Patents by Inventor Masaya Hara

Masaya Hara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11977949
    Abstract: A card reader includes a card reader main body, a board which is fixed to the card reader main body, a light emitting element which is disposed on a surface of the board, a cover member which is made of light transmissive material and covers the board from an opposite side to the card reader main body, and a code imaging part which images a one-dimensional code or a two-dimensional code. The cover member is formed with a card insertion port, and the code imaging part is held by the cover member and is disposed at a position adjacent to the card insertion port in a longitudinal direction of the card insertion port.
    Type: Grant
    Filed: November 29, 2022
    Date of Patent: May 7, 2024
    Assignee: NIDEC SANKYO CORPORATION
    Inventors: Ryota Hara, Masaya Fujimoto
  • Patent number: 11801372
    Abstract: A microneedle array to be used instead of a syringe has, at a tip side of each microneedle, two or four puncture portions disposed facing each other. The puncture portions each have a part of a side surface of each microneedle as outer surfaces, respectively, and one of the puncture portions is shorter than the other(s). A housing section capable of holding a drug is formed by inner surfaces of the puncture portions of each microneedle. The housing section opens toward the tip side and lateral directions orthogonal to an axis core of each microneedle, and has a central bottom surface at a bottom end. The inner surfaces facing each other and forming the housing section of each microneedle each have a downward slope, with a width between the inner surfaces getting narrower as it goes down from tips of the respective puncture portions toward the central bottom surface.
    Type: Grant
    Filed: August 6, 2018
    Date of Patent: October 31, 2023
    Assignees: MISHIMA KOSAN CO., LTD., KYUSHU INSTITUTE OF TECHNOLOGY
    Inventors: Toshiaki Atari, Masaaki Matsuo, Yasunori Tashiro, Masaya Hara, Junji Kuroki, Takahiro Ito, Tomohiro Hikima
  • Publication number: 20200330739
    Abstract: A microneedle array with a performance adequate to be used instead of a syringe has at a tip side of each microneedle 10 two puncture portions 14 and 15 disposed facing each other. The puncture portions 14 and 15 each have a part of a side surface of the microneedle 10 as outer surfaces 12 and 13, respectively, and one of the puncture portions 14 and 15 is shorter than the other. Surrounded by inner surfaces 16 and 17 of the puncture portions 14 and 15 facing each other, a housing section 19 capable of holding a drug is formed. The housing section 19 opens toward the tip side and both lateral directions along an axis core of the microneedle 10, and has a central bottom surface 18 at a bottom end.
    Type: Application
    Filed: August 6, 2018
    Publication date: October 22, 2020
    Applicants: Mishima Kosan Co., Ltd., Kyushu Institute of Technology
    Inventors: Toshiaki Atari, Masaaki Matsuo, Yasunori Tashiro, Masaya Hara, Junji Kuroki, Takahiro Ito, Tomohiro Hikima
  • Patent number: 6853237
    Abstract: The invention provides a temperature-compensating circuit which comprises first degree and second degree temperature-coefficient-generating circuits respectively comprising an operational amplifier and a plurality of resistors each having different temperature coefficient, a sign-inverting circuit, and first degree and second degree temperature-coefficient-adjusting circuits. Resistance values of the resistors of the first degree and second degree temperature-coefficient-generating circuits are decided so that voltage amplification factors are linearly or quadratically changed as a temperature changes. The sign-inverting circuit inverts signs of temperature coefficients generated by the first degree and second degree temperature-coefficient-generating circuits and the first degree and second degree temperature-coefficient-adjusting circuits adjust temperature coefficients generated by the first degree and second degree temperature-coefficient-generating circuits to predetermined values.
    Type: Grant
    Filed: September 18, 2001
    Date of Patent: February 8, 2005
    Assignees: Mitsubishi Denki Kabushiki Kaisha, Mitsubishi Electric Engineering Company
    Inventors: Mitsumasa Murakami, Masaya Hara
  • Publication number: 20030006822
    Abstract: The invention provides a temperature-compensating circuit which comprises first degree and second degree temperature-coefficient-generating circuits respectively comprising an operational amplifier and a plurality of resistors each having different temperature coefficient, a sign-inverting circuit, and first degree and second degree temperature-coefficient-adjusting circuits. Resistance values of the resistors of the first degree and second degree temperature-coefficient-generating circuits are decided so that voltage amplification factors are linearly or quadratically changed as a temperature changes. The sign-inverting circuit inverts signs of temperature coefficients generated by the first degree and second degree temperature-coefficient-generating circuits and the first degree and second degree temperature-coefficient-adjusting circuits adjust temperature coefficients generated by the first degree and second degree temperature-coefficient-generating circuits to predetermined values.
    Type: Application
    Filed: September 18, 2001
    Publication date: January 9, 2003
    Applicant: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Mitsumasa Murakami, Masaya Hara