Abstract: Provided are a Ni-based superalloy for stably obtaining high tensile strength and a method for manufacturing the same. Provided are: a Ni-based superalloy having a composition comprising, in mass %, C: up to 0.10%, Si: up to 0.5%, Mn: up to 0.5%, P: up to 0.05%, S: up to 0.050%, Fe: up to 45%, Cr: 14.0 to 22.0%, Co: up to 18.0%, Mo: up to 8.0%, W: up to 5.0%, Al: 0.10 to 2.80%, Ti: 0.50 to 5.50%, Nb: up to 5.8%, Ta: up to 2.0%, V: up to 1.0%, B: up to 0.030%, Zr: up to 0.10%, Mg: up to 0.005%, and the balance of Ni with inevitable impurities, and has a grain orientation spread (GOS) of at least 0.7° as an intragranular misorientation parameter measured by an SEM-EBSD technique; and a method for manufacturing the same.

Abstract: Provided are a Ni-based alloy for a hot die having high high-temperature compressive strength, oxidation resistance, and tensile strength and capable of yielding high productivity or long die service life, and a hot forging die using the Ni-based alloy for hot die. A Ni-based alloy for hot die comprising, in mass %, W: 12.0 to 16.0%, Mo: 1.0 to 5.0%, Al: 5.0 to 7.5%, Cr: 0.5 to 5.0%, Ta: 0.5 to 7.0%, Ti: 0.1 to 3.5%, C: 0.01 to 0.25%, N: 0.0005 to 0.01%, B: 0.05% or less, S: 0.015% or less, one or two or more elements selected from rare earth elements, Y, Ca, and Mg: 0 to 0.020% in total, one or two elements selected from Zr and Hf: 1.5% or less in total, Nb: 3.5% or less, Co: 15.0% or less, the balance being Ni and inevitable impurities, wherein C and N satisfy the following relational expression 1: C/100?N?C, wherein C and N in the expression mean mass % of each component content.

Abstract: Provided are a Ni-based superalloy for stably obtaining high tensile strength and a method for manufacturing the same. Provided are: a Ni-based superalloy having a composition comprising, in mass %, C: up to 0.10%, Si: up to 0.5%, Mn: up to 0.5%, P: up to 0.05%, S: up to 0.050%, Fe: up to 45%, Cr: 14.0 to 22.0%, Co: up to 18.0%, Mo: up to 8.0%, W: up to 5.0%, Al: 0.10 to 2.80%, Ti: 0.50 to 5.50%, Nb: up to 5.8%, Ta: up to 2.0%, V: up to 1.0%, B: up to 0.030%, Zr: up to 0.10%, Mg: up to 0.005%, and the balance of Ni with inevitable impurities, and has a grain orientation spread (GOS) of at least 0.7° as an intragranular misorientation parameter measured by an SEM-EBSD technique; and a method for manufacturing the same.

Abstract: There is provided a manufacturing method including: forming a molded body element with a molding material containing a ceramic powder and a binder; forming a ceramic molded body by disposing at least one molded body element in a mold and then injecting a molding material containing a ceramic powder and a binder into the mold and graft molding a graft molded body element to the molded body element; and forming a ceramic sintered body by degreasing and sintering the ceramic molded body. A graft connecting surface of the molded body element to which the graft molded body element is graft molded is formed so as to have a surface roughness of 2 ?m or more in terms of Ra.

Abstract: There is provided a manufacturing method including: forming a molded body element with a molding material containing a ceramic powder and a binder; forming a ceramic molded body by disposing at least one molded body element in a mold and then injecting a molding material containing a ceramic powder and a binder into the mold and graft molding a graft molded body element to the molded body element; and forming a ceramic sintered body by degreasing and sintering the ceramic molded body. A graft connecting surface of the molded body element to which the graft molded body element is graft molded is formed so as to have a surface roughness of 2 ?m or more in terms of Ra.

Abstract: Disclosed is a Pb-free solder alloy consisting of, in mass %, 0.1-1.5% of Ag, 0.5-0.75% of Cu, Ni in an amount satisfying 12.5?Cu/Ni?100, and the balance of Sn and unavoidable impurities. The solder alloy preferably contains, in mass %, 0.3-1.2% of Ag and 0.01-0.04% of Ni. Also disclosed is a solder ball obtained by spheroidizing the solder alloy. In addition, the solder alloy is suitable for a solder joint onto an Ni electrode. The solder alloy has excellent drop impact resistance, while being suppressed in decrease of joining strength under high temperature conditions for a long time.

Abstract: A solder alloy is provided, which consists of, by mass %: 0.6 to 0.75% of Cu; 0.3 to 1.5% of Ag; more than 0.01% but not more than 0.1% of Ge; and the balance being Sn and incidental impurities. Preferably an amount of Ag is 0.5 to 1 mass % Preferably, an amount of Ge is more than 0.01 mass % but not more than 0.06 mass %. The solder alloy is preferably spherically formed into a solder ball. A solder joint in which the solder alloy is joined to a Ni electrode is also provided.

Abstract: A solder ball having a diameter of 1.2 mm or less, a dispersion of a diameter distribution of 5% or less and sphericity of 0.95 or more, an area ratio of the maximum dendrite being 80% or less of a cross section including a center of the solder ball, comprises a first additional element of 0.5-8 mass % of Ag and/or 0.1-3 mass % of Cu, and 0.006-10 mass %, in total, of at least one second additional element selected from the group consisting of Bi, Ge, Ni, P, Mn, Au, Pd, Pt, S, In and Sb, the balance being substantially Sn. The solder ball is produced by a uniform droplet-spraying method comprising the steps of vibrating a melt of a solder alloy in a crucible under pressure to force the melt to drop through orifices of the crucible; permitting the melt dropping through the orifices to become spherical droplets in a non-oxidizing gas atmosphere; and rapidly solidifying them.

Abstract: A solder ball having a diameter of 1.2 mm or less, a dispersion of a diameter distribution of 5% or less and sphericity of 0.95 or more, an area ratio of the maximum dendrite being 80% or less of a cross section including a center of the solder ball, comprises a first additional element of 0.5-8 mass% of Ag and/or 0.1-3 mass % of Cu, and 0.006-10 mass %, in total, of at least one second additional element selected from the group consisting of Bi, Ge, Ni, P, Mn, Au, Pd, Pt, S, In and Sb, the balance being substantially Sn. The solder ball is produced by a uniform droplet-spraying method comprising the steps of vibrating a melt of a solder alloy in a crucible under pressure to force the melt to drop through orifices of the crucible; permitting the melt dropping through the orifices to become spherical droplets in a non-oxidizing gas atmosphere; and rapidly solidifying them.