Patents by Inventor Masaya Seki

Masaya Seki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190054589
    Abstract: The present invention relates to a polishing apparatus and a polishing method for polishing a substrate, such as a wafer, and more particularly to a polishing apparatus and a polishing method for polishing an edge portion of a wafer with use of a polishing tape. The polishing apparatus includes a substrate holder (1) configured to hold and rotate a substrate (W), and a polishing unit (7) configured to polish an edge portion of the substrate (W) with use of a polishing tape (5). The polishing unit (7) includes: a disk head (12) having a circumferential surface for supporting the polishing tape (5); and a head moving device (50) configured to move the disk head (12) in a tangential direction of the substrate (W) and to bring the polishing tape (5) on the circumferential surface of the disk head (12) into contact with the edge portion of the substrate (W).
    Type: Application
    Filed: October 22, 2018
    Publication date: February 21, 2019
    Applicant: Ebara Corporation
    Inventors: Masaya SEKI, Manao HOSHINA
  • Patent number: 10166647
    Abstract: A polishing apparatus polishes a periphery of a substrate. This polishing apparatus includes a rotary holding mechanism configured to hold the substrate horizontally and rotate the substrate, plural polishing head assemblies provided around the substrate, plural tape supplying and recovering mechanisms configured to supply polishing tapes to the plural polishing head assemblies and recover the polishing tapes from the plural polishing head assemblies, and plural moving mechanisms configured to move the plural polishing head assemblies in radial directions of the substrate held by the rotary holding mechanism. The tape supplying and recovering mechanisms are located outwardly of the plural polishing head assemblies in the radial directions of the substrate, and the tape supplying and recovering mechanisms are fixed in position.
    Type: Grant
    Filed: November 2, 2016
    Date of Patent: January 1, 2019
    Assignee: EBARA CORPORATION
    Inventors: Tamami Takahashi, Masaya Seki, Hiroaki Kusa, Kenji Yamaguchi, Masayuki Nakanishi
  • Patent number: 10155294
    Abstract: A polishing unit of a polishing apparatus according to an embodiment includes: a polishing head having a pressing member configured to hold a polishing tape and press the polishing tape against a peripheral portion of a substrate from above; a tape supply and recovery mechanism configured to supply the polishing tape to the polishing head and recover the polishing tape from the polishing head; a first moving mechanism configured to move the polishing head in a radial direction of the substrate; and a second moving mechanism configured to move the tape supply and recovery mechanism in the radial direction of the substrate. The positioning unit includes a positioning block having a contacting surface, and alignment of the polishing tape is conducted by the second moving mechanism moving the tape supply and recovery mechanism so that a substrate-side edge of the polishing tape makes contact with the contacting surface.
    Type: Grant
    Filed: January 29, 2018
    Date of Patent: December 18, 2018
    Assignee: Ebara Corporation
    Inventors: Masaya Seki, Tetsuji Togawa, Kenya Ito
  • Patent number: 10144103
    Abstract: The present invention relates to a polishing apparatus and a polishing method for polishing a substrate, such as a wafer, and more particularly to a polishing apparatus and a polishing method for polishing an edge portion of a wafer with use of a polishing tape. The polishing apparatus includes a substrate holder (1) configured to hold and rotate a substrate (W), and a polishing unit (7) configured to polish an edge portion of the substrate (W) with use of a polishing tape (5). The polishing unit (7) includes: a disk head (12) having a circumferential surface for supporting the polishing tape (5); and a head moving device (50) configured to move the disk head (12) in a tangential direction of the substrate (W) and to bring the polishing tape (5) on the circumferential surface of the disk head (12) into contact with the edge portion of the substrate (W).
    Type: Grant
    Filed: February 12, 2015
    Date of Patent: December 4, 2018
    Assignee: Ebara Corporation
    Inventors: Masaya Seki, Manao Hoshina
  • Patent number: 10137552
    Abstract: A polishing apparatus polishes a periphery of a substrate by bringing a polishing tool into sliding contact with the substrate. The polishing apparatus includes a substrate-holding mechanism configured to hold a substrate and rotate the substrate, a polishing mechanism configured to press a polishing tool against a periphery of the substrate so as to polish the periphery, and a periphery-supporting mechanism configured to support the periphery of the substrate by a fluid. The periphery-supporting mechanism is configured to support a surface of the substrate from an opposite side or the same side of the periphery of the substrate.
