Abstract: An epoxy resin represented by general formula (I) satisfying numerical formula (1) with hydrolytic halogen of 0.05 wt. % or less, said epoxy resin produced as follows: after dissolving 0.8 to 1.3 mole of epihalohydrin to 1 mole of divalent phenol in a solvent, a pre-reaction is performed over 30 to 70 minutes by adding dropwise 0.25-0.35 mole of 30˜50% aqueous solution of alkali metal hydroxide over 30 to 70 minutes thereto, and thereafter, 0.65-0.75 mole of the remaining 30˜50% aqueous solution of alkali metal hydroxide is added dropwise over about 1 hour to complete the reaction over 1 to 3 hours. 0.5?X/Y?1.

Abstract: An epoxy resin represented by general formula (I), which satisfies numerical formula (1) mentioned below and comprises hydrolytic halogen of 0.05 wt. % or less, said epoxy resin being produced by the procedure as follows: after dissolving 0.8 to 1.3 mole of epihalohydrin to 1 mole of divalent phenol in a solvent, a pre-reaction is performed over 30 to 70 minutes by adding dropwise 0.25-0.35 mole of 30˜50% aqueous solution of alkali metal hydroxide over 30 to 70 minutes thereto, and thereafter, 0.65-0.75 mole of the remaining 30˜50% aqueous solution of alkali metal hydroxide is added dropwise over about 1 hour to complete the reaction over 1 to 3 hours. wherein n is an integer of 0 or more; A1 and A2 are residue of divalent phenol, and can be same or different; both R1 and R2 are H or wherein, X: epoxy equivalent (g/eq); Y: phenolic hydroxyl group equivalent (g/eq).

Abstract: Epoxy resin represented by general formula (I), wherein n is an integer of 0 or more, A1 and A2 are residue of divalent phenol, and A1 and A2 can be same or can be different and both R1 and R2 are H or which is synthesized from divalent phenol and epihalohydrine, and satisfies numerical formula (1), 0.3?X/Y?2.0??formula (1) wherein, X; epoxy equivalent (g/eq) Y; phenolic hydroxyl group equivalent (g/eq) further, amount of hydrolytic halogen is 0.05 wt. % or less.

Abstract: A modified phenolic hydroxyl-containing resin having a low free difunctional phenol content and represented by general formula (1); a solid epoxy resin having an epoxy equivalent of 450 to 2,500 g/eq and prepared by epoxidizing the above resin; and another solid epoxy resin having an epoxy equivalent of 1,500 to 60,000 g/eq and a number-average molecular weight of 3,000 to 15,000 and prepared by reacting the above epoxy resin with a difunctional phenol compound. Resin compositions containing these resins have many applications as powder coatings and can paints. In formula (1), X represents a residue of a difunctional phenol compounds; X's may be the same or different; and n is the number of repeating units and is an integer of 0 or above.

Abstract: A modified phenolic hydroxyl-containing resin having a low free difunctional phenol content and represented by general formula (1); a solid epoxy resin having an epoxy equivalent of 450 to 2,500 g/eq and prepared by epoxidizing the above resin; and another solid epoxy resin having an epoxy equivalent of 1,500 to 60,000 g/eq and a number-average molecular weight of 3,000 to 15,000 and prepared by reacting the above epoxy resin with a difunctional phenol compound. Resin compositions containing these resins have many applications as powder coatings and can paints. In formula (1), X represents a residue of a difunctional phenol compounds; X's may be the same or different; and n is the number of repeating units and is an integer of 0 or above.