Abstract: A composite substrate includes a base layer formed of a composite material containing diamond and a metal, the base layer a first surface, and a second surface opposite to the first surface; a flat layer having a lower surface bonded to the first surface of the base layer, and an upper surface having a surface roughness Ra of 10 nm or less; and an insulating layer directly bonded to the upper surface of the flat layer.

Abstract: A display device includes a substrate including a first surface, and a second surface positioned at a side opposite to the first surface; a first light-emitting element located at a lateral side of the substrate; a plurality of light-receiving elements located at a second surface side of the substrate; a plurality of second light-emitting elements located on the first surface of the substrate; and a first drive element controlling driving of the second light-emitting elements based on output of the light-receiving elements. A light-emitting surface of the first light-emitting element is oriented in a first direction. The first direction is parallel to a direction from the first surface toward the second surface. Light-emitting surfaces of the second light-emitting elements are oriented in a second direction. The second direction is from the second surface toward the first surface.

Abstract: A method of producing a heat dissipation substrate, the method including: providing a composite material containing diamond and a metal; performing a treatment on a surface of the composite material to reduce a thickness of the composite material, the treatment forming a processed surface of the composite material; and subsequently, performing pulsed electric current sintering with a pressure of less than 50 MPa applied to the composite material, to heat the composite material.

Abstract: A method for manufacturing a light emitting device includes: roughening a light extracting surface of a semiconductor light emitting element, forming a first light transmissive layer on an entirety of the roughened light extracting surface, flattening a surface of a first light transmissive layer that is on a side opposite the semiconductor light emitting element, forming a second light transmissive layer on an entirety of a surface of an optical member, flattening a surface of the second light transmissive layer that is on a side opposite the optical member, and directly bonding the flattened surface of the first light transmissive layer and the flattened surface of second transmissive layer by performing surface-activated bonding, atomic diffusion bonding, or hydroxyl bonding.

Abstract: A method for manufacturing a light emitting device comprising an optical member provided on a light extracting surface side of a semiconductor light emitting element via a first light transmissive layer, the method comprising the steps of: (i) roughening said extracting surface of said semiconductor light emitting element, (ii) forming said first light transmissive layer on an entirety of said roughened light extracting surface, (iii) flattening an upper surface of said first light transmissive layer, and (iv) directly bonding said flattened upper surface of said first light transmissive layer and a surface of said optical member by performing surface-activated bonding, atomic diffusion bonding, or hydroxyl bonding.

Abstract: A display device includes a substrate including a first surface, and a second surface positioned at a side opposite to the first surface; a first light-emitting element located at a lateral side of the substrate; a plurality of light-receiving elements located at a second surface side of the substrate; a plurality of second light-emitting elements located on the first surface of the substrate; and a first drive element controlling driving of the second light-emitting elements based on output of the light-receiving elements. A light-emitting surface of the first light-emitting element is oriented in a first direction. The first direction is parallel to a direction from the first surface toward the second surface. Light-emitting surfaces of the second light-emitting elements are oriented in a second direction. The second direction is from the second surface toward the first surface.

Abstract: A composite substrate includes a base layer formed of a composite material containing diamond and a metal, the base layer a first surface, and a second surface opposite to the first surface; a flat layer having a lower surface bonded to the first surface of the base layer, and an upper surface having a surface roughness Ra of 10 nm or less; and an insulating layer directly bonded to the upper surface of the flat layer.

Abstract: A method of producing a heat dissipation substrate, the method including: providing a composite material containing diamond and a metal; performing a treatment on a surface of the composite material to reduce a thickness of the composite material, the treatment forming a processed surface of the composite material; and subsequently, performing pulsed electric current sintering with a pressure of less than 50 MP applied to the composite material, to heat the composite material.

Abstract: A light emitting device can further improve light extraction efficiency. A method of manufacturing such a light emitting device can also prove advantageous. The light emitting device includes a light emitting element, a light-transmissive member which is disposed on a light extracting surface side of the light emitting element, and a reflecting layer disposed on an element bonding surface of the light transmissive member where the light emitting element is disposed and adjacent to the light emitting element. The light-transmissive member, in a plan view, has a planar dimension greater than the light extracting surface of the light emitting element.

Abstract: A light emitting device can further improve light extraction efficiency. A method of manufacturing such a light emitting device can also prove advantageous. The light emitting device includes a light emitting element, a light-transmissive member which is disposed on a light extracting surface side of the light emitting element, and a reflecting layer disposed on an element bonding surface of the light transmissive member where the light emitting element is disposed and adjacent to the light emitting element. The light-transmissive member, in a plan view, has a planar dimension greater than the light extracting surface of the light emitting element.

