Abstract: A direct conversion receiver comprises a down converter for frequency-converting an analog RF signal modulated by an OFDM method such that the center frequency of the occupied band of a receiving object segment is a frequency of zero; AD conversion means for converting a down converted signal obtained by the down converter into a digital signal; FFT means for subjecting the signal obtained by the AD conversion means to fast Fourier transform, to transform the signal from time axis data to frequency axis data; and unnecessary component removal means for removing from an output signal of the FFT means an unnecessary component other than the receiving object segment.

Abstract: This invention relates to an aromatic ester (meth)acrylate dendrimer composed of the core formed by an aromatic polycarboxylic acid and the branches formed by an aromatic compound containing one hydroxyl group and two carboxyl groups and represented by the following general formula (1) and also to a curable resin composition which contains the dendrimer and a polymerization initiator as essential components, is low in viscosity and highly curable, and forms a coating film with excellent heat and moisture resistance.

Abstract: A digital broadcast receiver for realizing functions approximately corresponding to those of a VCR by utilizing a time shifting service broadcasting the same program on a plurality of channels which are time-shifted from one another in broadcasting the program by varying periods of delay time. For example in resuming viewing after an interruption of viewing on the desired one of the channels to realize the function of pause, the channel is determined the delay time of which relative to the channel initially viewed is greater than and most approximate to the interruption period, and the initial channel is automatically changed over to the channel thus determined.

Abstract: The present invention provides a novel silicate group-containing polyimide which is excellent in mechanical properties, heat resistance and electrical properties and has an excellent film forming ability. Further, the present invention provides a film-formable heat resistant material having an excellent solvent resistance, elasticity and adhesive property. The silicate group-containing polyimide has a repeated unit represented by the following Formula (1): ##STR1## wherein Ar.sub.1 represents a tetravalent organic group; R.sub.1 and R.sub.2 each are a single bond or represent an alkylene group having 1 to 4 carbon atoms or a phenylene group; R.sub.3 to R.sub.7, R.sub.9 and R.sub.10 each represent a hydrocarbon group having 1 to 6 carbon atoms; R.sub.8 represents an ethylene group or an alkylene group having 3 to 6 carbon atoms; m and n represent independently an integer of 1 to 10; and k represents an integer of 0 to 2.

Abstract: This invention relates to heat-resistant film adhesives for use in fabrication of printed circuit boards formulated from polyimides with silicone units and epoxy resins and, if necessary, epoxy resin curing agents. It is possible to introduce functional groups reactive with epoxy resins into the polyimide structure. The films are used by inserting them between adherends and pressing at 1 to 1,000 kg/cm.sup.2 and 20.degree. to 250.degree. C. and they show excellent heat resistance, heat resistance at soldering temperature after moisture absorption and processibility when contact-bonded at 250.degree. C. or less.