    Type: Grant
    Filed: April 12, 2017
    Date of Patent: November 27, 2018
    Assignee: EBARA CORPORATION
    Inventors: Kazuaki Maeda, Tamami Takahashi, Masaya Seki, Hiroaki Kusa
  • Publication number: 20180169822
    Abstract: A polishing unit of a polishing apparatus according to an embodiment includes: a polishing head having a pressing member configured to hold a polishing tape and press the polishing tape against a peripheral portion of a substrate from above; a tape supply and recovery mechanism configured to supply the polishing tape to the polishing head and recover the polishing tape from the polishing head; a first moving mechanism configured to move the polishing head in a radial direction of the substrate; and a second moving mechanism configured to move the tape supply and recovery mechanism in the radial direction of the substrate. The positioning unit includes a positioning block having a contacting surface, and alignment of the polishing tape is conducted by the second moving mechanism moving the tape supply and recovery mechanism so that a substrate-side edge of the polishing tape makes contact with the contacting surface.
    Type: Application
    Filed: January 29, 2018
    Publication date: June 21, 2018
    Applicant: Ebara Corporation
    Inventors: Masaya Seki, Tetsuji Togawa, Kenya Ito
  • Publication number: 20180076043
    Abstract: A method and an apparatus for processing a peripheral portion of a substrate, such as a wafer, are disclosed. The substrate processing method includes: holding a substrate on a substrate stage; rotating the substrate stage and the substrate about an axis of the substrate stage; directing a laser beam to an edge portion of the rotating substrate to form an annular crack in the substrate; and pressing a polishing tool against the edge portion of the rotating substrate to form a stepped recess in a peripheral portion of the substrate.
    Type: Application
    Filed: September 11, 2017
    Publication date: March 15, 2018
    Inventors: Kenya ITO, Masaya SEKI, Kenichi KOBAYASHI, Michiyoshi YAMASHITA
  • Patent number: 9914196
    Abstract: A polishing unit of a polishing apparatus according to an embodiment includes: a polishing head having a pressing member configured to hold a polishing tape and press the polishing tape against a peripheral portion of a substrate from above; a tape supply and recovery mechanism configured to supply the polishing tape to the polishing head and recover the polishing tape from the polishing head; a first moving mechanism configured to move the polishing head in a radial direction of the substrate; and a second moving mechanism configured to move the tape supply and recovery mechanism in the radial direction of the substrate. The positioning unit includes a positioning block having a contacting surface, and alignment of the polishing tape is conducted by the second moving mechanism moving the tape supply and recovery mechanism so that a substrate-side edge of the polishing tape makes contact with the contacting surface.
    Type: Grant
    Filed: March 10, 2015
    Date of Patent: March 13, 2018
    Assignee: Ebara Corporation
    Inventors: Masaya Seki, Tetsuji Togawa, Kenya Ito
  • Publication number: 20170312879
    Abstract: A method of detecting an abnormality in polishing of a substrate is provided. The method includes: rotating the substrate; pressing a polishing tool against an edge portion of the substrate to polish the edge portion; measuring a position of the polishing tool relative to a surface of the substrate; determining an amount of polishing of the substrate from the position of the polishing tool; calculating a polishing rate from the amount of polishing of the substrate; and judging that an abnormality in polishing of the edge portion of the substrate has occurred if the polishing rate is out of a predetermined range.
    Type: Application
    Filed: July 19, 2017
    Publication date: November 2, 2017
    Inventors: Tetsuji Togawa, Masaya Seki, Hiroyuki Takenaka
  • Patent number: 9782869
    Abstract: Detection of an abnormality in polishing of a substrate is provided. A measuring device measures a position of the polishing tool relative to a surface of the substrate. A controller determines an amount of polishing of the substrate from the position of the polishing tool; calculates a polishing rate from the amount of polishing of the substrate; and judges that an abnormality in polishing of the edge portion of the substrate has occurred if the polishing rate is out of a predetermined range exceeds a predetermined threshold value.
