Patents by Inventor Masayoshi Kanamaru

Masayoshi Kanamaru has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210262655
    Abstract: A supply-water warming system includes a steam compression heat pump circuit, a heat recovery heat exchanger, a heat source fluid line in which heat source fluid flows in the heat recovery heat exchanger and the evaporator in this order, a water supply line in which supply water flows in the heat recovery heat exchanger and the condenser in this order, a refrigerant flow rate adjustment section controlled based on the superheat degree of gas refrigerant flowing into the compressor and configured to adjust a refrigerant flow rate, a supply water flow rate adjustment section controlled based on the tapping temperature of the supply water flowing out of the condenser and configured to adjust a supply water flow rate, and a control section configured to control the refrigerant flow rate adjustment section and the supply water flow rate adjustment section.
    Type: Application
    Filed: December 14, 2020
    Publication date: August 26, 2021
    Applicant: MIURA CO., LTD.
    Inventors: Kazuma ISA, Satoru OSHITA, Kazuyuki OTANI, Tomoya OZAWA, Masayoshi KANAMARU
  • Publication number: 20140013786
    Abstract: There is provided an efficient steam generation system capable of reducing a temperature difference in heat to be drawn by a heat pump. A first heat pump (2) includes a first evaporator (7) and a second evaporator (8). A second heat pump (3) is connected to the first heat pump (2) via an uppermost condenser (10) serving as the first evaporator (7). A heat source fluid is passed through a second evaporator (8) of the first heat pump (2) and an evaporator (12) of the second heat pump (3) in sequence. Then, steam is generated by application of heat to water in a condenser (5) of the first heat pump (2).
    Type: Application
    Filed: October 26, 2011
    Publication date: January 16, 2014
    Inventors: Masayoshi Kanamaru, Akinori Kawakami, Mika Tasaka, Akio Morita