Patents by Inventor Masayoshi Tamura
Masayoshi Tamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11502022Abstract: A refrigerant channel of a heatsink includes an upwardly inclined channel formed by a side wall for downstream side of a first protruding portion and a side wall for upstream side of a second protruding portion. The upwardly inclined channel directs a flow of the refrigerant toward a base portion of the fin and causes the refrigerant to flow into the fin region, because of which more refrigerant flows to the base portion than to a leading end portion of the fin, and a high heat dissipating performance is obtained. Also, the fin is a columnar body whose sectional form perpendicular to a central axis is a regular hexagon, has rounded portions in corner portions, and has tapers on side faces. Six fins are disposed neighboring one fin, and a distance between fins is constant. Because of this, the heat dissipating performance further improves, and pressure loss can be reduced.Type: GrantFiled: January 27, 2020Date of Patent: November 15, 2022Assignee: Mitsubishi Electric CorporationInventors: Shigenobu Tochiyama, Yuhei Nagashima, Masayoshi Tamura
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Publication number: 20220346270Abstract: A heat sink includes a main body and multiple circular pipes. The main body is in contact with at least one heat emitter. The circular pipes are disposed inside the main body. The circular pipes extend in a shape of helices and are configured to convey refrigerant. The circular pipes are arranged such that the central axes of the helices are adjacent. Each two of the circular pipes of which the central axes of the helices are adjacent to each other are intertwined with each other.Type: ApplicationFiled: November 4, 2020Publication date: October 27, 2022Applicant: Mitsubishi Electric CorporationInventor: Masayoshi TAMURA
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Patent number: 11446751Abstract: A soldering system includes a temperature measurement device that measures a temperature distribution of a surface of a substrate. The soldering system also includes a driver that drives the soldering system based on a control parameter obtained from the temperature distribution measured by the temperature measurement device.Type: GrantFiled: January 26, 2018Date of Patent: September 20, 2022Assignee: MITSUBISHI ELECTRIC CORPORATIONInventors: Takashi Kobayashi, Masayoshi Tamura, Nobuyasu Kitagawa, Tsuyoshi Tanabe
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Patent number: 11085702Abstract: A pin-shaped first heat radiating fin low in fluid resistance is disposed in a region required to be high in cooling performance, and a second heat radiating fin high in fluid resistance of a shape in which a plurality of columns of grooves which each meander in zigzag at a narrow pitch are arranged side by side is disposed in a region only necessary to be low in cooling performance. Furthermore, the first and second heat radiating fins are installed in parallel to a direction of flow of refrigerant.Type: GrantFiled: March 17, 2017Date of Patent: August 10, 2021Assignee: Mitsubishi Electric CorporationInventors: Kazuki Arata, Masayoshi Tamura
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Publication number: 20210066166Abstract: In a liquid-cooling-type cooler, an inlet header region and an outlet header region are formed by a partition member. If an inflow direction of a coolant to an inflow port is defined as a Y direction and a direction perpendicular to the Y direction is defined as an X direction, the partition member guides a coolant, which has flowed in the Y direction into the inlet header region, to an inlet flow path while deflecting an advancing direction of the coolant by a partition wall, thereby causing the coolant, which has passed through the header region, to flow into the entire area of the inlet flow path at an approximately equal flow rate and to further flow in the X direction into one side surface of each of heat dissipation regions at an even flow rate. Accordingly, a uniform cooling effect is obtained on mounting surfaces on heat generating elements.Type: ApplicationFiled: March 19, 2018Publication date: March 4, 2021Applicant: Mitsubishi Electric CorporationInventors: Kazuki ARATA, Takuya NAKAMURA, Masayoshi TAMURA
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Patent number: 10809017Abstract: A heat sink includes a plurality of heat-radiating fins provided on a base, wherein the heat-radiating fins each have a projection-and-recess shape in which a sectional shape along the base is inscribed in a regular hexagon, wherein projections of the projection-and-recess shape are held in contact with the regular hexagon. In adjacent heat-radiating fins, sides of the regular hexagon, with which the projections are held in contact, are opposed to each other in an entire region. The heat-radiating fins are arranged so that distances between the sides opposed to each other at a distance are equal.Type: GrantFiled: May 10, 2016Date of Patent: October 20, 2020Assignee: Mitsubishi Electric CorporationInventors: Kazuki Arata, Masayoshi Tamura
