Patents by Inventor Masatsugu Soga

Masatsugu Soga has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10570320
    Abstract: Provided is an adhesive member to be adhesively fixed through pressure which has both position adjustability and adhesiveness and is capable of producing a sufficient adhesive strength in addition to the position adjustability. The adhesive member comprises a support, a pressure-sensitive adhesive layer provided on one surface of the support, and a plurality of protrusion elements arranged, in spaced-apart relation to each other, on a principal surface of the pressure-sensitive adhesive layer on a side opposite to the support. Each of the protrusion elements is composed of an aggregation of a plurality of cohesive particles, wherein the adhesive member has a frictional force of 0.4 N/cm2 or less, with respect to a stainless steel plate serving as an adherend, as measured when the protrusion elements are in contact with a surface of the adherend, and a shear adhesive strength of 45 N/cm2 or more.
    Type: Grant
    Filed: March 7, 2016
    Date of Patent: February 25, 2020
    Assignee: NITTO DENKO CORPORATION
    Inventors: Kensuke Tani, Mizuho Nagata, Kaori Mizobata, Masatsugu Soga, Ryota Masuda, Masayuki Satake, Kenichi Okada, Naofumi Kosaka, Keisuke Shimokita
  • Publication number: 20190016923
    Abstract: Provided is an adhesive member to be adhesively fixed through pressure which has both position adjustability and adhesiveness and is capable of producing a sufficient adhesive strength in addition to the position adjustability. The adhesive member comprises a support, a pressure-sensitive adhesive layer provided on one surface of the support, and a plurality of protrusion elements arranged, in spaced-apart relation to each other, on a principal surface of the pressure-sensitive adhesive layer on a side opposite to the support. Each of the protrusion elements is composed of an aggregation of a plurality of cohesive particles, wherein the adhesive member has a frictional force of 0.4 N/cm2 or less, with respect to a stainless steel plate serving as an adherend, as measured when the protrusion elements are in contact with a surface of the adherend, and a shear adhesive strength of 45 N/cm2 or more.
    Type: Application
    Filed: March 7, 2016
    Publication date: January 17, 2019
    Applicant: NITTO DENKO CORPORATION
    Inventors: Kensuke TANI, Mizuho NAGATA, Kaori MIZOBATA, Masatsugu SOGA, Ryota MASUDA, Masayuki SATAKE, Kenichi OKADA, Naofumi KOSAKA, Keisuke SHIMOKITA
  • Publication number: 20150357605
    Abstract: A method for producing an organic electroluminescence device using a roll-to-roll method includes the step of sticking a belt-shaped sealing substrate 5 transported while being applied with tension on a belt-shaped supporting substrate 21 on which an organic electroluminescence element is formed, wherein either one substrate of the supporting substrate 21 or the sealing substrate 5 has a tensile modulus of elasticity larger than that of another substrate, in the step, the sticking is performed in the middle of transporting the belt-shaped supporting substrate 21 in the long-side direction while being applied with tension, and in the step, the substrate having a smaller tensile modulus of elasticity is applied with tension less than or equal to 170 N/m and the substrate having a larger tensile modulus of elasticity is applied with tension greater than the tension applied to the substrate having a smaller tensile modulus of elasticity.
    Type: Application
    Filed: March 11, 2014
    Publication date: December 10, 2015
    Applicant: NITTO DENKO CORPORATION
    Inventors: Yoshinori Osaki, Satoru Yamamoto, Yusuke Komoto, Masatsugu Soga
  • Publication number: 20130344308
    Abstract: A radiant heat conduction-suppressing sheet according to an embodiment of the present invention includes: a heat conduction-suppressing layer and a heat conductive layer. The heat conduction-suppressing layer has a heat conductivity of 0.06 W/m·K or less. The heat conductive layer has a far-infrared absorptivity at a wavelength of 7 ?m to 10 ?m of 0.6 or less, and a heat conductivity of 200 W/m·K or more. The radiant heat conduction-suppressing sheet is used by being fixed to a housing containing a heating element under a state in which a side of the heat conduction-suppressing layer is fixed to the housing at such a position that the heat conductive layer faces a heat radiating surface of the heating element while being free of close contact with the heating element.
    Type: Application
    Filed: June 21, 2013
    Publication date: December 26, 2013
    Applicant: NITTO DENKO CORPORATION
    Inventors: Tomonori Hyodo, Masatsugu Soga, Akira Hirao, Yusuke Komoto, Hidetoshi Maikawa