Patents by Inventor Masaya Nishikawa

Masaya Nishikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor chip mounting wiring board, manufacturing method for same, and semiconductor module
    Patent number: 7656032
    Abstract: A semiconductor chip mounting wiring board 2 includes an insulating resin substrate 5, a first conductive bump 12 formed on one side of the insulative resin substrate 5 to mount a semiconductor chip 3, a wiring pattern 15 extending from the first conductive bump 12 toward the periphery of the insulating resin substrate 5, a filled viahole 9 leading from the other side of the insulating resin substrate 5 to the wiring pattern 15, and a second conductive bump 13, or a conductive pad 19, positioned just above the filled viahole 9 and electrically connected to the viahole 9.
    Type: Grant
    Filed: November 17, 2005
    Date of Patent: February 2, 2010
    Assignee: Ibiden Co., Ltd.
    Inventors: Takashi Kariya, Masaya Nishikawa
  • Semiconductor chip mounting wiring board, manufacturing method for same, and semiconductor module
    Patent number: 7049528
    Abstract: A semiconductor chip mounting wiring board 2 includes an insulating resin substrate 5, a first conductive bump 12 formed on one side of the insulative resin substrate 5 to mount a semiconductor chip 3, a wiring pattern 15 extending from the first conductive bump 12 toward the periphery of the insulating resin substrate 5, a filled viahole 9 leading from the other side of the insulating resin substrate 5 to the wiring pattern 15, and a second conductive bump 13, or a conductive pad 19, positioned just above the filled viahole 9 and electrically connected to the viahole 9.
    Type: Grant
    Filed: February 6, 2002
    Date of Patent: May 23, 2006
    Assignee: Ibiden Co., Ltd.
    Inventors: Takashi Kariya, Masaya Nishikawa
  • Semiconductor chip mounting wiring board, manufacturing method for same, and semiconductor module
    Publication number: 20060076671
    Abstract: A semiconductor chip mounting wiring board 2 includes an insulating resin substrate 5, a first conductive bump 12 formed on one side of the insulative resin substrate 5 to mount a semiconductor chip 3, a wiring pattern 15 extending from the first conductive bump 12 toward the periphery of the insulating resin substrate 5, a filled viahole 9 leading from the other side of the insulating resin substrate 5 to the wiring pattern 15, and a second conductive bump 13, or a conductive pad 19, positioned just above the filled viahole 9 and electrically connected to the viahole 9.
    Type: Application
    Filed: November 17, 2005
    Publication date: April 13, 2006
    Applicant: IBIDEN CO., LTD.
    Inventors: Takashi Kariya, Masaya Nishikawa
  • Semiconductor chip mounting wiring board, manufacturing method for same, and semiconductor module
    Publication number: 20030168254
    Abstract: A semiconductor chip mounting wiring board 2 includes an insulating resin substrate 5, a first conductive bump 12 formed on one side of the insulative resin substrate 5 to mount a semiconductor chip 3, a wiring pattern 15 extending from the first conductive bump 12 toward the periphery of the insulating resin substrate 5, a filled viahole 9 leading from the other side of the insulating resin substrate 5 to the wiring pattern 15, and a second conductive bump 13, or a conductive pad 19, positioned just above the filled viahole 9 and electrically connected to the viahole 9.
    Type: Application
    Filed: February 25, 2003
    Publication date: September 11, 2003
    Inventors: Takashi Kariya, Masaya Nishikawa