Abstract: A heat conductive cured product which can be handled even in a single layer or thin film form, can be readily attached to a heat-generating component or heat-dissipating member, and exhibits an appropriate tack and heat conductivity in a thin film form is provided as well as a method for preparing the same. A heat conductive cured product is prepared by applying a heat conductive composition as a thin film to a substrate which has been treated to have a silicone pressure-sensitive adhesive releasable surface, and curing the composition, the composition comprising as essential components, (a) an organopolysiloxane having alkenyl radicals, (b) a heat conductive filler, the filler containing at least 30 vol % of aluminum powder based on its total volume, (c) an organohydrogenpolysiloxane, (d) a platinum group metal catalyst, (e) a reaction regulator, and (f) a silicone resin.

Abstract: A silicone rubber composition comprises (a) an organopolysiloxane having alkenyl radicals, (b) a heat conductive filler, (c) an organohydrogenpolysiloxane, (d) a platinum group metal compound, (e) a reaction regulator, and (f) a silicone resin. A heat conductive cured product is prepared by intimately mixing components (a) to (f), applying the composition as a thin film to a substrate which has been treated to be releasable, and curing the composition.

Abstract: A heat conductive cured product which can be handled even in a single layer or thin film form, can be readily attached to a heat-generating component or heat-dissipating member, and exhibits an appropriate tack and heat conductivity in a thin film form is provided as well as a method for preparing the same. A heat conductive cured product is prepared by applying a heat conductive composition as a thin film to a substrate which has been treated to have a silicone pressure-sensitive adhesive releasable surface, and curing the composition, the composition comprising as essential components, (a) an organopolysiloxane having alkenyl radicals, (b) a heat conductive filler, the filler containing at least 30 vol % of aluminum powder based on its total volume, (c) an organohydrogenpolysiloxane, (d) a platinum group metal catalyst, (e) a reaction regulator, and (f) a silicone resin.

Abstract: A heat transfer member is prepared by applying a silicone composition onto a substrate to form an uncured silicone coating, and heat curing the coating to form a silicone heat conductor including a cured skin layer on the outer surface side and a low hardness layer on the inner surface side. The silicone composition comprises (a) an organopolysiloxane having alkenyl groups, (b) a heat conductive filler, (c) an organohydrogenpolysiloxane having Si—H groups, (d) an addition reaction catalyst, and (e) a volatile compound having one alkenyl group allowing for addition of an Si—H group thereto.

Abstract: A silicone rubber composition comprises (a) an organopolysiloxane having alkenyl radicals, (b) a heat conductive filler, (c) an organohydrogenpolysiloxane, (d) a platinum group metal compound, (e) a reaction regulator, and (f) a silicone resin. A heat conductive cured product is prepared by intimately mixing components (a) to (f), applying the composition as a thin film to a substrate which has been treated to be releasable, and curing the composition.

Abstract: A heat transfer member is prepared by applying a silicone composition onto a substrate to form an uncured silicone coating, and heat curing the coating to form a silicone heat conductor including a cured skin layer on the outer surface side and a low hardness layer on the inner surface side. The silicone composition comprises (a) an organopolysiloxane having alkenyl groups, (b) a heat conductive filler, (c) an organohydrogenpolysiloxane having Si—H groups, (d) an addition reaction catalyst, and (e) a volatile compound having one alkenyl group allowing for addition of an Si—H group thereto.

Abstract: A heat conductive silicone composition comprising (a) an organopolysiloxane having alkenyl groups only at both ends of a molecular chain, (b) a heat conductive filler, (c) an organohydrogenpolysiloxane having Si—H groups only at both ends of a molecular chain, and (d) a platinum group curing catalyst is shaped into an article which conforms to a member and permits heat to dissipate from the member without applying stresses thereto.

Abstract: A heat conductive silicone composition comprising (a) an organopolysiloxane having alkenyl groups only at both ends of a molecular chain, (b) a heat conductive filler, (c) an organohydrogenpolysiloxane having Si—H groups only at both ends of a molecular chain, and (d) a platinum group curing catalyst is shaped into an article which conforms to a member and permits heat to dissipate from the member without applying stresses thereto.