Patents by Inventor Masayasu Sakuma

Masayasu Sakuma has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250189554
    Abstract: A sensor module includes: a first substrate; a second substrate; a coupling portion that electrically couples the first substrate and the second substrate; a first sensor device provided on the first substrate and configured to detect a physical quantity of a first axis; a second sensor device provided on the first substrate, configured to detect the physical quantity of the first axis, and having a drive frequency different from that of the first sensor device; a third sensor device provided on the second substrate and configured to detect a physical quantity of a second axis; and a fourth sensor device provided on the second substrate and configured to detect the physical quantity of the second axis.
    Type: Application
    Filed: December 3, 2024
    Publication date: June 12, 2025
    Inventors: Taketo CHINO, Masayasu SAKUMA
  • Publication number: 20250076335
    Abstract: A sensor module includes: a substrate having a first surface and a second surface that are in a front-back relationship with each other, and side surfaces including a first side surface; a first relay substrate having a first front surface and a first back surface and mounted on the first side surface with the first back surface facing the first side surface, the first front surface and the first back surface being in a front-back relationship with each other; and a first inertial sensor including a first package mounted on the first front surface of the first relay substrate and a first sensor element housed in the first package.
    Type: Application
    Filed: August 30, 2024
    Publication date: March 6, 2025
    Inventor: Masayasu SAKUMA
  • Publication number: 20240393113
    Abstract: An inertial sensor module includes a first inertial sensor that detects a physical quantity of a first axis; a second inertial sensor that detects the physical quantity of the first axis; a first substrate on which the first inertial sensor and the second inertial sensor are mounted; and a second substrate on which the first substrate is mounted and which includes a first terminal electrically coupled to the first inertial sensor via the first substrate and a second terminal electrically coupled to the second inertial sensor via the first substrate.
    Type: Application
    Filed: May 23, 2024
    Publication date: November 28, 2024
    Inventor: Masayasu SAKUMA
  • Publication number: 20240393360
    Abstract: An inertial sensor module includes a first inertial sensor that detects a physical quantity of a first axis, a second inertial sensor that detects the physical quantity of the first axis, a substrate includes a first region in which the first inertial sensor and the second inertial sensor are mounted, a second region surrounding the first region, and a plurality of slits provided between the first region and the second region to surround the first region.
    Type: Application
    Filed: May 24, 2024
    Publication date: November 28, 2024
    Inventor: Masayasu Sakuma
  • Patent number: 12130304
    Abstract: An inertial sensor module includes: a first inertial sensor having a first axis as a detection axis; and a second inertial sensor having the first axis, a second axis, and a third axis as detection axes, in which the first inertial sensor and the second inertial sensor are separated from each other, and detection accuracy of the first inertial sensor is higher than detection accuracy of the second inertial sensor.
    Type: Grant
    Filed: September 12, 2022
    Date of Patent: October 29, 2024
    Assignee: SEIKO EPSON CORPORATION
    Inventor: Masayasu Sakuma
  • Publication number: 20240302191
    Abstract: A sensor device includes a mounting member having fixation surfaces inside, and at least one electronic component directly or indirectly fixed to the fixation surfaces of the mounting member, and the mounting member constitutes a part of a casing for housing the electronic component. Further, the fixation surfaces are perpendicular to each other.
    Type: Application
    Filed: May 16, 2024
    Publication date: September 12, 2024
    Inventors: Masayasu SAKUMA, Yoshihiro KOBAYASHI, Shojiro KITAMURA, Taketo CHINO
  • Patent number: 12031847
    Abstract: A sensor device includes a mounting member having fixation surfaces inside, and at least one electronic component directly or indirectly fixed to the fixation surfaces of the mounting member, and the mounting member constitutes a part of a casing for housing the electronic component. Further, the fixation surfaces are perpendicular to each other.
