Patents by Inventor Masayoshi Tamura

Masayoshi Tamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11502022
    Abstract: A refrigerant channel of a heatsink includes an upwardly inclined channel formed by a side wall for downstream side of a first protruding portion and a side wall for upstream side of a second protruding portion. The upwardly inclined channel directs a flow of the refrigerant toward a base portion of the fin and causes the refrigerant to flow into the fin region, because of which more refrigerant flows to the base portion than to a leading end portion of the fin, and a high heat dissipating performance is obtained. Also, the fin is a columnar body whose sectional form perpendicular to a central axis is a regular hexagon, has rounded portions in corner portions, and has tapers on side faces. Six fins are disposed neighboring one fin, and a distance between fins is constant. Because of this, the heat dissipating performance further improves, and pressure loss can be reduced.
    Type: Grant
    Filed: January 27, 2020
    Date of Patent: November 15, 2022
    Assignee: Mitsubishi Electric Corporation
    Inventors: Shigenobu Tochiyama, Yuhei Nagashima, Masayoshi Tamura
  • Publication number: 20220346270
    Abstract: A heat sink includes a main body and multiple circular pipes. The main body is in contact with at least one heat emitter. The circular pipes are disposed inside the main body. The circular pipes extend in a shape of helices and are configured to convey refrigerant. The circular pipes are arranged such that the central axes of the helices are adjacent. Each two of the circular pipes of which the central axes of the helices are adjacent to each other are intertwined with each other.
    Type: Application
    Filed: November 4, 2020
    Publication date: October 27, 2022
    Applicant: Mitsubishi Electric Corporation
    Inventor: Masayoshi TAMURA
  • Patent number: 11446751
    Abstract: A soldering system includes a temperature measurement device that measures a temperature distribution of a surface of a substrate. The soldering system also includes a driver that drives the soldering system based on a control parameter obtained from the temperature distribution measured by the temperature measurement device.
    Type: Grant
    Filed: January 26, 2018
    Date of Patent: September 20, 2022
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Takashi Kobayashi, Masayoshi Tamura, Nobuyasu Kitagawa, Tsuyoshi Tanabe
  • Patent number: 11085702
    Abstract: A pin-shaped first heat radiating fin low in fluid resistance is disposed in a region required to be high in cooling performance, and a second heat radiating fin high in fluid resistance of a shape in which a plurality of columns of grooves which each meander in zigzag at a narrow pitch are arranged side by side is disposed in a region only necessary to be low in cooling performance. Furthermore, the first and second heat radiating fins are installed in parallel to a direction of flow of refrigerant.
    Type: Grant
    Filed: March 17, 2017
    Date of Patent: August 10, 2021
    Assignee: Mitsubishi Electric Corporation
    Inventors: Kazuki Arata, Masayoshi Tamura
  • Publication number: 20210066166
    Abstract: In a liquid-cooling-type cooler, an inlet header region and an outlet header region are formed by a partition member. If an inflow direction of a coolant to an inflow port is defined as a Y direction and a direction perpendicular to the Y direction is defined as an X direction, the partition member guides a coolant, which has flowed in the Y direction into the inlet header region, to an inlet flow path while deflecting an advancing direction of the coolant by a partition wall, thereby causing the coolant, which has passed through the header region, to flow into the entire area of the inlet flow path at an approximately equal flow rate and to further flow in the X direction into one side surface of each of heat dissipation regions at an even flow rate. Accordingly, a uniform cooling effect is obtained on mounting surfaces on heat generating elements.
    Type: Application
    Filed: March 19, 2018
    Publication date: March 4, 2021
    Applicant: Mitsubishi Electric Corporation
    Inventors: Kazuki ARATA, Takuya NAKAMURA, Masayoshi TAMURA
  • Patent number: 10809017
    Abstract: A heat sink includes a plurality of heat-radiating fins provided on a base, wherein the heat-radiating fins each have a projection-and-recess shape in which a sectional shape along the base is inscribed in a regular hexagon, wherein projections of the projection-and-recess shape are held in contact with the regular hexagon. In adjacent heat-radiating fins, sides of the regular hexagon, with which the projections are held in contact, are opposed to each other in an entire region. The heat-radiating fins are arranged so that distances between the sides opposed to each other at a distance are equal.