    Type: Grant
    Filed: January 4, 2016
    Date of Patent: October 10, 2017
    Assignee: EBARA CORPORATION
    Inventors: Tetsuji Togawa, Masaya Seki, Hiroyuki Takenaka
  • Publication number: 20170216989
    Abstract: A polishing apparatus polishes a periphery of a substrate by bringing a polishing tool into sliding contact with the substrate. The polishing apparatus includes a substrate-holding mechanism configured to hold a substrate and rotate the substrate, a polishing mechanism configured to press a polishing tool against a periphery of the substrate so as to polish the periphery, and a periphery-supporting mechanism configured to support the periphery of the substrate by a fluid. The periphery-supporting mechanism is configured to support a surface of the substrate from an opposite side or the same side of the periphery of the substrate.
    Type: Application
    Filed: April 12, 2017
    Publication date: August 3, 2017
    Inventors: Kazuaki MAEDA, Tamami TAKAHASHI, Masaya SEKI, Hiroaki KUSA
  • Patent number: 9694467
    Abstract: A polishing method of polishing a substrate includes moving a stopper from a predetermined initial position by a distance corresponding to a target polishing amount of a substrate. The method further includes pressing a polishing tool against the substrate by a pressing member while rotating the substrate. The method further includes polishing the substrate until a positioning member which moves together with the pressing member is brought into contact with the stopper.
    Type: Grant
    Filed: December 21, 2016
    Date of Patent: July 4, 2017
    Assignee: EBARA CORPORATION
    Inventors: Masaya Seki, Tetsuji Togawa
  • Publication number: 20170165804
    Abstract: The present invention relates to a polishing apparatus and a polishing method for polishing a substrate, such as a wafer, and more particularly to a polishing apparatus and a polishing method for polishing an edge portion of a wafer with use of a polishing tape. The polishing apparatus includes a substrate holder (1) configured to hold and rotate a substrate (W), and a polishing unit (7) configured to polish an edge portion of the substrate (W) with use of a polishing tape (5). The polishing unit (7) includes: a disk head (12) having a circumferential surface for supporting the polishing tape (5); and a head moving device (50) configured to move the disk head (12) in a tangential direction of the substrate (W) and to bring the polishing tape (5) on the circumferential surface of the disk head (12) into contact with the edge portion of the substrate (W).
    Type: Application
    Filed: February 12, 2015
    Publication date: June 15, 2017
    Applicant: Ebara Corporation
    Inventors: Masaya SEKI, Manao HOSHINA
  • Patent number: 9649739
    Abstract: A polishing apparatus polishes a periphery of a substrate by bringing a polishing tool into sliding contact with the substrate. The polishing apparatus includes a substrate-holding mechanism configured to hold a substrate and rotate the substrate, a polishing mechanism configured to press a polishing tool against a periphery of the substrate so as to polish the periphery, and a periphery-supporting mechanism configured to support the periphery of the substrate by a fluid. The periphery-supporting mechanism is configured to support a surface of the substrate from an opposite side or the same side of the periphery of the substrate.
    Type: Grant
    Filed: August 18, 2015
    Date of Patent: May 16, 2017
    Assignee: EBARA CORPORATION
    Inventors: Kazuaki Maeda, Tamami Takahashi, Masaya Seki, Hiroaki Kusa
  • Publication number: 20170100813
    Abstract: A polishing apparatus is used for polishing a substrate such as a semiconductor wafer. The polishing apparatus includes a substrate holder to hold a substrate and to rotate the substrate, a pressing member configured to press a polishing tool against the substrate and to polish the substrate, a pressing force control mechanism configured to control a pressing force of the pressing member, and a polishing position limiting mechanism configured to limit a polishing position of the pressing member. A polishing tape or a fixed abrasive is used as the polishing tool.
    Type: Application
    Filed: December 21, 2016
    Publication date: April 13, 2017
    Inventors: Masaya Seki, Tetsuji Togawa
  • Publication number: 20170072528
    Abstract: A polishing apparatus polishes a periphery of a substrate. This polishing apparatus includes a rotary holding mechanism configured to hold the substrate horizontally and rotate the substrate, plural polishing head assemblies provided around the substrate, plural tape supplying and recovering mechanisms configured to supply polishing tapes to the plural polishing head assemblies and recover the polishing tapes from the plural polishing head assemblies, and plural moving mechanisms configured to move the plural polishing head assemblies in radial directions of the substrate held by the rotary holding mechanism. The tape supplying and recovering mechanisms are located outwardly of the plural polishing head assemblies in the radial directions of the substrate, and the tape supplying and recovering mechanisms are fixed in position.