    Type: Grant
    Filed: April 26, 2023
    Date of Patent: July 9, 2024
    Assignee: SEIKO EPSON CORPORATION
    Inventors: Masayasu Sakuma, Yoshihiro Kobayashi, Shojiro Kitamura, Taketo Chino
  • Patent number: 12000857
    Abstract: A sensor module includes: a substrate including a first terminal and a second terminal; a first conductive bonding member having a first melting point and a first Young's modulus; a lead bonded to the first terminal by the first conductive bonding member; a second conductive bonding member having a second melting point lower than the first melting point and a second Young's modulus higher than the first Young's modulus; and an inertial sensor bonded to the second terminal by the second conductive bonding member.
    Type: Grant
    Filed: February 22, 2022
    Date of Patent: June 4, 2024
    Assignee: SEIKO EPSON CORPORATION
    Inventor: Masayasu Sakuma
  • Patent number: 11906538
    Abstract: A sensor module includes: a printed circuit board having a first recessed portion formed at a first side, a second recessed portion formed at a second side facing the first side, a third recessed portion formed at a third side, and a fourth recessed portion formed at a fourth side facing the third side; a metal cap including convex portions each bonded to a respective one of the first to fourth recessed portions; and a first inertial sensor and a second inertial sensor that are provided at a main surface of the printed circuit board. The first inertial sensor and the second inertial sensor are disposed outside a region surrounded by a line connecting both ends of the first recessed portion and the second recessed portion and outside a region surrounded by a line connecting both ends of the third recessed portion and the fourth recessed portion.
    Type: Grant
    Filed: January 18, 2022
    Date of Patent: February 20, 2024
    Assignee: SEIKO EPSON CORPORATION
    Inventor: Masayasu Sakuma
  • Publication number: 20230258481
    Abstract: A sensor device includes a mounting member having fixation surfaces inside, and at least one electronic component directly or indirectly fixed to the fixation surfaces of the mounting member, and the mounting member constitutes a part of a casing for housing the electronic component. Further, the fixation surfaces are perpendicular to each other.
    Type: Application
    Filed: April 26, 2023
    Publication date: August 17, 2023
    Inventors: Masayasu SAKUMA, Yoshihiro KOBAYASHI, Shojiro KITAMURA, Taketo CHINO
  • Patent number: 11709177
    Abstract: An inertial measurement unit includes a sensor module including at least one inertial sensor and a printed substrate on which the inertia sensor is provided, and a lead group provided as a support member for supporting the printed substrate on an attachment surface, and leads of the lead group each have a first section coupled to the attachment surface, a second section extending from the first section toward the printed substrate in a direction that intersects the attachment surface, and a third section coupled to the printed substrate.
    Type: Grant
    Filed: October 27, 2020
    Date of Patent: July 25, 2023
    Inventor: Masayasu Sakuma
  • Patent number: 11709079
    Abstract: A sensor device includes a mounting member having fixation surfaces inside, and at least one electronic component directly or indirectly fixed to the fixation surfaces of the mounting member, and the mounting member constitutes a part of a casing for housing the electronic component. Further, the fixation surfaces are perpendicular to each other.
    Type: Grant
    Filed: August 6, 2021
    Date of Patent: July 25, 2023
    Inventors: Masayasu Sakuma, Yoshihiro Kobayashi, Shojiro Kitamura, Taketo Chino
  • Publication number: 20230194563
    Abstract: An inertial measurement device includes: a first inertial sensor; a first inertial sensor module in which the first inertial sensor is stored in a first package made of resin; a base having a concave portion and made of ceramic; and a lid body. The first inertial sensor module is accommodated in an accommodation space between the base and the lid body and is hermetically sealed.
    Type: Application
    Filed: December 20, 2022
    Publication date: June 22, 2023
    Inventors: Toru Watanabe, Masayasu Sakuma, Hiroki Matsuoka
  • Publication number: 20230078589
    Abstract: An inertial sensor module includes: a first inertial sensor having a first axis as a detection axis; and a second inertial sensor having the first axis, a second axis, and a third axis as detection axes, in which the first inertial sensor and the second inertial sensor are separated from each other, and detection accuracy of the first inertial sensor is higher than detection accuracy of the second inertial sensor.
