Patents by Inventor Masayoshi Hashimoto

Masayoshi Hashimoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120224339
    Abstract: A terminal box for a solar cell module, has terminal boards (10). A bypass diode (30) is connected between corresponding terminal boards (10) and serves as a bypass for a reverse load. A box main body (50) houses the bypass diode (30) and the terminal boards (10) and has an opening (58). A cover (70) is fit to the box main body (50) to cover the opening (58) and has a protrusion (71) on the back surface. An insulating resin (60) is introduced into the box main body (50) before the cover (70) is fit to the box main body (50) and has a recess (61) the surface of which contacts the outer surface of the protrusion (71) after the cover (70) is fit to the box main body (50).
    Type: Application
    Filed: July 29, 2010
    Publication date: September 6, 2012
    Applicant: SUMITOMO WIRING SYSTEMS, LTD.
    Inventors: Hiroyuki Yoshikawa, Masayoshi Hashimoto, Makoto Higashikozono, Tomoya Kawaguchi
  • Publication number: 20120174970
    Abstract: Disclosed is a terminal box for a solar cell module, which has improved heat transfer properties. Specifically, disclosed is a terminal box for a solar cell module with a plurality of terminal boards (60), a case (10) which contains the terminal boards (60) and has an outer periphery (12) that surrounds the peripheries of the terminal boards (60); a bypass diode (80) which is connected to two corresponding terminal boards (60) and serve as a bypass for a reverse load; a radiator plate (60) which supports a rectifying device body (81) that is a heat generating portion of the bypass diode. The radiator plate (60) is being formed integrally with or separately from the terminal board (60); and a bottom (11) arranged between the radiator plate (60) and the solar cell module serves as a heat transferring part that has a higher heat resistance than the outer periphery (12).
    Type: Application
    Filed: July 29, 2010
    Publication date: July 12, 2012
    Applicant: SUMITOMO WIRING SYSTEMS, LTD.
    Inventors: Hiroyuki Yoshikawa, Masayoshi Hashimoto, Makoto Higashikozono, Tomoya Kawaguchi
  • Patent number: 5839367
    Abstract: A stamp pressing device includes: a housing for housing at least two stamps; a selection mechanism for selecting one of the at least two stamps accommodated in the housing; and a pressing mechanism for pressing the selected stamp on a sheet. The housing includes a stamping room disposed opposite to the sheet, a first room provided for a first stamp on one side of the stamping room, and a second room provided for a second stamp on the other. The selection mechanism includes a replace mechanism for replacing one stamp in the stamping room with the other by moving the first and second stamps along an elongate direction in which the stamping room and the first and second rooms are disposed. The pressing mechanism presses the stamp which is placed in the stamping room against the sheet.
    Type: Grant
    Filed: February 12, 1996
    Date of Patent: November 24, 1998
    Assignee: Sharp Kabushiki Kaisha
    Inventor: Masayoshi Hashimoto
  • Patent number: 5598627
    Abstract: A wire harness includes a main circuit part 1 including an insulated conductor wiring circuit plate 3 in which conductors 8 are arranged on a base insulation film 9 to form a wiring circuit by turning, bowing, crossing, or branching the conductors and covered with a flexible insulation film 12. Further, a branched connection part 2 is provided including a printed circuit plate 4 connected to a connecting area 14A in the main circuit part 1 through a connecting area 14B formed thereon and adapted to receive leading electrical wires 5. The conductor wiring circuit plate 30 is a flexible circuit plate which has an insulation base film 33, conductors 31 juxtaposed on the base film, an upper coverlet film 32, and a connecting area 36 for the conductors 31 having an adhesive layer 37 on the back side of the film 32. The connecting area 36 is formed by removing a predetermined width 38 of the base film 33 along the lateral direction of the coverlet film 32.
    Type: Grant
    Filed: June 6, 1995
    Date of Patent: February 4, 1997
    Assignee: Sumitomo Wiring Systems, Ltd.
    Inventors: Kazuhito Saka, Masayoshi Hashimoto, Kou Furuta, Takahiro Okamura
  • Patent number: 5479701
    Abstract: A cover at an end portion of a covered wire is incised by upper and lower cutting blades. The covered wire and the cutting blades are moved relatively in the longitudinal direction of the covered wire to thereby start the cover stripping operation at an end portion of the cover on the core. Thereafter, during this relative movement, the depth of incising the cover by the cutting blades is reduced step by step within a range where blade portions of the cutting blades can catch the cover. Even in the case where the cover of a covered wire is thin, it is made possible not only to strip the cover surely, but also to prevent a core from being injured.
    Type: Grant
    Filed: May 20, 1994
    Date of Patent: January 2, 1996
    Assignee: Sumitomo Wiring Systems, Ltd.
    Inventors: Yoshiaki Yamano, Masayoshi Hashimoto, Hiroji Kodera
  • Patent number: 5374778
    Abstract: Insulatedly coated wires (10) each coated with a metal foil of good electric conductivity and a metal foil of high magnetic permeability to form an electrostatic shielding layer (20) and a magnetic shielding layer (30), are bundled and are connected at their opposite ends to connectors. Each wire is adapted to be shielded with the metal foils in place of the conventional braided tube, thereby providing an easy-to-manufacture wire harness having good shielding effects adjacent the connectors.
    Type: Grant
    Filed: October 19, 1993
    Date of Patent: December 20, 1994
    Assignee: Sumitomo Wiring Systems, Ltd.
    Inventors: Masayoshi Hashimoto, Yoshiaki Yamano, Kenji Mizutani