Abstract: Modified polyolefin particles are obtained by grafting a monomer having an ethylenically unsaturated group and a polar functional group in the same molecule to a polymer including one, or two or more specific ?-olefins and having a specific melting point, the modified polyolefin particles satisfying the following requirements (1) to (3): (1) the amount of grafting x by the monomer is not less than 0.5 wt % and not more than 20 wt %; (2) the x (wt %) and the intrinsic viscosity [?] (dl/g) measured in decalin at 135° C. satisfy the relation: log10[?]?0.1?0.15x; and (3) the particles have a gel content of less than 1 wt %.

Abstract: An object of the invention is to provide modified polyolefin particles which have a satisfactory amount of grafting and a sufficient molecular weight, are substantially free from gels, and exhibit excellent handleability and workability when shaped or mixed with various resins. The particles include a modified polyolefin obtained by grafting a monomer having an ethylenically unsaturated group and a polar functional group in the same molecule to a polymer including one, or two or more ?-olefins selected from C2-18 ?-olefins and having a melting point of not less than 50° C. and less than 250° C., the modified polyolefin particles satisfying the following requirements (1) to (3): (1) the amount of grafting x by the monomer having an ethylenically unsaturated group and a polar functional group in the same molecule is not less than 0.5 wt % and not more than 20 wt %; (2) the amount of grafting x (wt %) and the intrinsic viscosity [i](dl/g) measured in decalin at 135° C. satisfy the relation: log10[?]?0.1?0.

Abstract: A pawl of a locking lever is inserted into an opening formed in a display to lock the display in a storage position. A slide lever is connected to a brake portion mounted to a rotating shaft of the display, and is moved to brake the display in a use position. A sector gear includes a first rib that engages the locking lever, and a second rib that engages the slide lever. The sector gear is pivoted between a lock position where the sector gear engages the locking lever to lock the display in the storage position, and a braking position where the sector gear engages the slide lever to brake the display in the use position.

Abstract: A receptacle that can detect the insertion and extraction of a plug includes: a receptacle shell having formed therein a plug insertion port into which the plug is inserted and from which the plug is extracted; a receptacle body provided inside the receptacle shell; a movable contact that is installed at a base portion of the receptacle body, the base portion faces a distal end of the plug inserted into the plug insertion port, and that is deformed elastically when pushed by the plug; and an immovable contact that is installed at the base portion, is normally spaced from the movable contact, and comes into contact with the movable contact when the movable contact is pushed by the plug and elastically deformed. The receptacle that can conform to the HDMI standard can be realized without adding any modification to main components relating to mating with a plug.

Abstract: The present invention provides a connector able to be made thin so as to satisfy the needs of making an electronic device further light in weight, thin, short and compact. Therefore, the connector has a connector main body having a housing for storing a contactor and having an opening portion, and an actuator rotatably supported with respect to the connector main body. A flexible cable inserted into the opening portion and the contactor come in press contact with each other by the actuator and are electrically connected to each other in the rotation of the actuator. A metallic cover for covering a portion of the housing and having a receiving portion is arranged in the connector main body. When the actuator makes the flexible cable inserted into the opening portion come in press contact with the contactor, the receiving portion receives reaction force of the press contact. Thus, the thin type connector can be provided.

Abstract: A wiring board for a semiconductor package comprises a base substrate having first and second surfaces; a wiring layer consisting of necessary wiring patterns formed on at least one of the first and second surfaces; a plurality of semiconductor element mounting areas formed on the surface of the base substrate on which the wiring layer is formed; and individual patterns as position information provided for the respective semiconductor element mounting areas, the individual patterns having a particular shape for the respective semiconductor element mounting area. The individual patterns as position information are formed on peripheral regions of the respective semiconductor element mounting areas.