    Type: Application
    Filed: September 12, 2022
    Publication date: March 16, 2023
    Inventor: Masayasu Sakuma
  • Publication number: 20220268806
    Abstract: A sensor module includes: a substrate including a first terminal and a second terminal; a first conductive bonding member having a first melting point and a first Young's modulus; a lead bonded to the first terminal by the first conductive bonding member; a second conductive bonding member having a second melting point lower than the first melting point and a second Young's modulus higher than the first Young's modulus; and an inertial sensor bonded to the second terminal by the second conductive bonding member.
    Type: Application
    Filed: February 22, 2022
    Publication date: August 25, 2022
    Inventor: Masayasu Sakuma
  • Publication number: 20220229085
    Abstract: A sensor module includes: a printed circuit board having a first recessed portion formed at a first side, a second recessed portion formed at a second side facing the first side, a third recessed portion formed at a third side, and a fourth recessed portion formed at a fourth side facing the third side; a metal cap including convex portions each bonded to a respective one of the first to fourth recessed portions; and a first inertial sensor and a second inertial sensor that are provided at a main surface of the printed circuit board. The first inertial sensor and the second inertial sensor are disposed outside a region surrounded by a line connecting both ends of the first recessed portion and the second recessed portion and outside a region surrounded by a line connecting both ends of the third recessed portion and the fourth recessed portion.
    Type: Application
    Filed: January 18, 2022
    Publication date: July 21, 2022
    Inventor: Masayasu Sakuma
  • Publication number: 20220099698
    Abstract: An inertial measurement unit includes: a substrate including a first surface and a second surface orthogonal to a Z-axis and having a front-back relationship with each other; an inertial sensor installed at the first surface of the substrate; a semiconductor device installed at the second surface of the substrate and electrically coupled to the inertial sensor; and a plurality of lead terminals coupled to the substrate and configured to support the substrate to a mounting target surface. The plurality of lead terminals have a first part coupled to the substrate, a second part mounted at the mounting target surface, and a third part located between the first part and the second part and extending in a direction having a component along the Z-axis. The semiconductor device is exposed from between the plurality of lead terminals, as viewed in a plan view from a direction orthogonal to the Z-axis.
    Type: Application
    Filed: September 22, 2021
    Publication date: March 31, 2022
    Inventors: Masayasu Sakuma, Shinji Nishio
  • Patent number: 11215484
    Abstract: A sensor device includes a mounting member having fixation surfaces inside, and at least one electronic component directly or indirectly fixed to the fixation surfaces of the mounting member, and the mounting member constitutes a part of a casing for housing the electronic component. Further, the fixation surfaces are perpendicular to each other.
    Type: Grant
    Filed: January 15, 2020
    Date of Patent: January 4, 2022
    Inventors: Masayasu Sakuma, Yoshihiro Kobayashi, Shojiro Kitamura, Taketo Chino
  • Publication number: 20210364330
    Abstract: A sensor device includes a mounting member having fixation surfaces inside, and at least one electronic component directly or indirectly fixed to the fixation surfaces of the mounting member, and the mounting member constitutes a part of a casing for housing the electronic component. Further, the fixation surfaces are perpendicular to each other.
    Type: Application
    Filed: August 6, 2021
    Publication date: November 25, 2021
    Inventors: Masayasu SAKUMA, Yoshihiro KOBAYASHI, Shojiro KITAMURA, Taketo CHINO
  • Patent number: 11041723
    Abstract: A sensor unit with high reliability and stable detection accuracy against vibrations of an installation target object is to be provided. A sensor unit includes: a sensor module configured including a substrate with inertial sensors mounted thereon, and an inner case in which the substrate is installed; and an outer case accommodating the sensor module. A recessed part is formed in the inner case. The inertial sensors are arranged in an area overlapping with the recessed part as viewed in a plan view seen from the direction of thickness of the substrate, and a filling member is provided to fill a space formed by the substrate and the recessed part. The sensor module is joined to a bottom wall of the outer case via a joining member.
    Type: Grant
    Filed: December 30, 2019
    Date of Patent: June 22, 2021
    Inventors: Yusuke Kinoshita, Masayasu Sakuma