Abstract: An elastic surface wave element including first and a second two-port surface acoustic wave filters and a one-port elastic surface acoustic wave resonator filter with a single inter-digital transducer is connected via bumps to electrodes formed on a housing by face down bonding techniques. The housing has an opening section in a ground terminal electrode in a part facing the one-port elastic surface acoustic wave resonator filter.

Abstract: In an elastic surface wave device according to this invention, an elastic surface wave element including a first and a second two-port surface acoustic wave filter and a one-port surface acoustic wave filter with a single inter-digital transducer is connected via bumps to electrodes formed on a housing by face down bonding techniques. The housing has an opening section for a ground terminal electrode in a part facing the one-port surface acoustic wave filter.

Abstract: A surface acoustic wave apparatus includes a package having a concave-shaped base and a concave-shaped cap and a surface acoustic wave element housed in the package. The base has a mounting surface on which the surface acoustic wave element is mounted and a side wall raised from the periphery of the mounting surface. The side wall of the base is formed lower than the highest part of the surface acoustic wave element mounted on the mounting surface. Since the surface acoustic wave element mounted on the base is raised above the side wall of the base, the surface acoustic wave element is subjected easily to, for example, test, measurement, fault analysis, and others.

Abstract: A surface acoustic wave filter element and a method of producing the same. The element is constructed in a manner such that a conductive film, which constitutes a plurality of electrode fingers, a bus bar connecting the electrode fingers in common, an electrode pad connected to the bus bar, etc., is formed on a piezoelectric substrate. When using the surface acoustic wave filter element with this arrangement in a high-frequency band, the thickness of the conductive film and the line width of electrodes are reduced, so that the mechanical strength is a critical problem. According to the present invention, therefore, the conductive film has a two-layer structure, including a layer containing tantalum and aluminum and a metallic layer of aluminum or an alloy consisting mainly of aluminum formed thereon, for example. The composition ratio between tantalum and aluminum is set so that the tantalum content ranges from 39% to 75% (atomic percentage).

Abstract: A thermometer includes an infrared sensor (14) for receiving infrared radiation to generate a corresponding electrical signal; a reference unit (10) for emitting a standard infrared radiation; a temperature sensor (11) for receiving the standard infrared radiation to generate a corresponding standard electrical signal; a support unit (1, 2) for supporting the infrared sensor and the reference means such that the infrared sensor receives the standard infrared radiation from the reference means in a standby state and infrared radiation from a subject in a measurement state; an arithmetic unit (44) for computing a temperature of the subject based on the electrical signals from the infrared sensor in both the standby and measurement states and from the temperature sensor.

Abstract: An acoustic surface wave resonator element has first and second interdigital electrodes consisting of pairs of opposed interleaving comb-shaped electrodes formed on one major surface of a piezoelectric substrate and arrayed along an acoustic wave propagation direction on the piezoelectric substrate, and acoustic surface wave reflectors sandwiching the first and second interdigital electrodes along the acoustic surface wave propagation direction. A base has the resonator element mounted thereon. First and second lead terminals are formed on the base and are electrically connected to the pair comb-shaped electrodes constituting the first interdigital electrode. A third lead terminal is electrically connected to one of the pair comb-shaped electrodes constituting the second interdigital electrode. The distance between the first and third lead terminals is substantially equal to that between the second and third lead terminals.