Abstract: A method for producing a wiring board for a semiconductor package having a base substrate with first and second surfaces; a wiring layer including wiring patterns formed on at least one of the first and second surfaces; a plurality of semiconductor element mounting areas formed on the surface of the base substrate on which the wiring layer is formed; and individual patterns as position information formed for the respective semiconductor element mounting areas, the individual patterns having a different shape for each of the respective semiconductor element mounting areas. The individual patterns as position information are formed on peripheral regions of the respective semiconductor element mounting areas.

Abstract: The present invention provides a connector able to be made thin so as to satisfy the needs of making an electronic device further light in weight, thin, short and compact. Therefore, the connector has a connector main body having a housing for storing a contactor and having an opening portion, and an actuator rotatably supported with respect to the connector main body. A flexible cable inserted into the opening portion and the contactor come in press contact with each other by the actuator and are electrically connected to each other in the rotation of the actuator. A metallic cover for covering a portion of the housing and having a receiving portion is arranged in the connector main body. When the actuator makes the flexible cable inserted into the opening portion come in press contact with the contactor, the receiving portion receives reaction force of the press contact. Thus, the thin type connector can be provided.

Abstract: An insulating substrate has a plurality of semiconductor chip mounting sections arranged one by one along a predetermined direction extending from one to the other end of the substrate, and a resin transmitting port. The resin transmitting port is located at a position in the vicinity of the one end along the predetermined direction and other than the semiconductor chip mounting section arranged nearest to the one end. A semiconductor chip is mounted on a respective semiconductor chip mounting section. A mold defines a cavity, including first and second cavity sections on the respective surfaces of the substrate, in such a manner that the first and second cavities communicates with each other by means of the resin transmitting port. A sealing resin is rejected into the cavity, so that the resin flows through the resin transmitting port to fill both of the first and second cavity sections with the sealing resin.

Abstract: A wiring board for a semiconductor package comprises a base substrate having first and second surfaces; a wiring layer consisting of necessary wiring patterns formed on at least one of the first and second surfaces; a plurality of semiconductor element mounting areas formed on the surface of the base substrate on which the wiring layer is formed; and individual patterns as position information provided for the respective semiconductor element mounting areas, the individual patterns having a particular shape for the respective semiconductor element mounting area. The individual patterns as position information are formed on peripheral regions of the respective semiconductor element mounting areas.

Abstract: An operation panel turnabout mechanism for vehicle mount audio equipment is provided which is simple and allows an operation panel to be prevented from being stolen without removing it. A panel supporting member 6 which rotatably supports an operation panel 1 is provided to freely project from a housing and urged in the direction of projection using elasticity of a spring 14. The operation panel 1 is manually made to face backward with the panel supporting member 6 projected from the housing, and the panel supporting member 6 is moved back against elasticity of the spring 14 to allow the operation panel 1 to be installed on the front surface of the housing when the operation panel 1 faces backward.

Abstract: To provide a case body with a front panel that achieves a simplified structure and thus reduction in manufacturing cost, and allows a space in the case body to be effectively used. There is provided a case body with a front panel in which driving means is actuated to thereby cause an attitude of a panel 2 to be successively changed from a first state where the panel 2 is substantially parallel to a front surface of a case body 1, to a second state where the panel 2 substantially horizontally projects forward from the front surface of the case body 1, and to a third state where top and bottom as well as inside and outside of the panel 2 are reversed to the first state, wherein the driving means has a panel driving member 68 pivotably coupled to the panel via a drive shaft 68b, and as the drive shaft 68b moves, the shaft member 3 moves in the groove 4 to pivot the panel 2.

Abstract: An insulating substrate has a plurality of semiconductor chip mounting sections arranged one by one along a predetermined direction extending from one to the other end of the substrate, and a resin transmitting port. The resin transmitting port is located at a position in the vicinity of the one end along the predetermined direction and other than the semiconductor chip mounting section arranged nearest to the one end. A semiconductor chip is mounted on a respective semiconductor chip mounting section. A mold defines a cavity, including first and second cavity sections on the respective surfaces of the substrate, in such a manner that the first and second cavities communicates with each other by means of the resin transmitting port. A sealing resin is injected into the cavity, so that the resin flows through the resin transmitting port to fill both of the first and second cavity sections with the sealing resin.