    Type: Grant
    Filed: May 10, 2016
    Date of Patent: October 20, 2020
    Assignee: Mitsubishi Electric Corporation
    Inventors: Kazuki Arata, Masayoshi Tamura
  • Publication number: 20200286812
    Abstract: A refrigerant channel of a heatsink includes an upwardly inclined channel formed by a side wall for downstream side of a first protruding portion and a side wall for upstream side of a second protruding portion. The upwardly inclined channel directs a flow of the refrigerant toward a base portion of the fin and causes the refrigerant to flow into the fin region, because of which more refrigerant flows to the base portion than to a leading end portion of the fin, and a high heat dissipating performance is obtained. Also, the fin is a columnar body whose sectional form perpendicular to a central axis is a regular hexagon, has rounded portions in corner portions, and has tapers on side faces. Six fins are disposed neighboring one fin, and a distance between fins is constant. Because of this, the heat dissipating performance further improves, and pressure loss can be reduced.
    Type: Application
    Filed: January 27, 2020
    Publication date: September 10, 2020
    Applicant: Mitsubishi Electric Corporation
    Inventors: Shigenobu TOCHIYAMA, Yuhei NAGASHIMA, Masayoshi TAMURA
  • Publication number: 20190375036
    Abstract: A soldering system includes a temperature measurement device that measures a temperature distribution of a surface of a substrate. The soldering system also includes a driver that drives the soldering system based on a control parameter obtained from the temperature distribution measured by the temperature measurement device.
    Type: Application
    Filed: January 26, 2018
    Publication date: December 12, 2019
    Applicant: Mitsubishi Electric Corporation
    Inventors: Takashi Kobayashi, Masayoshi Tamura, Nobuyasu Kitagawa, Tsuyoshi Tanabe
  • Publication number: 20190331428
    Abstract: A pin-shaped first heat radiating fin low in fluid resistance is disposed in a region required to be high in cooling performance, and a second heat radiating fin high in fluid resistance of a shape in which a plurality of columns of grooves which each meander in zigzag at a narrow pitch are arranged side by side is disposed in a region only necessary to be low in cooling performance. Furthermore, the first and second heat radiating fins are installed in parallel to a direction of flow of refrigerant.
    Type: Application
    Filed: March 17, 2017
    Publication date: October 31, 2019
    Applicant: Mitsubishi Electric Corporation
    Inventors: Kazuki ARATA, Masayoshi TAMURA
  • Patent number: 10455734
    Abstract: A liquid coolant supplying header is configured on a central portion in the width direction between an upper portion heatsink and a partitioning plate, a liquid coolant discharging header is configured on a central portion in the width direction between a lower portion heatsink and the partitioning plate so as to be parallel to the liquid coolant supplying header, vertical flow channels are formed so as to pass through the partitioning plate vertically on two sides in the width direction so as to be parallel to the liquid coolant supplying header, a liquid coolant distributing structural body is disposed inside the liquid coolant supplying header, and an external shape of the liquid coolant distributing structural body is formed such that flow channel cross-sectional area of the liquid coolant supplying header becomes gradually smaller from an upstream end toward a downstream end.
    Type: Grant
    Filed: June 14, 2017
    Date of Patent: October 22, 2019
    Assignee: Mitsubishi Electric Corporation
    Inventors: Shigenobu Tochiyama, Seiji Haga, Masayoshi Tamura, Satoshi Ishibashi, Shinsuke Idenoue
  • Publication number: 20190137195
    Abstract: A heat sink capable of enhancing heat radiation performance while maintaining a lower limit value of a distance of a gap between adjacent heat-radiating fins is obtained. Provided is a heat sink, including a plurality of heat-radiating fins provided on a base of the heat sink, wherein the heat-radiating fins each have a projection-and-recess shape in which a sectional shape along the base is inscribed in a regular hexagon, wherein projections of the projection-and-recess shape are held in contact with the regular hexagon, and wherein, in the adjacent heat-radiating fins, sides of the regular hexagon, with which the projections are held in contact, are opposed to each other in an entire region, and the heat-radiating fins are arranged so that side-to-side distances being distances between the sides opposed to each other at a distance are equal.
