sealing layer therein. The first sealing layer contains a number of voids or minute air bubbles therein which are effective in reducing the permittivity of the first sealing layer. A method of manufacturing the ultrahigh-frequency electronic component is also disclosed.