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Publication number: 20200286812Abstract: A refrigerant channel of a heatsink includes an upwardly inclined channel formed by a side wall for downstream side of a first protruding portion and a side wall for upstream side of a second protruding portion. The upwardly inclined channel directs a flow of the refrigerant toward a base portion of the fin and causes the refrigerant to flow into the fin region, because of which more refrigerant flows to the base portion than to a leading end portion of the fin, and a high heat dissipating performance is obtained. Also, the fin is a columnar body whose sectional form perpendicular to a central axis is a regular hexagon, has rounded portions in corner portions, and has tapers on side faces. Six fins are disposed neighboring one fin, and a distance between fins is constant. Because of this, the heat dissipating performance further improves, and pressure loss can be reduced.Type: ApplicationFiled: January 27, 2020Publication date: September 10, 2020Applicant: Mitsubishi Electric CorporationInventors: Shigenobu TOCHIYAMA, Yuhei NAGASHIMA, Masayoshi TAMURA
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Publication number: 20190375036Abstract: A soldering system includes a temperature measurement device that measures a temperature distribution of a surface of a substrate. The soldering system also includes a driver that drives the soldering system based on a control parameter obtained from the temperature distribution measured by the temperature measurement device.Type: ApplicationFiled: January 26, 2018Publication date: December 12, 2019Applicant: Mitsubishi Electric CorporationInventors: Takashi Kobayashi, Masayoshi Tamura, Nobuyasu Kitagawa, Tsuyoshi Tanabe
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Publication number: 20190331428Abstract: A pin-shaped first heat radiating fin low in fluid resistance is disposed in a region required to be high in cooling performance, and a second heat radiating fin high in fluid resistance of a shape in which a plurality of columns of grooves which each meander in zigzag at a narrow pitch are arranged side by side is disposed in a region only necessary to be low in cooling performance. Furthermore, the first and second heat radiating fins are installed in parallel to a direction of flow of refrigerant.Type: ApplicationFiled: March 17, 2017Publication date: October 31, 2019Applicant: Mitsubishi Electric CorporationInventors: Kazuki ARATA, Masayoshi TAMURA
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Patent number: 10455734Abstract: A liquid coolant supplying header is configured on a central portion in the width direction between an upper portion heatsink and a partitioning plate, a liquid coolant discharging header is configured on a central portion in the width direction between a lower portion heatsink and the partitioning plate so as to be parallel to the liquid coolant supplying header, vertical flow channels are formed so as to pass through the partitioning plate vertically on two sides in the width direction so as to be parallel to the liquid coolant supplying header, a liquid coolant distributing structural body is disposed inside the liquid coolant supplying header, and an external shape of the liquid coolant distributing structural body is formed such that flow channel cross-sectional area of the liquid coolant supplying header becomes gradually smaller from an upstream end toward a downstream end.Type: GrantFiled: June 14, 2017Date of Patent: October 22, 2019Assignee: Mitsubishi Electric CorporationInventors: Shigenobu Tochiyama, Seiji Haga, Masayoshi Tamura, Satoshi Ishibashi, Shinsuke Idenoue
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Publication number: 20190137195Abstract: A heat sink capable of enhancing heat radiation performance while maintaining a lower limit value of a distance of a gap between adjacent heat-radiating fins is obtained. Provided is a heat sink, including a plurality of heat-radiating fins provided on a base of the heat sink, wherein the heat-radiating fins each have a projection-and-recess shape in which a sectional shape along the base is inscribed in a regular hexagon, wherein projections of the projection-and-recess shape are held in contact with the regular hexagon, and wherein, in the adjacent heat-radiating fins, sides of the regular hexagon, with which the projections are held in contact, are opposed to each other in an entire region, and the heat-radiating fins are arranged so that side-to-side distances being distances between the sides opposed to each other at a distance are equal.Type: ApplicationFiled: May 10, 2016Publication date: May 9, 2019Applicant: Mitsubishi Electric CorporationInventors: Kazuki ARATA, Masayoshi TAMURA
