Patents by Inventor Masayoshi Takeuchi

Masayoshi Takeuchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070236896
    Abstract: A wiring board in which silver is deposited near a via-conductor includes a ceramic substrate having a via-hole, a via-conductor disposed in the via-hole, and a metal thin-film pattern which is disposed on the ceramic substrate such that the metal thin-film pattern is connected to the via-conductor. The via-conductor contains silver or a material principally containing silver. A silver deposit that is a piece of the via-conductor is disposed on a surface portion of the ceramic substrate that is located near the via-hole. A catalyst layer containing a metal material is disposed over an exposed face of the via-conductor and the surface portion of the ceramic substrate. A metal layer is disposed on the catalyst layer. The metal thin-film pattern is disposed over the metal layer and the ceramic substrate.
    Type: Application
    Filed: March 5, 2007
    Publication date: October 11, 2007
    Inventors: Masayoshi Takeuchi, Shinji Murata
  • Publication number: 20070049535
    Abstract: The present invention provides a novel agent for the prophylaxis or treatment of diabetic complications. Specifically, the present invention provides an agent for the prophylaxis or treatment of diabetic complications, which contains, as an active ingredient, an oligopeptide containing at least two amino acid residues having an amino group or a guadinino group in the side chain, and which has AGE2 production inhibitory action and AGE2 blood concentration reduction promoting action.
    Type: Application
    Filed: September 26, 2006
    Publication date: March 1, 2007
    Inventors: Yoshiro Kitahara, Masayoshi Takeuchi
  • Publication number: 20070022819
    Abstract: An object detecting apparatus includes: a piezoelectric sensor including a first electrode, a piezoelectric material surrounding the first electrode, and a second electrode surrounding the piezoelectric material and provided at an outer edge portion at a side of an opening of a door for a vehicle having a door panel; a signal processing circuit measuring a potential difference between the first electrode and the second electrode; and a connecting line connecting the first electrode and the second electrode to the signal processing circuit.
    Type: Application
    Filed: July 25, 2006
    Publication date: February 1, 2007
    Inventors: Masayoshi Takeuchi, Takehiko Sugiura, Nobuhiro Yamauchi
  • Publication number: 20070022818
    Abstract: An object detecting apparatus includes a piezoelectric sensor provided at an edge portion of an opening/closing body for emitting an output voltage which changes corresponding to an external force applied to the edge portion and a detection circuit for receiving the output voltage of the piezoelectric sensor and for judging an entrapment. The detection circuit includes a voltage-measuring circuit for measuring the output voltage of the piezoelectric sensor, a time-measuring circuit for measuring time, and a judging circuit configured to judge the entrapment. The judging circuit judges the entrapment corresponding to the output voltage of the piezoelectric sensor. The judging circuit calculates a changing value of the output voltage after the output voltage of the piezoelectric sensor reaches a predetermined first level. The judging circuit judges that the entrapment has not occurred in a situation where the changing value of the output voltage is larger than a predetermined value.
    Type: Application
    Filed: July 25, 2006
    Publication date: February 1, 2007
    Inventors: Takehiko Sugiura, Masayoshi Takeuchi
  • Publication number: 20060231953
    Abstract: There is provided a structure for mounting a semiconductor part having improved productivity, in which a bump is detached from a land portion and a method of manufacturing a mounting substrate used therein. The structure for mounting the semiconductor part includes a mounting substrate 1 having an insulating substrate 2 on which a wiring pattern 3 and a land portion 4 are provided, a semiconductor part 5 mounted on the mounting substrate 1 using a bump 7 and the land portion 4, and an underfill 8 inserted between the semiconductor part 5 and the insulating substrate 2. An undercut portion 4c having an inverse tapered shape from the insulating substrate 2 to an upper surface of the land portion 4 is provided in an edge 4a of the land portion 4 in which the bump 7 is located, and the bump is inserted into the undercut portion. Accordingly, since the couple between the bump 7 and the land portion 4 becomes stronger, the bump is not detached from the land portion 4 when the underfill 8 expands or contracts.
    Type: Application
    Filed: March 20, 2006
    Publication date: October 19, 2006
    Inventors: Shinji Murata, Masayoshi Takeuchi
  • Publication number: 20060113943
    Abstract: A contact-detecting apparatus provided at an open-and close device for detecting a state of contact with trapping object to be detected includes a piezoelectric sensor member for detecting a state of contact of the open-and close device with the trapping object to be detected, a detection circuit for receiving an output from the piezoelectric sensor, and a protector provided at the open-and close device and including a supporting member for supporting the piezoelectric sensor member and a base member integrally formed with the supporting member for supporting and protecting the detection circuit. Rigidity of the supporting member is lower than rigidity of the base member.
    Type: Application
    Filed: November 16, 2005
    Publication date: June 1, 2006
    Applicant: AISIN SEIKI KABUSHIKI KAISHA
    Inventors: Nobuhiro Yamauchi, Masayoshi Takeuchi
  • Publication number: 20060087418
    Abstract: A pressure sensitive sensor includes a base member, a supporting member connected to one end of the base member and deformable upon receipt of a pressure, and a piezoelectric sensor provided in the supporting member.
    Type: Application
    Filed: October 25, 2005
    Publication date: April 27, 2006
    Applicant: AISIN SEIKI KABUSHIKI KAISHA
    Inventor: Masayoshi Takeuchi
  • Patent number: 6503775
    Abstract: A production method of a micromachine includes a polysilicon film forming step which overlays grooves, defined in an upper surface of a sacrificial layer on a silicon substrate, with polysilicon layer so as to be flat. The production method includes a first processing step for filling the grooves by adding a lower laid portion of the polysilicon layer onto a sacrificial layer. The lower laid portion has a thickness greater than 0.625 times relative to a width of the grooves. The production method of the micromachine further includes a second processing step for making the polysilicon layer to have a predetermined thickness by adding a upper laid portion of the polysilicon layer on the lower laid portion to form the polysilicon layer, the upper laid portion formed by depositing polysilicon which has the same impurity concentration as the lower laid portion does.