    Type: Application
    Filed: November 2, 2016
    Publication date: March 16, 2017
    Inventors: Tamami TAKAHASHI, Masaya SEKI, Hiroaki KUSA, Kenji YAMAGUCHI, Masayuki NAKANISHI
  • Patent number: 9561573
    Abstract: A polishing apparatus is used for polishing a substrate such as a semiconductor wafer. The polishing apparatus includes a substrate holder to hold a substrate and to rotate the substrate, a pressing member configured to press a polishing tool against the substrate and to polish the substrate, a pressing force control mechanism configured to control a pressing force of the pressing member, and a polishing position limiting mechanism configured to limit a polishing position of the pressing member. A polishing tape or a fixed abrasive is used as the polishing tool.
    Type: Grant
    Filed: January 29, 2014
    Date of Patent: February 7, 2017
    Assignee: EBARA CORPORATION
    Inventors: Masaya Seki, Tetsuji Togawa
  • Patent number: 9517544
    Abstract: A polishing apparatus polishes a periphery of a substrate. This polishing apparatus includes a rotary holding mechanism configured to hold the substrate horizontally and rotate the substrate, plural polishing head assemblies provided around the substrate, plural tape supplying and recovering mechanisms configured to supply polishing tapes to the plural polishing head assemblies and recover the polishing tapes from the plural polishing head assemblies, and plural moving mechanisms configured to move the plural polishing head assemblies in radial directions of the substrate held by the rotary holding mechanism. The tape supplying and recovering mechanisms are located outwardly of the plural polishing head assemblies in the radial directions of the substrate, and the tape supplying and recovering mechanisms are fixed in position.
    Type: Grant
    Filed: December 19, 2014
    Date of Patent: December 13, 2016
    Assignee: EBARA CORPORATION
    Inventors: Tamami Takahashi, Masaya Seki, Hiroaki Kusa, Kenji Yamaguchi, Masayuki Nakanishi
  • Patent number: 9457447
    Abstract: The polishing apparatus has a polishing unit capable of forming a right-angled cross section by polishing a peripheral portion of the substrate. The polishing unit includes a polishing head having a pressing member configured to press a polishing tape against the peripheral portion of the substrate from above, a tape supply and recovery mechanism configured to supply the polishing tape to the polishing head and to recover the polishing tape from the polishing head, a first moving mechanism configured to move the polishing head in a radial direction of the substrate, and a second moving mechanism configured to move the tape supply and recovery mechanism in the radial direction of the substrate. The guide rollers are arranged such that the polishing tape extends parallel to a tangential direction of the substrate and a polishing surface of the polishing tape is parallel to a surface of the substrate.
    Type: Grant
    Filed: March 28, 2011
    Date of Patent: October 4, 2016
    Assignee: EBARA CORPORATION
    Inventors: Masaya Seki, Tetsuji Togawa, Masayuki Nakanishi
  • Patent number: 9457448
    Abstract: The polishing apparatus has a polishing unit capable of forming a right-angled cross section by polishing a peripheral portion of the substrate. The polishing unit includes a polishing head having a pressing member configured to press a polishing tape against the peripheral portion of the substrate from above, a tape supply and recovery mechanism configured to supply the polishing tape to the polishing head and to recover the polishing tape from the polishing head, a first moving mechanism configured to move the polishing head in a radial direction of the substrate, and a second moving mechanism configured to move the tape supply and recovery mechanism in the radial direction of the substrate. The guide rollers are arranged such that the polishing tape extends parallel to a tangential direction of the substrate and a polishing surface of the polishing tape is parallel to a surface of the substrate.
    Type: Grant
    Filed: June 22, 2015
    Date of Patent: October 4, 2016
    Assignee: EBARA CORPORATION
    Inventors: Masaya Seki, Tetsuji Togawa, Masayuki Nakanishi