Abstract: One aspect of the present disclosure provides a muffler including an exhaust pipe and a space forming member. The exhaust pipe has a cylindrical shape having a flow passage inside through which exhaust gas passes. The space forming member forms closed spaces between itself and the exhaust pipe, the closed spaces being branched from the flow passage and adjacent to the flow passage. Each of the closed spaces and the flow passage communicate with one another via a single communication hole.

Abstract: A muffler system with a muffler in one aspect of the present disclosure includes an outer wall, and a first separator and a second separator that partition a muffling space. An attachment member is arranged on an outer surface of the outer wall, and a muffler pipe to communicate with the muffling space is arranged to pass through an attachment member hole in the attachment member. The outer surface of the outer wall includes a first area and a second area. The first area is located between a first end of the muffling space and the first separator, and the second area is located between a second end of the muffling space and the second separator. The attachment member is welded to the first and second areas of the outer surface of the outer wall.

Abstract: One aspect of the present disclosure provides a muffler including an exhaust pipe and a space forming member. The exhaust pipe has a cylindrical shape having a flow passage inside through which exhaust gas passes. The space forming member forms closed spaces between itself and the exhaust pipe, the closed spaces being branched from the flow passage and adjacent to the flow passage. Each of the closed spaces and the flow passage communicate with one another via a single communication hole.

Abstract: The present disclosure provides a muffler system that can effectively reduce exhaust noises. The muffler system includes an exhaust passage and a first muffler. The exhaust passage is configured to allow a flow of an exhaust gas. The first muffler is an expansion chamber muffler and disposed in the exhaust passage. The first muffler is situated upstream of a first position in a flow direction of the exhaust gas. The first position is located away from an upstream end of the exhaust passage by one third of an entire length of the exhaust passage.

Abstract: A support structure for an exhaust system part that configures an exhaust system of an internal combustion engine for a vehicle includes a bracket and a support member. The bracket includes a first plate and a second plate. The first plate has both end portions attached to the second plate, and the second plate has both end portions attached to the exhaust system part. A first space is defined between the first plate and the second plate, and a second space is defined between the second plate and the exhaust system part. Each of the first space and the second space has a first open end disposed on the vehicle front side, and has a second open end disposed on the vehicle rear side. The first plate, the first space, the second plate, and the second space are disposed between the support member and the exhaust system part.

Abstract: In an exhaust system of an internal combustion engine, an exhaust pipe is reliably bent and deformed during vehicle rear collision while improving drainage performance in the exhaust pipe in normal times. The exhaust system 1 includes a second pipe 17 corresponding to a downstream end part of an exhaust pipe 10 through which exhaust gas flows from an engine 2. The second pipe 17 includes: a fragile part 30 as a starting point of bending deformation of a tail pipe 13; and a partition plate 20 vertically dividing the inside of the second pipe 17 to form, under the partition plate 20, a lower passage 7 to flow water that accumulates in the exhaust pipe 10. The partition plate 20 is in a vicinity of the fragile part 30 and at a position not overlapping with the fragile part 30 in an axial direction of the second pipe 17.

Abstract: A muffler system with a muffler in one aspect of the present disclosure includes an outer wall, and a first separator and a second separator that partition a muffling space. An attachment member is arranged on an outer surface of the outer wall, and a muffler pipe to communicate with the muffling space is arranged to pass through an attachment member hole in the attachment member. The outer surface of the outer wall includes a first area and a second area. The first area is located between a first end of the muffling space and the first separator, and the second area is located between a second end of the muffling space and the second separator. The attachment member is welded to the first and second areas of the outer surface of the outer wall.

Abstract: A support structure for an exhaust system part that configures an exhaust system of an internal combustion engine for a vehicle includes a bracket and a support member. The bracket includes a first plate and a second plate. The first plate has both end portions attached to the second plate, and the second plate has both end portions attached to the exhaust system part. A first space is defined between the first plate and the second plate, and a second space is defined between the second plate and the exhaust system part. Each of the first space and the second space has a first open end disposed on the vehicle front side, and has a second open end disposed on the vehicle rear side. The first plate, the first space, the second plate, and the second space are disposed between the support member and the exhaust system part.

Abstract: In an exhaust system of an internal combustion engine, an exhaust pipe is reliably bent and deformed during vehicle rear collision while improving drainage performance in the exhaust pipe in normal times. The exhaust system 1 includes a second pipe 17 corresponding to a downstream end part of an exhaust pipe 10 through which exhaust gas flows from an engine 2. The second pipe 17 includes: a fragile part 30 as a starting point of bending deformation of a tail pipe 13; and a partition plate 20 vertically dividing the inside of the second pipe 17 to form, under the partition plate 20, a lower passage 7 to flow water that accumulates in the exhaust pipe 10. The partition plate 20 is in a vicinity of the fragile part 30 and at a position not overlapping with the fragile part 30 in an axial direction of the second pipe 17.

Abstract: A cassette assembly for storing a plurality of platelike workpieces. The cassette assembly includes a first cassette, a second cassette stacked on the first cassette, and a fixing unit for fixing the first cassette and the second cassette to each other in the stacked condition. Both of the cassettes include a first side plate having workpiece supporting grooves, and a second side plate arranged parallel to the first side plate. The second side plate has workpiece supporting grooves respectively opposed to the workpiece supporting grooves of the first side plate, a top plate for connecting the upper ends of the first and second side plates, a bottom plate for connecting the lower ends of the first and second side plates, and a load/unload opening formed near the front ends of the first and second side plates, the top plate, and the bottom plate for loading and unloading the workpieces.