    Type: Grant
    Filed: September 21, 2001
    Date of Patent: January 7, 2003
    Assignee: Aisin Seiki Kabushiki Kaisha
    Inventors: Satoru Nomoto, Masayoshi Takeuchi, Shuji Noda
  • Patent number: 6501497
    Abstract: The present invention provides a thermal head having a long lifetime and a high printing quality by making the size of steps of a protective layer formed on a heating portion of a heating resistor small and a method for manufacturing the thermal heads. In the thermal head, respective lower-layer electrodes having a film thickness of approximately 2 &mgr;m are formed on outskirts portion of a bulging portion of a heat insulation layer excluding a heating portion of a heating resistor and portions in the vicinity of the heating portion. Then, respective upper-layer electrodes having a film thickness which falls in a range of 0.1 to 0.3 &mgr;m are continuously formed from portions at positions in the vicinity of the heating portion excluding the heating portion to upper surfaces of the lower-layer electrodes.
    Type: Grant
    Filed: August 27, 2001
    Date of Patent: December 31, 2002
    Assignee: Alps Electric Co., Ltd.
    Inventors: Takashi Shirakawa, Masayoshi Takeuchi, Satoshi Kubo, Daiki Sugiyama, Noboru Tsushima
  • Publication number: 20020037601
    Abstract: A production method of a micromachine includes a polysilicon film forming step which overlays grooves, defined in an upper surface of a sacrificial layer on a silicon substrate, with polysilicon layer so as to be flat. The production method includes a first processing step for filling the grooves by adding a lower laid portion of the polysilicon layer onto a sacrificial layer. The lower laid portion has a thickness greater than 0.625 times relative to a width of the grooves. The production method of the micromachine further includes a second processing step for making the polysilicon layer to have a predetermined thickness by adding a upper laid portion of the polysilicon layer on the lower laid portion to form the polysilicon layer, the upper laid portion formed by depositing polysilicon which has the same impurity concentration as the lower laid portion does.
    Type: Application
    Filed: September 21, 2001
    Publication date: March 28, 2002
    Applicant: AISIN SEIKI KABUSHIKI KAISHA
    Inventors: Satoru Nomoto, Masayoshi Takeuchi, Shuji Noda
  • Publication number: 20020024582
    Abstract: The present invention provides a thermal head having a long lifetime and a high printing quality by making the size of steps of a protective layer formed on a heating portion of a heating resistor small and a method for manufacturing the thermal heads. In the thermal head, respective lower-layer electrodes having a film thickness of approximately 2 &mgr;m are formed on outskirts portion of a bulging portion of a heat insulation layer excluding a heating portion of a heating resistor and portions in the vicinity of the heating portion. Then, respective upper-layer electrodes having a film thickness which falls in a range of 0.1 to 0.3 &mgr;m are continuously formed from portions at positions in the vicinity of the heating portion excluding the heating portion to upper surfaces of the lower-layer electrodes.
    Type: Application
    Filed: August 27, 2001
    Publication date: February 28, 2002
    Applicant: Alps Electric Co., Ltd.
    Inventors: Takashi Shirakawa, Masayoshi Takeuchi, Satoshi Kubo, Daiki Sugiyama, Noboru Tsushima
  • Patent number: 4714086
    Abstract: A method for washing and drying a substrate and an apparatus therefor are disclosed which are capable of effectively rapidly carrying out the washing and drying of a semiconductor substrate in good yields without damaging and contaminating the substrate. The method comprises the steps of immersing a carrier carrying at least one substrate thereon into wash liquid; drawing up the carrier from the wash liquid while oscillating the substrate; and feeding drying gas to the substrate during the drawing-up of the carrier to remove the wash liquid from the surface of the substrate. The apparatus of the invention is constructed to allow the method to be effectively practiced.
    Type: Grant
    Filed: September 25, 1986
    Date of Patent: December 22, 1987
    Assignees: Sharp Corporation, Dainichi Shoji Co., Ltd.
    Inventors: Yoshifumi Kishida, Masayoshi Takeuchi
  • Patent number: 4643774
    Abstract: A method for washing and drying a substrate and an apparatus therefor are disclosed which are capable of effectively rapidly carrying out the washing and drying of a semiconductor substrate in good yields without damaging and contaminating the substrate. The method comprises the steps of immersing a carrier carrying at least one substrate thereon into wash liquid; drawing up the carrier from the wash liquid while oscillating the substrate; and feeding drying gas to the substrate during the drawing-up of the carrier to remove the wash liquid from the surface of the substrate. The apparatus of the invention is constructed to allow the method to be effectively practiced.
    Type: Grant
    Filed: April 17, 1985
    Date of Patent: February 17, 1987
    Assignees: Sharp Corporation, Dainichi Shoji Co., Inc.
    Inventors: Yoshifumi Kishida, Masayoshi Takeuchi
  • Patent number: D549848
    Type: Grant
    Filed: February 25, 2005
    Date of Patent: August 28, 2007
    Assignee: Aisin Seiki Kabushiki Kaisha
    Inventors: Masayoshi Takeuchi, Yoshichika Ito
  • Patent number: D549849
    Type: Grant
    Filed: September 2, 2005
    Date of Patent: August 28, 2007
    Assignee: Aisin Seiki Kabushiki Kaisha
    Inventors: Hironori Koeda, Masayoshi Takeuchi, Masaru Hoshina