Patents by Inventor Masatsugu NIMURA

Masatsugu NIMURA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for manufacturing semiconductor device, semiconductor mounting device, and memory device manufactured by method for manufacturing semiconductor device
    Patent number: 10181460
    Abstract: A method for manufacturing a semiconductor device includes laminating a plurality of semiconductor wafers via an adhesive, heating such that the adhesive reaches a specific viscosity, and pressing the semiconductor wafers under a provisional pressure bonding load such that a gap between solder of through-electrodes provided to chip parts and through-electrodes of an adjacent semiconductor wafer falls within a specific range that is greater than zero, to produce a provisional pressure-bonded laminate; cutting the provisional pressure-bonded laminate with a cutter to produce a provisional pressure-bonded laminate chip part; and heating the provisional pressure-bonded laminate chip part to at least curing temperature of the adhesive and at least melting point of the solder, and pressing the provisional pressure-bonded laminate chip part under a main pressure bonding load to produce a main pressure-bonded laminate chip part such that the solder comes into contact with the through-electrodes of adjacent chip parts
    Type: Grant
    Filed: March 29, 2016
    Date of Patent: January 15, 2019
    Assignee: TORAY ENGINEERING CO., LTD.
    Inventors: Noboru Asahi, Yoshiyuki Arai, Yoshinori Miyamoto, Shimpei Aoki, Masatsugu Nimura
  • METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR MOUNTING DEVICE, AND MEMORY DEVICE MANUFACTURED BY METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
    Publication number: 20180096980
    Abstract: A method for manufacturing a semiconductor device includes laminating a plurality of semiconductor wafers via an adhesive, heating such that the adhesive reaches a specific viscosity, and pressing the semiconductor wafers under a provisional pressure bonding load such that a gap between solder of through-electrodes provided to chip parts and through-electrodes of an adjacent semiconductor wafer falls within a specific range that is greater than zero, to produce a provisional pressure-bonded laminate; cutting the provisional pressure-bonded laminate with a cutter to produce a provisional pressure-bonded laminate chip part; and heating the provisional pressure-bonded laminate chip part to at least curing temperature of the adhesive and at least melting point of the solder, and pressing the provisional pressure-bonded laminate chip part under a main pressure bonding load to produce a main pressure-bonded laminate chip part such that the solder comes into contact with the through-electrodes of adjacent chip parts
    Type: Application
    Filed: March 29, 2016
    Publication date: April 5, 2018
    Inventors: Noboru ASAHI, Yoshiyuki ARAI, Yoshinori MIYAMOTO, Shimpei AOKI, Masatsugu NIMURA