Abstract: A cassette assembly for storing a plurality of platelike workpieces. The cassette assembly includes a first cassette, a second cassette stacked on the first cassette, and a fixing unit for fixing the first cassette and the second cassette to each other in the stacked condition. Both of the cassettes include a first side plate having workpiece supporting grooves, and a second side plate arranged parallel to the first side plate. The second side plate has workpiece supporting grooves respectively opposed to the workpiece supporting grooves of the first side plate, a top plate for connecting the upper ends of the first and second side plates, a bottom plate for connecting the lower ends of the first and second side plates, and a load/unload opening formed near the front ends of the first and second side plates, the top plate, and the bottom plate for loading and unloading the workpieces.

Abstract: A machining device comprises laser beam machining means for shining a laser beam to a workpiece. The laser beam machining means includes laser beam oscillation means, laser beam modulation means, and laser beam shining means. The laser beam modulation means includes laser beam pulse width setting means for converting the laser beam oscillated by the laser beam oscillation means into a pulse laser having a pulse width of 1,000 ps or less.

Abstract: A semiconductor wafer dividing method for dividing a semiconductor wafer, in which a plurality of rectangular regions are demarcated by streets arranged in a lattice pattern on the face of the semiconductor wafer, and a semiconductor circuit is disposed in each of the rectangular regions, into the individual rectangular regions. This method includes a groove cutting step of cutting the face of the semiconductor wafer along the streets to form grooves along the streets on the face of the semiconductor wafer, and a back grinding step of grinding the back of the semiconductor wafer to reduce the thickness of the semiconductor wafer to not more than the depth of the grooves, thereby dividing the semiconductor wafer along the streets. This method further includes, before the back grinding step, a groove depth measuring step of measuring the depth of the grooves.

Abstract: A semiconductor wafer dividing method for dividing a semiconductor wafer, in which a plurality of rectangular regions are demarcated by streets arranged in a lattice pattern on the face of the semiconductor wafer, and a semiconductor circuit is disposed in each of the rectangular regions, into the individual rectangular regions. This method includes a groove cutting step of cutting the face of the semiconductor wafer along the streets to form grooves along the streets on the face of the semiconductor wafer, and a back grinding step of grinding the back of the semiconductor wafer to reduce the thickness of the semiconductor wafer to not more than the depth of the grooves, thereby dividing the semiconductor wafer along the streets. This method further includes, before the back grinding step, a groove depth measuring step of measuring the depth of the grooves.

Abstract: A cutting machine comprises a chucking means for holding the semiconductor wafer that is to be cut, a cutting means for cutting the semiconductor wafer held on the chucking means, a first moving means for moving the chucking means relative to the cutting means in a moving direction perpendicular to the center axis of the chucking means, and a second moving means for moving the cutting means relative to the chucking means in a direction of depth of cutting which is the direction of center axis of the chucking means. The cutting machine further comprises a thickness detecting means for detecting the thickness of the workpiece held on the chucking means, and a control means for controlling the motion of the second moving means depending upon the thickness of the workpiece detected by the thickness detecting means and for setting the position of the cutting means in the direction of depth of cutting relative to the chucking means thereby to set the depth of cutting the workpiece by the cutting means.

Abstract: The cleaning treatment apparatus of the present invention is constituted so that a cleaning liquid is continuously supplied by a liquid film forming means in a gap formed between a surface of a processed member held horizontally and rotationally driven by a holding and rotating means and a ultrasonically oscillating lower face of a ultrasonic oscillating means, to thereby form a liquid film in the gap. Hereby, the surface of the processed member is subjected to a cleaning treatment by the liquid film, which is ultrasonically oscillated by the ultrasonic oscillating means. At this stage, as the processed member is rotated by the holding and rotating means, the surface of the processed member is properly cleaned by the ultrasonically oscillating cleaning liquid not only in a region thereof opposed to the ultrasonic oscillating means during the standstill of the member but also in a region thereof opposed to the ultrasonic oscillating means during the rotation of the member.

Abstract: A cutting machine comprises a chucking means for holding the semiconductor wafer that is to be cut, a cutting means for cutting the semiconductor wafer held on the chucking means, a first moving means for moving the chucking means relative to the cutting means in a moving direction perpendicular to the center axis of the chucking means, and a second moving means for moving the cutting means relative to the chucking means in a direction of depth of cutting which is the direction of center axis of the chucking means. The cutting machine further comprises a thickness detecting means for detecting the thickness of the workpiece held on the chucking means, and a control means for controlling the motion of the second moving means depending upon the thickness of the workpiece detected by the thickness detecting means and for setting the position of the cutting means in the direction of depth of cutting relative to the chucking means thereby to set the depth of cutting the workpiece by the cutting means.

Abstract: Fluorescent ophthalmoscopic photographing apparatus including an injector for a fluorescent agent and a photographing camera for taking a photograph of an eye fundus. A time counter is provided for indicating a count of time interval from the start of the injection to each instance when the photograph is taken. A switch is provided so as to be actuated when the injection is completed to thereby make a record of the time interval wherein the injection is performed.