Abstract: A semiconductor device comprises a semiconductor substrate, a plurality of bump electrodes formed on the semiconductor substrate, and a sealing film having a top surface located higher than a top surface of each bump electrode and an opening for exposing the top surface of each bump electrode.

Abstract: An IC module includes a film substrate, a plurality of wiring leads, an electrically insulative plastic, and an IC chip. A junction structure of the IC module comprises the IC module, an electronic component, and an electrically conductive bonding compound to couple the IC module to the electronic component. The film substrate is provided with an opening. The plurality of wiring leads are arranged on the film substrate in a manner that some respective portions of the wiring leads bridge the opening provided in the film substrate, the electrically insulative plastic coats the some respective portions of the wiring leads which bridge the opening, and the IC chip is coupled to the wiring leads. The IC module is folded at a part where the some respective portions of the wiring leads bridge the opening.