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Patent number: 10084388Abstract: A power converter includes: a base conductor, an electrically heating member which is provided on the base conductor, a noise reduction capacitor of flat plate-shape in which via an insulator, a plurality of first electrodes and second electrodes are alternately layered, on one surface, the first electrode in an outermost layer is exposed and on another surface, the second electrode in an outermost layer is exposed, a relay conductor which is electrically connected to other members from the electrically heating member via the noise reduction capacitor, and the second electrode in an outermost layer of the noise reduction capacitor is face-joined to a face of the base conductor at a side where the electrically heating member is provided and the first electrode in an outermost layer and the relay conductor are face-joined.Type: GrantFiled: June 12, 2015Date of Patent: September 25, 2018Assignee: Mitsubishi Electric CorporationInventors: Keita Takahashi, Kazuki Sakata, Yoshiyuki Deguchi, Takuto Yano, Mamoru Takikita, Kazutoshi Awane, Koji Nakajima, Takao Mitsui, Kosuke Nakano, Masayoshi Tamura, Masashi Sakai
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Publication number: 20170280589Abstract: A liquid coolant supplying header is configured on a central portion in the width direction between an upper portion heatsink and a partitioning plate, a liquid coolant discharging header is configured on a central portion in the width direction between a lower portion heatsink and the partitioning plate so as to be parallel to the liquid coolant supplying header, vertical flow channels are formed so as to pass through the partitioning plate vertically on two sides in the width direction so as to be parallel to the liquid coolant supplying header, a liquid coolant distributing structural body is disposed inside the liquid coolant supplying header, and an external shape of the liquid coolant distributing structural body is formed such that flow channel cross-sectional area of the liquid coolant supplying header becomes gradually smaller from an upstream end toward a downstream end.Type: ApplicationFiled: June 14, 2017Publication date: September 28, 2017Applicant: Mitsubishi Electric CorporationInventors: Shigenobu TOCHIYAMA, Seiji HAGA, Masayoshi TAMURA, Satoshi ISHIBASHI, Shinsuke IDENOUE
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Publication number: 20170194873Abstract: A power converter includes: a base conductor, an electrically heating member which is provided on the base conductor, a noise reduction capacitor of flat plate-shape in which via an insulator, a plurality of first electrodes and second electrodes are alternately layered, on one surface, the first electrode in an outermost layer is exposed and on another surface, the second electrode in an outermost layer is exposed, a relay conductor which is electrically connected to other members from the electrically heating member via the noise reduction capacitor, and the second electrode in an outermost layer of the noise reduction capacitor is face-joined to a face of the base conductor at a side where the electrically heating member is provided and the first electrode in an outermost layer and the relay conductor are face-joined.Type: ApplicationFiled: June 12, 2015Publication date: July 6, 2017Applicant: Mitsubishi Electric CorporationInventors: Keita TAKAHASHI, Kazuki SAKATA, Yoshiyuki DEGUCHI, Takuto YANO, Mamoru TAKIKITA, Kazutoshi AWANE, Koji NAKAJIMA, Takao MITSUI, Kosuke NAKANO, Masayoshi TAMURA, Masashi SAKAI
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Patent number: 9594222Abstract: There are provided a heat transfer part 21 having heat-receiving surfaces 211a and 211b which have curved surface shapes along side surfaces 111 and 121 of a stem 11 and a cylindrical part 12 and in which the stem 11 and the cylindrical part 12 can be fitted, and heat-dissipating surfaces 212a and 212b provided with projected and retracted portions 213a and 213b; and a casing 22 having the optical distributor 1 and the heat transfer part 21 mounted thereon, and having heat-receiving surfaces 222a and 222b provided with projected and retracted portions 223a and 223b engaged with the projected and retracted portions 213a and 213b.Type: GrantFiled: December 13, 2013Date of Patent: March 14, 2017Assignee: Mitsubishi Electric CorporationInventors: Hideki Goto, Naoto Himura, Noriyuki Tani, Seiji Haga, Masayoshi Tamura
