Abstract: A defect inspection device in which an optical axis of a detection optical system is inclined with respect to a surface of a sample, and an imaging sensor is inclined with respect to the optical axis, a height variation amount of an illumination spot in a normal direction of the surface of the sample is calculated based on an output of a height measuring unit, a deviation amount of the focusing position with respect to the light receiving surface in an optical axis direction of the detection optical system is calculated based on the height variation amount of the illumination spot, the deviation amount of the focusing position being generated accompanying a height variation of the illumination spot, and the focus actuator is controlled based on the deviation amount of the focusing position, and scattered light intensities at the same coordinates of the sample are added.

Abstract: It is an object to provide a therapeutic composition for treatment of a central nervous disease, a method for producing a therapeutic composition for treatment of a central nervous disease, and a method for producing and preserving a therapeutic formulation for treatment of a central nervous disease. The object is attained by a therapeutic composition for treatment of a central nervous disease, containing synovial membrane-derived mesenchymal stem cells cultured in a serum-free medium.

Abstract: A power monitoring device is configured to monitor power consumed in a device for mounting component, which constitutes a component mounting line. The power monitoring device includes: an operation information collecting section configured to collect in time-series operation information representing a device operation state of the device for mounting component and to create time-series data of the operation information; a power measuring section configured to measure in time-series an amount of power consumption representing an amount of power consumed in the device for mounting component and to create time-series data of the amount of power; a synchronous output section configured to output the time-series data of the operation information and the time-series data of the amount of power by synchronizing respective time axes in time-series with each other.

Abstract: A method of optimizing an order of component mounting which includes optimizing an order of component mounting for any one pattern among the plurality of patterns, calculating a quotient and a remainder by dividing the total number of the patterns included in the board by the number of mounters, determining the quotient as the number of patterns to be allocated in a case where the remainder is zero. The optimization method also includes determining a number, which is the quotient plus one, as the number of patterns to be allocated to the same number of the mounters as the remainder, starting from the mounter in a process farthest upstream, determining the quotient as the number of patterns to be allocated to the rest of the mounters, in the case where the remainder is one or greater, and allocating the allocated number of patterns, to each of the mounters.

Abstract: A component verification method for a mounter (100) that is capable of performing component verification with less labor. The method includes a position specification step (S12A) of specifying a placement position in the mounter (100) where a component tape is placed; a read step (S13) of reading component information from an IC tag (426b) that is attached to the component tape or a reel (426); and a verification step (S14) of verifying the component information and the placement position against component arrangement data that indicates components that should be mounted onto the board as well a position where the component tape should be placed.

Abstract: An optimizing apparatus for optimizing a mounter equipped with a line gang pickup head which picks up a plurality of components and mounts them on a board. The apparatus includes a nozzle set determination unit for determining a nozzle set which reduces a mounting time in view of a number of times interchanging pickup nozzles and a total task number necessary for mounting the plural components, a nozzle pattern determination unit for determining an optimal nozzle pattern as well as an arrangement of pickup nozzles (nozzle arrangement) at a nozzle station, based on the nozzle set determined by the nozzle set determination unit, and Z-axis arrangement/mounting order optimization unit for determining an array order of component feeders and a mounting order of components while maintaining the determined nozzle set and nozzle pattern.

Abstract: A method for identifying apparatuses to be recalled that enables identifying the locations of the products to be recalled, the method including: collecting steps (S2 and S4) of collecting the information items stored in IC tags from the apparatuses with the IC tag via a communication network, a checking step (S6) of checking the information items collected in the collecting step with the information items related to the apparatuses to be recalled, and an identifying step (S8) of identifying the apparatuses to be recalled in the apparatuses with the IC tag based on the checking results.

Abstract: A plurality of patterns having the same component placement structure is included in the board, said plurality of patterns corresponding respectively to a plurality of sub-boards obtained by partitioning said board.

Abstract: A component verification method for a mounter (100) that is capable of performing component verification with less labor, is comprised of: a position specification step (S12A) of specifying a placement position in the mounter (100) where a component tape is placed; a read step (S13) of reading component information from an IC tag (426b) that is attached to the component tape or a reel (426); and a verification step (S14) of verifying the component information and the placement position against component arrangement data that indicates components that should be mounted onto the board as well a position where the component tape should be placed.

Abstract: An optimizing apparatus (300a) for a mounter equipped with a line gang pickup head which picks up a plurality of components and mounts them on a board comprises: a nozzle set determination unit (305a) for determining a nozzle set which reduces a mounting time in view of the number of times interchanging pickup nozzles and a total task number necessary for mounting the plural components; a nozzle pattern determination unit (305b) for determining an optimal nozzle pattern as well as an arrangement of pickup nozzles (nozzle arrangement) at a nozzle station (119), based on the nozzle set determined by the nozzle set determination unit (305a); and Z-axis arrangement/mounting order optimization unit (305c) for determining an array order of component feeders and a mounting order of components while maintaining the determined nozzle set and nozzle pattern.

Abstract: An algorithm for determining the movement of camera for automatic tracing of inspection positions is preset based on the characteristic shape of the component. A start point and an end point of inspection of lands are designated to the camera, and the camera moves from the start point to the end point automatically along a predetermined path in accordance with the preset algorithm, thereby performing inspection of lands in succession.

Abstract: The present invention provides an apparatus and a method for operating reflow soldering in a mounting field whereby an abnormality in transfer of circuit boards can be detected with high reliability. Whether or not a circuit board is transferred by a transfer conveyor is judged. A discharge conveyor is started when a control device judges occurrence of transfer abnormality. After the discharge conveyor starts, the transfer abnormality is determined to be a drop of the circuit board if a discharge completion detector detects that a dropped circuit board is discharged. And then the control device continues the reflow soldering. The transfer abnormality in the reflow soldering apparatus can be detected with high reliability because it can be detected whether the transfer abnormality is either the drop or a clog of the circuit board.

Abstract: The present invention provides an apparatus and a method for operating reflow soldering in a mounting field whereby an abnormality in transfer of circuit boards can be detected with high reliability. Whether or not a circuit board is transferred by a transfer conveyor is judged. A discharge conveyor is started when a control device judges occurrence of transfer abnormality. After the discharge conveyor starts, the transfer abnormality is determined to be a drop of the circuit board if a discharge completion detector detects that a dropped circuit board is discharged. And then the control device continues the reflow soldering. The transfer abnormality in the reflow soldering apparatus can be detected with high reliability because it can be detected whether the transfer abnormality is either the drop or a clog of the circuit board.

Abstract: The present invention provides an apparatus and a method for operating reflow soldering in a mounting field whereby an abnormality in transfer of circuit boards can be detected with high reliability. Whether or not a circuit board is transferred by a transfer conveyor is judged. A discharge conveyor is started when a control device judges occurrence of transfer abnormality. After the discharge conveyor starts, the transfer abnormality is determined to be a drop of the circuit board if a discharge completion detector detects that a dropped circuit board is discharged. And then the control device continues the reflow soldering. The transfer abnormality in the reflow soldering apparatus can be detected with high reliability because it can be detected whether the transfer abnormality is either the drop or a clog of the circuit board.

Abstract: Coordinate positions of openings and lands on a screen and a first circuit board are recognized by a recognition camera and a display device. A correction amount for movement of the stage is calculated by a control device only for the first circuit board. Then, the correction of movement of the stage is executed for the second and following circuit boards by utilizing the correction amount.