Abstract: The present invention is drawn to an electronic component in the form of a packaged semiconductor device or the like, and an electronic apparatus using the same, in which protrusions having a semicircular cross section are formed along the sides of the lower surface of the package, leads of the component include a first curved portion conformed to the contour of a protrusion, a second curved portion conformed to the lower surface of the first curved portion and a linking portion coupling the first and second curved portions. The leads project from the side of the package, and the lower surface of the second curved portion is soldered to the wiring pattern on a printed circuit board. With this structure, if the electronic component becomes defective, the package can be lifted from the surface of the printed circuit board by stretching the external leads, and the solder can be removed very easily.