Abstract: A patterned pressure-sensitive adhesive body obtained by a method for producing a patterned pressure-sensitive adhesive body including a pattern forming step of cutting a pressure-sensitive adhesive layer in a pressure-sensitive adhesive film including a first release film and the pressure-sensitive adhesive layer laminated on one surface of the first release film so as to form a first slit in a pattern shape and an outer frame forming step of cutting the first release film and the pressure-sensitive adhesive layer so as to form a second slit in an outer frame shape surrounding the pattern shape, wherein the second slit has a discontinuous portion in a cutting direction.

Abstract: A method for producing a patterned pressure-sensitive adhesive body includes a pattern forming step of cutting a pressure-sensitive adhesive layer in a pressure-sensitive adhesive film including a first release film and the pressure-sensitive adhesive layer laminated on one surface of the first release film so as to form a first slit in a pattern shape and an outer frame forming step of cutting the first release film and the pressure-sensitive adhesive layer so as to form a second slit in an outer frame shape surrounding the pattern shape. The second slit has a discontinuous portion in a cutting direction.

Abstract: A method for producing a patterned pressure-sensitive adhesive body includes a pattern forming step of cutting a pressure-sensitive adhesive layer in a pressure-sensitive adhesive film including a first release film and the pressure-sensitive adhesive layer laminated on one surface of the first release film so as to form a first slit in a pattern shape and an outer frame forming step of cutting the first release film and the pressure-sensitive adhesive layer so as to form a second slit in an outer frame shape surrounding the pattern shape. The second slit has a discontinuous portion in a cutting direction.

Abstract: A semiconductor processing sheet contains a base layer having a plastic sheet containing pigment as a core layer, wherein a non-pigment-containing layer is arranged in the outermost layer on front and back main surfaces of the core layer. According to the present invention, in a process for manufacturing semiconductor devices, it is possible to minimize contamination of the inner surface for the film manufacturing die that is due to the pigment contained in the film while maintaining the visibility of the semiconductor processing sheet. Consequently, partial occlusion of the die lip aperture due to pigment contamination is reduced, with the result that effective prevention of the deterioration of the sheet thickness precision due to adhering pigment is possible.

Abstract: Provided is an improved method of joining a protective tape having one object to suppress generation of bending of a semiconductor wafer after a back-grinding process. The protective tape is supplied toward the semiconductor wafer suction-held on a chuck table, and an intermediate sheet is supplied along an upper side of the protective tape. Then, the intermediate sheet is interposed between a joining member and the protective tape along a surface of a base material in the protective tape so as to be movable. Under this state, the joining member and the semiconductor wafer move relative to each other in a horizontal direction, whereby the protective tape is joined to a surface of the semiconductor wafer.

Abstract: The invention provides a method of inflation extrusion molding, comprising: introducing one or more resin materials extruded from one or more extruders into a die; subsequently extruding the resin material(s) from the die and inflating the extrudate into a cylindrical shape having a predetermined diameter by blown-film extrusion; and then passing the cylindrical inflated resin material through a space between stabilizers which face each other at a predetermined angle, to deform the cylindrical resin material into a flat tube shape having an elongated elliptic section, thereby producing a film or sheet having a predetermined width, wherein the deformation of the cylindrical inflated resin material into a flat tube shape having an elongated elliptic section is assisted by a guide device to thereby facilitate the deformation.

Abstract: An adhesive tape inserted into a tape inserting clearance defined between a tape supplying roller and a tape guide is supplied to joining rollers while being wound around the tape supplying roller under guidance. At the tape inserting clearance, one side edge of the adhesive tape is guided to a tape positioner in slide contact, to be positioned in a tape width direction, and further, the adhesive tape T is inserted and moved while allowing the tape to be moved toward the other side edge of the adhesive tape.

Abstract: The invention provides a method of inflation extrusion molding, comprising: introducing one or more resin materials extruded from one or more extruders into a die; subsequently extruding the resin material(s) from the die and inflating the extrudate into a cylindrical shape having a predetermined diameter by blown-film extrusion; and then passing the cylindrical inflated resin material through a space between stabilizers which face each other at a predetermined angle, to deform the cylindrical resin material into a flat tube shape having an elongated elliptic section, thereby producing a film or sheet having a predetermined width, wherein the deformation of the cylindrical inflated resin material into a flat tube shape having an elongated elliptic section is assisted by a guide device to thereby facilitate the deformation.

Abstract: A pressure-sensitive adhesive tape has a supporting substrate made of a plastic film and a pressure-sensitive adhesive layer formed on at least one side of the supporting substrate, an uneven portion having a shape extending in the vertical direction against the longitudinal direction being disposed on one side of the supporting substrate, wherein a maximum stress at an elongation of not more than 50% is larger than a stress at break, and an elongation at break is from 100 to 300%.

Abstract: An adhesive tape inserted into a tape inserting clearance defined between a tape supplying roller and a tape guide is supplied to joining rollers while being wound around the tape supplying roller under guidance. At the tape inserting clearance, one side edge of the adhesive tape is guided to a tape positioner in slide contact, to be positioned in a tape width direction, and further, the adhesive tape T is inserted and moved while allowing the tape to be moved toward the other side edge of the adhesive tape.

Abstract: The present invention provides an adhesive tape containing a substrate and an adhesive layer formed on at least one side of the substrate, wherein the substrate contains an olefin polymer and a flame retardant, but substantially no halogen atom, and the adhesive tape has a thermal deformation at 100° C. of not more than 65%. The present invention also provides a substrate containing an olefin polymer and a flame retardant, but substantially no halogen atom, wherein the olefin polymer contains the following Component A and Component B: Component A: a thermoplastic resin having a carbonyl oxygen atom in the molecular skeleton Component B: a polymer alloy containing an ethylene component and a propylene component. The adhesive tape and the substrate for the adhesive tape of the present invention are free of generation of dioxin and toxic gas upon incineration, and show superior resistance to thermal deformation, flame resistance and superior stretchability in combination.

Abstract: The present invention provides an adhesive tape comprising a substrate and an adhesive layer formed on at least one side of the substrate, wherein the substrate comprises the following Component A, Component B and Component C: Component A: a thermoplastic resin having a carbonyl oxygen atom in the molecular skeleton Component B: a polymer alloy containing an ethylene component and a propylene component Component C: an inorganic metal compound surface-treated with a silane coupling agent but substantially no halogen atom. The adhesive tape and the substrate for the adhesive tape of the present invention are free of generation of dioxin or a toxic gas upon incineration, are superior in flexibility, resistance to thermal deformation, flame resistance and resistance to surface whitening, and show suitable stretchability and mechanical strength.

Abstract: The present invention provides an adhesive tape comprising a substrate and an adhesive layer formed on at least one side of the substrate, wherein the substrate comprises the following

Abstract: A sheet for protecting a paint film, the sheet comprising a substrate and formed on one side thereof a rubber-based pressure-sensitive adhesive layer which has, on a side opposite the substrate side, a modified surface layer having a thickness of 100 nm or smaller and having a higher functional group concentration than the inner parts of the adhesive layer; and a process for producing the sheet which comprises subjecting a rubber-based pressure-sensitive adhesive layer formed on a substrate to a treatment for generating functional groups on the surface of the adhesive layer. The sheet, even when applied to a poorly bondable paint film apt to cause adhesion failures due to bleeding, etc.