Abstract: An information processing device which allocates items to UI components included in an order receiving terminal, includes a first display unit configured to display a list of the items on a display device and a second display unit configured to display, on the display device, an allocation screen including component images corresponding to each UI component included in the order receiving terminal. The device further comprises an allocation unit configured to allocate a selected item from the list to one of the component images designated as the allocation destination of the item, a generation unit configured to generate allocation information including the selected item and the UI component corresponding to the component image to which the selected item is allocated, and a provision unit configured to provide the allocation information generated by the generation unit to the order receiving terminal.

Abstract: A controller of a commodity sales data processing apparatus outputs, in response to closing operation for one transaction or bill exchange operation for instructing bill exchange, an opening command to a cash storing unit, which can be freely opened and closed to store cash and opens according to the opening command, to open the cash storing unit. The controller prohibits the opening of the cash storing unit when the bill exchange operation in the operation input unit is performed regardless of a state in which the one transaction is suspended.

Abstract: The present invention provides a method of forming a coating film on an aluminum substrate, comprising the steps of: (1) coating an aluminum substrate with a thermosetting polyester resin lustrous powder base coating composition (a) containing a lustrous material, and baking the resulting base coat layer; and (2) coating the base coat layer with a thermosetting acrylic resin clear powder coating composition (b), and baking the resulting clear coat layer to obtain a lustrous multilayer coating film.

Abstract: A method of manufacturing an optical semiconductor device includes preparing an optical semiconductor provided on a distal end of a first lead portion of a lead frame and connected electrically with a distal end of a second lead portion of the lead frame, forming thermoplastic resin for preparing a package molding jig having a concave portion corresponding to a contour of a package of the optical semiconductor device, inserting the distal ends of the lead portions into the concave portion of the package molding jig for positioning and fixing, and filling packaging resin in the concave portion of the package molding jig.

Abstract: The present invention provides a method of forming a coating film on an aluminum substrate, comprising the steps of: (1) coating an aluminum substrate with a thermosetting polyester resin lustrous powder base coating composition (a) containing a lustrous material, and baking the resulting base coat layer; and (2) coating the base coat layer with a thermosetting acrylic resin clear powder coating composition (b), and baking the resulting clear coat layer to obtain a lustrous multilayer coating film.

Abstract: The present invention provides a powder paint excellent in productivity and cost, because the powder paints that are not adhered to the substrate can recovered and reused. And in case of using the powder paint of the present invention, coating efficiency is high and fine textured coated films excellent in attractiveness of appearance and water resistance can be obtained, because the base paint powder and the pigment particle thereof hardly separate. The powder paints of the present invention are characterized in that the pigment particles are bound to the base paint powders via shellac. The powder paints of the present invention not only allows uniform and firm binding of pigment particles to base paint powders by the action of shellac, but also provides the resulting coated films with excellent attractiveness of appearance.

Abstract: A method of manufacturing an optical semiconductor device includes preparing an optical semiconductor provided on a distal end of a first lead portion of a lead frame and connected electrically with a distal end of a second lead portion of the lead frame, forming thermoplastic resin for preparing a package molding jig having a concave portion corresponding to a contour of a package of the optical semiconductor device, inserting the distal ends of the lead portions into the concave portion of the package molding jig for positioning and fixing, and filling packaging resin in the concave portion of the package molding jig.