Abstract: An object of the present invention is to provide an adhesive composition for a printed wiring board, the adhesive composition having a good heat resistance. Another object of the present invention is to provide a coverlay for a printed wiring board, a copper-clad laminate, and a printed wiring board, all of which use the adhesive composition for a printed wiring board. The present invention provides an adhesive composition for a printed wiring board, the adhesive composition containing a siloxane-modified polyimide that includes structural units represented by formulae (1) and (2) below, an epoxy resin, and an inorganic filler. The siloxane-modified polyimide has a weight-average molecular weight (Mw) of 25,000 or more and 150,000 or less. A content of the inorganic filler is 10 parts by mass or more and 100 parts by mass or less relative to 100 parts by mass of the siloxane-modified polyimide. In formulae (1) and (2), Ar represents a tetravalent aromatic tetracarboxylic acid residue, m is 0.35 or more and 0.

Abstract: An object of the present invention is to provide an adhesive composition for a printed wiring board, the adhesive composition having a good heat resistance. Another object of the present invention is to provide a coverlay for a printed wiring board, a copper-clad laminate, and a printed wiring board, all of which use the adhesive composition for a printed wiring board. The present invention provides an adhesive composition for a printed wiring board, the adhesive composition containing a siloxane-modified polyimide that includes structural units represented by formulae (1) and (2) below, an epoxy resin, and an inorganic filler. The siloxane-modified polyimide has a weight-average molecular weight (Mw) of 25,000 or more and 150,000 or less. A content of the inorganic filler is 10 parts by mass or more and 100 parts by mass or less relative to 100 parts by mass of the siloxane-modified polyimide. In formulae (1) and (2), Ar represents a tetravalent aromatic tetracarboxylic acid residue, m is 0.35 or more and 0.

Abstract: A negative photosensitive resin composition contains a polyimide precursor resin obtained by condensation polymerization of a carboxylic anhydride component containing an aromatic tetracarboxylic dianhydride and a diamine component containing an aromatic diamine, a photopolymerizable monomer, and a photopolymerization initiator, wherein a compound having a photoreactive functional group and a glycidyl group is contained as the photopolymerizable monomer in an amount of 0.05% to 15% by weight relative to the total solid content of the negative photosensitive resin composition. Accordingly, a negative photosensitive resin composition is provided in which non-exposed areas have excellent solubility in a developing solution and degradation of the film located in exposed areas, the degradation being caused by the developing solution, is suppressed. Also provided are a printed circuit board and a polyimide film using the negative photosensitive resin composition.

Abstract: A heat-resistant resin varnish characterized by comprising a polyamideimide resin whose terminal isocyanate group is blocked with a blocking agent and a polyamic acid, which is freed from viscosity increase even without employing any complicated step such as heating or cooling and which is easily applicable to a substrate and can form, through curing, films having excellent strength and elongation (toughness) equivalent to those of polyimide resin; heat-resistant resin films which are made of a heat-resistant resin formed by baking the varnish and have excellent toughness; heat-resistant composites having the heat-resistant resin films; and insulated wire which is covered with an insulating coating film made from the varnish through curing and having excellent toughness and which can be easily manufactured at a low cost.

Abstract: A non-cooled type infrared sensor that uses ceramic in the lens body is provided, wherein the infrared light transmittance of the lens body, which is the light receiving part, the performance of shielding of the visible light that becomes noise, and the performance reliability as a whole are improved and the manufacturing cost of the sensor is reduced.