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Patent number: 9291404Abstract: The cooling device comprises a heat exchange unit provided in a cooling water flow path. The heat exchange unit has a plate part in the form of a plate and multiple fins erected on the plate face of the plate part, and provided in the manner that the plate face of the plate part extends along the cooling water flow path and the cooling water runs through the space between the fins. The multiple fins are each in the form of a rhombic column and provided on the plate part in a lattice pattern in the manner that the longer diagonal of the rhombic column extends along the cooling water flow path.Type: GrantFiled: January 24, 2013Date of Patent: March 22, 2016Assignee: MITSUBISHI ELECTRIC CORPORATIONInventors: Masayoshi Tamura, Seiji Haga, Yosuke Kikuchi
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Publication number: 20150355425Abstract: There are provided a heat transfer part 21 having heat-receiving surfaces 211a and 211b which have curved surface shapes along side surfaces 111 and 121 of a stem 11 and a cylindrical part 12 and in which the stem 11 and the cylindrical part 12 can be fitted, and heat-dissipating surfaces 212a and 212b provided with projected and retracted portions 213a and 213b; and a casing 22 having the optical distributor 1 and the heat transfer part 21 mounted thereon, and having heat-receiving surfaces 222a and 222b provided with projected and retracted portions 223a and 223b engaged with the projected and retracted portions 213a and 213b.Type: ApplicationFiled: December 13, 2013Publication date: December 10, 2015Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Hideki GOTO, Naoto HIMURA, Noriyuki TANI, Seiji HAGA, Masayoshi TAMURA
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Publication number: 20140158324Abstract: A liquid coolant supplying header is configured on a central portion in the width direction between an upper portion heatsink and a partitioning plate, a liquid coolant discharging header is configured on a central portion in the width direction between a lower portion heatsink and the partitioning plate so as to be parallel to the liquid coolant supplying header, vertical flow channels are formed so as to pass through the partitioning plate vertically on two sides in the width direction so as to be parallel to the liquid coolant supplying header, a liquid coolant distributing structural body is disposed inside the liquid coolant supplying header, and an external shape of the liquid coolant distributing structural body is formed such that flow channel cross-sectional area of the liquid coolant supplying header becomes gradually smaller from an upstream end toward a downstream end.Type: ApplicationFiled: November 21, 2013Publication date: June 12, 2014Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Shigenobu TOCHIYAMA, Seiji HAGA, Masayoshi TAMURA, Satoshi ISHIBASHI, Shinsuke IDENOUE
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Publication number: 20130220587Abstract: The cooling device comprises a heat exchange unit provided in a cooling water flow path. The heat exchange unit has a plate part in the form of a plate and multiple fins erected on the plate face of the plate part, and provided in the manner that the plate face of the plate part extends along the cooling water flow path and the cooling water runs through the space between the fins. The multiple fins are each in the form of a rhombic column and provided on the plate part in a lattice pattern in the manner that the longer diagonal of the rhombic column extends along the cooling water flow path.Type: ApplicationFiled: January 24, 2013Publication date: August 29, 2013Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Masayoshi Tamura, Seiji Haga, Yosuke Kikuchi
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Patent number: 4566079Abstract: A holder in which a bubble cassette housing a bubble memory device is inserted. The contacts of the holder contact the contacts of the cassette when the cassette is inserted into the holder, so that current can flow into the bubble memory device. The holder contains a detector for detecting the insertion and withdrawal of the cassette. A circuit controls the current introduced into the magnetic-bubble memory device so that the current is introduced after the contacts of the cassette and the contacts of the holder are connected and is interrupted before the contacts of the cassette and the contacts of the holder are disconnected.Type: GrantFiled: December 17, 1982Date of Patent: January 21, 1986Assignee: Fujitsu LimitedInventors: Hirosi Hasegawa, Tatsuro Onuma, Norio Matsubayashi, Masayoshi Tamura