Abstract: A wiring board for a semiconductor package comprises a base substrate having first and second surfaces; a wiring layer consisting of necessary wiring patterns formed on at least one of the first and second surfaces; a plurality of semiconductor element mounting areas formed on the surface of the base substrate on which the wiring layer is formed; and individual patterns as position information provided for the respective semiconductor element mounting areas, the individual patterns having a particular shape for the respective semiconductor element mounting area. The individual patterns as position information are formed on peripheral regions of the respective semiconductor element mounting areas.

Abstract: To provide a case body with a front panel that achieves a simplified structure and thus reduction in manufacturing cost, and allows a space in the case body to be effectively used. There is provided a case body with a front panel in which driving means is actuated to thereby cause an attitude of a panel 2 to be successively changed from a first state where the panel 2 is substantially parallel to a front surface of a case body 1, to a second state where the panel 2 substantially horizontally projects forward from the front surface of the case body 1, and to a third state where top and bottom as well as inside and outside of the panel 2 are reversed to the first state, wherein the driving means has a panel driving member 68 pivotably coupled to the panel via a drive shaft 68b, and as the drive shaft 68b moves, the shaft member 3 moves in the groove 4 to pivot the panel 2.

Abstract: A robbery-proof mechanism for a vehicle mounted electronic apparatus wherein a cover for covering the electronic apparatus is accommodated in the upper space of the electronic apparatus and can be driven by a small scale drive mechanism without moving the electronic apparatus.

Abstract: A vacuum heat insulator is provided which includes a vacuum heat-insulated space defined between a pair of spaced outer skin members, a portion of the space closer to one of the outer skin members being set as high-temperature side, with a portion closer to the other outer skin member being set as low-temperature side. A laminate is disposed at the high-temperature side of the vacuum heat-insulated space, and a board having an inorganic material is disposed at the low temperature side. The laminate includes inorganic sheet members and metallic foils with low heat emissivity, the sheet members and metallic foils being alternately laid in plural layers.

Abstract: A rotary dryer for drying and mixing particulate material, includes a shell having a pair of conical portions and provided with a jacket to which a hot fluid may be fed, the shell defining a chamber for the material to be dried and mixed. An air-tight closure for the chamber is provided with a jacket to which hot fluid may be fed and through which the material is charged and discharged. A rotary tube shaft extends horizontally from one end of the shell and along the horizontal axis of the shell, the rotary tube shaft being sheathed by a rotary joint pipe equipped with a bearing rotatably supporting the rotary tube shaft. The rotary tube shaft is provided with a plurality of communication paths which communicate with charge/discharge ports located on the rotary joint pipe during rotation of the rotary tube shaft in the rotary joint pipe, the communication paths connecting the jackets of the shell and the closure for feeding the hot fluid.

Abstract: An enclosed type lead battery comprises in combination:a cap formed of a synthetic resin, which is integrally formed with anodec and cathodec terminals formed of lead or a lead alloy inserted therein and an exhaust portion to which a safety valve is attached,a plate stack having its ears connected to said terminals, andan enclosure formed of a film or sheet made of a synthetic resin, in which said plate stack is placed, and which is thermally fused at the peripheral edge of its opening to said cap.

Abstract: A transfer molding machine for filling at least one cavity of a mold with a resin by means of a plunger including a resin pressure sensor for sensing the resin pressure in the mold, and a control device for controlling the pressure applied to the plunger to drive same in such a manner that an arbitrarily selected primary pressure higher than a holding pressure is applied to the plunger to drive same until the pressure of the resin charged into the mold which pressure is detected by the resin pressure sensor in the mold reaches a predetermined pressure level and a secondary pressure corresponding to the holding pressure is applied to the plunger to drive same after the predetermined pressure level has been exceeded by the pressure of the resin being charged into the mold sensed by the resin pressure sensor in the mold, and a warning device that issues a warning when the pressure applied to the plunger to drive has exceeded a predetermined pressure.