Abstract: A dissimilar material solid phase bonding method is disclosed wherein one member and another member having different compositions are brought into contact with one another by way of an insert material to form an interface (1) to be bonded, at which the one member and the insert material are in contact with one another, and an interface (2) to be bonded, at which the other member and the insert material are in contact with one another; the temperature of the interface (1) to be bonded and the interface (2) to be bonded is raised by means of frictional heat and/or by electrical heating; a bonding pressure (1) is applied substantially perpendicular to the interface (1) to be bonded; a bonding pressure (2) is applied substantially perpendicular to the interface (2) to be bonded; and the bonding pressure (1) and the bonding pressure (2) are set to different values.

Abstract: To provide a solid phase welding method and a solid phase welding apparatus which are possible to accurately control the welding temperature, to lower the welding temperature and to achieve a solid phase welding of the metallic materials. The present invention provides a solid phase welding method for metallic materials comprising, a first step of forming an interface to be welded by abutting end portions of one material to be welded and the other material to be welded and applying a pressure in a direction substantially perpendicular to the interface to be welded, a second step of raising a temperature of the vicinity of the interface to be welded to a welding temperature by an external heating means, wherein the pressure is set to equal to or more than the yield strength of the one material to be welded and/or the other material to be welded at the welding temperature.

Abstract: The present invention provides: a solid-phase spot-welding method with which the welding temperature can be controlled accurately and with which a reduction in the welding temperature can be achieved, regardless of the type of metal material being welded; and a solid-phase spot-welding device that can be used suitably in this solid-phase spot-welding method.

Abstract: A dissimilar material solid phase bonding method is disclosed wherein one member and another member having different compositions are brought into contact with one another by way of an insert material to form an interface (1) to be bonded, at which the one member and the insert material are in contact with one another, and an interface (2) to be bonded, at which the other member and the insert material are in contact with one another; the temperature of the interface (1) to be bonded and the interface (2) to be bonded is raised by means of frictional heat and/or by electrical heating; a bonding pressure (1) is applied substantially perpendicular to the interface (1) to be bonded; a bonding pressure (2) is applied substantially perpendicular to the interface (2) to be bonded; and the bonding pressure (1) and the bonding pressure (2) are set to different values.

Abstract: To provide a solid phase welding method and a solid phase welding apparatus which are possible to accurately control the welding temperature, to lower the welding temperature and to achieve a solid phase welding of the metallic materials. The present invention provides a solid phase welding method for metallic materials comprising, a first step of forming an interface to be welded by abutting end portions of one material to be welded and the other material to be welded and applying a pressure in a direction substantially perpendicular to the interface to be welded, a second step of raising a temperature of the vicinity of the interface to be welded to a welding temperature by an external heating means, wherein the pressure is set to equal to or more than the yield strength of the one material to be welded and/or the other material to be welded at the welding temperature.

Abstract: A high frequency power supplying device and a plasma generation device using the same includes: two or more inductive antennas; high frequency power sources, respectively supplying power to the antennas; and a vacuum chamber on which the antennas are provided so as to generate a plasma by inductive coupling with high frequency power, wherein each of the high frequency power sources is positioned close to a corresponding antenna. On this account, it is possible to reduce unevenness in high frequency voltages generated in the antennas. Thus, even when a diameter and a volume of the plasma generation section are made larger, it is possible to generate much more uniform plasma, thereby stabilizing (i) thin film formation processes based on the plasma and (ii) plasma ion implantation processes.

Abstract: A high frequency power supplying device and a plasma generation device using the same includes: two or more inductive antennas; high frequency power sources, respectively supplying power to the antennas; and a vacuum chamber on which the antennas are provided so as to generate a plasma by inductive coupling with high frequency power, wherein each of the high frequency power sources is positioned close to a corresponding antenna. On this account, it is possible to reduce unevenness in high frequency voltages generated in the antennas. Thus, even when a diameter and a volume of the plasma generation section are made larger, it is possible to generate much more uniform plasma, thereby stabilizing (i) thin film formation processes based on the plasma and (ii) plasma ion implantation processes.