    Type: Application
    Filed: May 10, 2016
    Publication date: May 9, 2019
    Applicant: Mitsubishi Electric Corporation
    Inventors: Kazuki ARATA, Masayoshi TAMURA
  • Patent number: 10084388
    Abstract: A power converter includes: a base conductor, an electrically heating member which is provided on the base conductor, a noise reduction capacitor of flat plate-shape in which via an insulator, a plurality of first electrodes and second electrodes are alternately layered, on one surface, the first electrode in an outermost layer is exposed and on another surface, the second electrode in an outermost layer is exposed, a relay conductor which is electrically connected to other members from the electrically heating member via the noise reduction capacitor, and the second electrode in an outermost layer of the noise reduction capacitor is face-joined to a face of the base conductor at a side where the electrically heating member is provided and the first electrode in an outermost layer and the relay conductor are face-joined.
    Type: Grant
    Filed: June 12, 2015
    Date of Patent: September 25, 2018
    Assignee: Mitsubishi Electric Corporation
    Inventors: Keita Takahashi, Kazuki Sakata, Yoshiyuki Deguchi, Takuto Yano, Mamoru Takikita, Kazutoshi Awane, Koji Nakajima, Takao Mitsui, Kosuke Nakano, Masayoshi Tamura, Masashi Sakai
  • Publication number: 20170280589
    Abstract: A liquid coolant supplying header is configured on a central portion in the width direction between an upper portion heatsink and a partitioning plate, a liquid coolant discharging header is configured on a central portion in the width direction between a lower portion heatsink and the partitioning plate so as to be parallel to the liquid coolant supplying header, vertical flow channels are formed so as to pass through the partitioning plate vertically on two sides in the width direction so as to be parallel to the liquid coolant supplying header, a liquid coolant distributing structural body is disposed inside the liquid coolant supplying header, and an external shape of the liquid coolant distributing structural body is formed such that flow channel cross-sectional area of the liquid coolant supplying header becomes gradually smaller from an upstream end toward a downstream end.
    Type: Application
    Filed: June 14, 2017
    Publication date: September 28, 2017
    Applicant: Mitsubishi Electric Corporation
    Inventors: Shigenobu TOCHIYAMA, Seiji HAGA, Masayoshi TAMURA, Satoshi ISHIBASHI, Shinsuke IDENOUE
  • Publication number: 20170194873
    Abstract: A power converter includes: a base conductor, an electrically heating member which is provided on the base conductor, a noise reduction capacitor of flat plate-shape in which via an insulator, a plurality of first electrodes and second electrodes are alternately layered, on one surface, the first electrode in an outermost layer is exposed and on another surface, the second electrode in an outermost layer is exposed, a relay conductor which is electrically connected to other members from the electrically heating member via the noise reduction capacitor, and the second electrode in an outermost layer of the noise reduction capacitor is face-joined to a face of the base conductor at a side where the electrically heating member is provided and the first electrode in an outermost layer and the relay conductor are face-joined.
    Type: Application
    Filed: June 12, 2015
    Publication date: July 6, 2017
    Applicant: Mitsubishi Electric Corporation
    Inventors: Keita TAKAHASHI, Kazuki SAKATA, Yoshiyuki DEGUCHI, Takuto YANO, Mamoru TAKIKITA, Kazutoshi AWANE, Koji NAKAJIMA, Takao MITSUI, Kosuke NAKANO, Masayoshi TAMURA, Masashi SAKAI
  • Patent number: 9594222
    Abstract: There are provided a heat transfer part 21 having heat-receiving surfaces 211a and 211b which have curved surface shapes along side surfaces 111 and 121 of a stem 11 and a cylindrical part 12 and in which the stem 11 and the cylindrical part 12 can be fitted, and heat-dissipating surfaces 212a and 212b provided with projected and retracted portions 213a and 213b; and a casing 22 having the optical distributor 1 and the heat transfer part 21 mounted thereon, and having heat-receiving surfaces 222a and 222b provided with projected and retracted portions 223a and 223b engaged with the projected and retracted portions 213a and 213b.