Abstract: Provided is a semiconductor light emitting device 1 includes a semiconductor stacked layer 2 having a light extraction surface 3a perpendicular to a stacked surface of the semiconductor stacked layer 2, a light transmissive light guide member 3 disposed on the semiconductor stacked layer 2, a light reflective member 4 disposed on the light guide member 3, and a light reflective package 5 which has an open portion corresponding to the light extraction surface 3a and surrounds peripheral surfaces of the semiconductor stacked layer 2.

Abstract: A method for manufacturing a light emitting device comprising an optical member provided on a light extracting surface side of a semiconductor light emitting element via a first light transmissive layer, the method comprising the steps of: (i) roughening said extracting surface of said semiconductor light emitting element, (ii) forming said first light transmissive layer on an entirety of said roughened light extracting surface, (iii) flattening an upper surface of said first light transmissive layer, and (iv) directly bonding said flattened upper surface of said first light transmissive layer and a surface of said optical member by performing surface-activated bonding, atomic diffusion bonding, or hydroxyl bonding.

Abstract: A light emitting device can further improve light extraction efficiency. A method of manufacturing such a light emitting device can also prove advantageous. The light emitting device includes a light emitting element, a light-transmissive member which is disposed on a light extracting surface side of the light emitting element, and a reflecting layer disposed on an element bonding surface of the light transmissive member where the light emitting element is disposed and adjacent to the light emitting element. The light-transmissive member, in a plan view, has a planar dimension greater than the light extracting surface of the light emitting element.

Abstract: Provided is a light emitting device capable of reducing light attenuation within the element and having high light extraction efficiency, and a method of manufacturing the light emitting device. The light emitting device has a light emitting element having a light transmissive member and semiconductor stacked layer portion, electrodes disposed on the semiconductor stacked layer portion in this order. The light emitting element has a first region and a second region from the light transmissive member side. The light transmissive member has a third region and a fourth region from the light emitting element side. The first region has an irregular atomic arrangement compared with the second region. The third region has an irregular atomic arrangement compared with the fourth region. The first region and the third region are directly bonded.

Abstract: An optical component for optical semiconductor includes a wavelength converting member including a fluorescent part having an upper surface, a lower surface, and one or more lateral surfaces, and containing a fluorescent material, and a light-reflecting part disposed adjacently surrounding the one or more lateral surfaces of the fluorescent part when viewed from above, and a light-transmissive member disposed below the wavelength converting member. A dielectric multilayer film is disposed on an upper surface of the light-transmissive member at least at a region facing the fluorescent part, the dielectric multilayer film is configured to transmit excitation light incident from below the light-transmissive member and to reflect fluorescent light emitted from the fluorescent part. Further, a space is formed between the fluorescent part and the dielectric multilayer film, and the light-reflecting part and the light-transmissive member are connected by a connecting member made of a metal material.

Abstract: Provided is a light emitting device comprising an optical member provided on a light extracting surface side of a semiconductor light emitting element via a first light transmissive layer, wherein bonding surfaces of the semiconductor light emitting element and the first light transmissive layer are roughened surfaces, bonding surfaces of the first light transmissive layer and the optical member are flat, and the first light transmissive layer and the optical member are directly bonded.

Abstract: A light emitting device can further improve light extraction efficiency. A method of manufacturing such a light emitting device can also prove advantageous. The light emitting device includes a light emitting element, a light-transmissive member which is disposed on a light extracting surface side of the light emitting element, and a reflecting layer disposed on an element bonding surface of the light transmissive member where the light emitting element is disposed and adjacent to the light emitting element. The light-transmissive member, in a plan view, has a planar dimension greater than the light extracting surface of the light emitting element.

Abstract: A method of manufacturing an optical component for an optical semiconductor includes: providing a joined body including: a first member having light transmissivity and containing at least one element selected from the group consisting of oxygen, fluorine, and nitrogen, and a second member, wherein the first member and the second member are joined together via a metal joining member made by directly bonding a first metal film formed on the first member and a second metal film formed on the second member; and irradiating the joining member with a laser beam or a microwave.

Abstract: A method of manufacturing a semiconductor device includes disposing a substrate metal film on an upper surface of a substrate made of a metal; disposing a first element metal film on a lower surface of a first element; disposing a second element metal film on a lower surface of a second element; bonding the first element and the second element to the substrate so that an upper surface of the substrate metal film is in contact with a lower surface of the first element metal film and a lower surface of the second element metal film; oxidizing at least a portion of a region of the upper surface of the substrate metal film other than regions in contact with the first element metal film and the second element metal film; and disposing a wiring electrically connecting the first element and the second element, across and above the region oxidized.

Abstract: A light distribution member includes a body and a light-shielding frame. The body includes a plurality of transmissive pieces and a plurality of light shield parts each interposed between adjacent ones of the transmissive pieces. Each of the transmissive pieces is made of a phosphor or made of a sinter of a phosphor and a binder composed of an inorganic substance. The light-shielding frame is provided so as to surround an outer edge periphery of the body. The light-shielding frame is made of a ceramic. The light distribution member contains substantially no organic substance inside the light-shielding frame.