Patents by Inventor Masatugi Kawaguchi

Masatugi Kawaguchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device having a mechanical buffer
    Patent number: 5235212
    Abstract: A metal having a Knoop hardness of 40 or more is used as an electrode, Cu or a Cu alloy is used as a thin metal wire, and a mechanical buffer layer is formed between the electrode and an insulating material layer. Silicon nitride or metal vanadium is used as the mechanical buffer layer. The thin metal wire is fixed to the electrode metal by compression bonding.
    Type: Grant
    Filed: March 13, 1989
    Date of Patent: August 10, 1993
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Yoshio Shimizu, Shoji Kotani, Masatugi Kawaguchi