    Type: Grant
    Filed: December 13, 2013
    Date of Patent: March 14, 2017
    Assignee: Mitsubishi Electric Corporation
    Inventors: Hideki Goto, Naoto Himura, Noriyuki Tani, Seiji Haga, Masayoshi Tamura
  • Patent number: 9291404
    Abstract: The cooling device comprises a heat exchange unit provided in a cooling water flow path. The heat exchange unit has a plate part in the form of a plate and multiple fins erected on the plate face of the plate part, and provided in the manner that the plate face of the plate part extends along the cooling water flow path and the cooling water runs through the space between the fins. The multiple fins are each in the form of a rhombic column and provided on the plate part in a lattice pattern in the manner that the longer diagonal of the rhombic column extends along the cooling water flow path.
    Type: Grant
    Filed: January 24, 2013
    Date of Patent: March 22, 2016
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Masayoshi Tamura, Seiji Haga, Yosuke Kikuchi
  • Publication number: 20150355425
    Abstract: There are provided a heat transfer part 21 having heat-receiving surfaces 211a and 211b which have curved surface shapes along side surfaces 111 and 121 of a stem 11 and a cylindrical part 12 and in which the stem 11 and the cylindrical part 12 can be fitted, and heat-dissipating surfaces 212a and 212b provided with projected and retracted portions 213a and 213b; and a casing 22 having the optical distributor 1 and the heat transfer part 21 mounted thereon, and having heat-receiving surfaces 222a and 222b provided with projected and retracted portions 223a and 223b engaged with the projected and retracted portions 213a and 213b.
    Type: Application
    Filed: December 13, 2013
    Publication date: December 10, 2015
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Hideki GOTO, Naoto HIMURA, Noriyuki TANI, Seiji HAGA, Masayoshi TAMURA
  • Publication number: 20140158324
    Abstract: A liquid coolant supplying header is configured on a central portion in the width direction between an upper portion heatsink and a partitioning plate, a liquid coolant discharging header is configured on a central portion in the width direction between a lower portion heatsink and the partitioning plate so as to be parallel to the liquid coolant supplying header, vertical flow channels are formed so as to pass through the partitioning plate vertically on two sides in the width direction so as to be parallel to the liquid coolant supplying header, a liquid coolant distributing structural body is disposed inside the liquid coolant supplying header, and an external shape of the liquid coolant distributing structural body is formed such that flow channel cross-sectional area of the liquid coolant supplying header becomes gradually smaller from an upstream end toward a downstream end.
    Type: Application
    Filed: November 21, 2013
    Publication date: June 12, 2014
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Shigenobu TOCHIYAMA, Seiji HAGA, Masayoshi TAMURA, Satoshi ISHIBASHI, Shinsuke IDENOUE
  • Publication number: 20130220587
    Abstract: The cooling device comprises a heat exchange unit provided in a cooling water flow path. The heat exchange unit has a plate part in the form of a plate and multiple fins erected on the plate face of the plate part, and provided in the manner that the plate face of the plate part extends along the cooling water flow path and the cooling water runs through the space between the fins. The multiple fins are each in the form of a rhombic column and provided on the plate part in a lattice pattern in the manner that the longer diagonal of the rhombic column extends along the cooling water flow path.
    Type: Application
    Filed: January 24, 2013
    Publication date: August 29, 2013
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Masayoshi Tamura, Seiji Haga, Yosuke Kikuchi
  • Patent number: 4566079
    Abstract: A holder in which a bubble cassette housing a bubble memory device is inserted. The contacts of the holder contact the contacts of the cassette when the cassette is inserted into the holder, so that current can flow into the bubble memory device. The holder contains a detector for detecting the insertion and withdrawal of the cassette. A circuit controls the current introduced into the magnetic-bubble memory device so that the current is introduced after the contacts of the cassette and the contacts of the holder are connected and is interrupted before the contacts of the cassette and the contacts of the holder are disconnected.
    Type: Grant
    Filed: December 17, 1982
    Date of Patent: January 21, 1986
    Assignee: Fujitsu Limited
    Inventors: Hirosi Hasegawa, Tatsuro Onuma, Norio Matsubayashi, Masayoshi Tamura