Abstract: There are provided a layered body and a display device including the same, the layered body including a substrate layer and a resin layer disposed on at least one surface of the substrate layer, in which the resin layer contains a light scattering agent (A), and, when the contact angle of the substrate layer with respect to diiodomethane is indicated by ?s (°) and the contact angle of the resin layer with respect to diiodomethane is indicated by ?r (°), the following formula: |?s - ?r| ? 21 is satisfied.

Abstract: The photosensitive composition according to the present invention is a photosensitive composition including a semiconductor particle (A), a photopolymerizable compound (C) and a photopolymerization initiator (D), in which the photosensitive composition satisfies any one or more of the following (a) to (c): (a) the photosensitive composition further includes a stabilizer (E), and a content of the stabilizer (E) is 8% by mass or more based on the total amount of the photosensitive composition; (b) the photopolymerizable compound (C) includes a (meth)acrylate compound (C1) having a molecular weight of 180 or less; and (c) the photopolymerizable compound (C) includes a compound (C2) having a vinyl ether group and a (meth)acryloyl group in the same molecule.

Abstract: There is provided a resin composition containing a resin (A), a light scattering agent (B), a solvent (C), and a leveling agent (H), in which the content ratio of the solvent (C) is 40% by mass or more and less than 74% by mass based on the total amount of the resin composition, and the content ratio of the leveling agent (H) is 0.01% by mass or more and 1% by mass or less based on the total amount of the resin composition.

Abstract: There are provided a layered body and a display device including the same, the layered body including a substrate layer and a resin layer disposed on at least one surface of the substrate layer, in which the resin layer contains a light scattering agent (A), and, when the surface tension of the substrate layer is indicated by ?s (mN/m), and the surface tension of the resin layer is indicated by ?r (mN/m), the following formula: |?s??r|?11.0 is satisfied.

Abstract: A curable resin composition containing quantum dots (A), a resin (B), a photopolymerizable compound (C), a photopolymerization initiator (D), an antioxidant (E), and a solvent (F), wherein a water content based on a total mass of the curable resin composition is 50 ppm or more and less than 5000 ppm.

Abstract: There is provided a curable resin composition containing quantum dots (A), a resin (B), a photopolymerizable compound (C), and a photopolymerization initiator (D), in which the photopolymerization initiator (D) contains an oxime compound having a first molecular structure represented by the formula (1).

Abstract: The photosensitive composition according to the present invention is a photosensitive composition including a semiconductor particle (A), a photopolymerizable compound (C) and a photopolymerization initiator (D), in which the photosensitive composition satisfies any one or more of the following (a) to (c): (a) the photosensitive composition further includes a stabilizer (E), and a content of the stabilizer (E) is 8% by mass or more based on the total amount of the photosensitive composition; (b) the photopolymerizable compound (C) includes a (meth)acrylate compound (C1) having a molecular weight of 180 or less; and (c) the photopolymerizable compound (C) includes a compound (C2) having a vinyl ether group and a (meth)acryloyl group in the same molecule.

Abstract: Provided is a curable resin composition containing quantum dots (A), a compound (B-1) having a first functional group and a second functional group, a resin (C), a photopolymerizable compound (D), and a photopolymerization initiator (E), wherein the first functional group is a carboxy group and the second functional group is a carboxy group or a thiol group.

Abstract: The photosensitive composition according to the present invention is a photosensitive composition including a semiconductor particle (A), a photopolymerizable compound (C) and a photopolymerization initiator (D), in which the photosensitive composition satisfies any one or more of the following (a) to (c): (a) the photosensitive composition further includes a stabilizer (E), and a content of the stabilizer (E) is 8% by mass or more based on the total amount of the photosensitive composition; (b) the photopolymerizable compound (C) includes a (meth)acrylate compound (C1) having a molecular weight of 180 or less; and (c) the photopolymerizable compound (C) includes a compound (C2) having a vinyl ether group and a (meth)acryloyl group in the same molecule.

Abstract: A composition contains quantum dots (A) and a resin (B), wherein the resin (B) contains a polymer (B1) having a sulfide group, a carboxyl group, and an unsaturated double bond.

Abstract: A curable resin composition contains quantum dots (A), a resin (B), a photopolymerizable compound (C), a photopolymerization initiator (D), an antioxidant (E), a leveling agent (F), and a solvent (G), wherein the resin (B) has a weight-average molecular weight in terms of polystyrene of less than 10000 and an acid value of 90 mg KOH/g or more and 150 mg KOH/g or less.

Abstract: An object of the present invention is to provide a laminate which has a substrate, an intermediate layer, and a water-repellent layer laminated in this order, and has excellent abrasion resistance.

Abstract: A mixed composition including an organosilicon compound (A) in which at least one trialkylsilyl group-containing molecular chain and at least one hydrolyzable group are bonded to a silicon atom, a metal compound (B), an acid (C), and water (D), in which a molar ratio (C/D) of the acid (C) to the water (D) is 0.002 to 0.15.

Abstract: The composition of the present invention is a mixed composition including at least one metal compound (G) selected from a metal compound represented by the following formula (G1) and a condensate thereof, a polysilazane (F), and a solvent (I), in which an amount of the polysilazane (F) is 0.01% by mass or more and less than 50% by mass. M(Rg10)r(Ag1)m-r??(G1) In formula (G1), M represents Al, Fe, In, Ge, Hf, Si, Ti, Sn, Zr, or Ta, Rg10 represents a hydrocarbon chain-containing group or a hydrogen atom, r is 0 or 1, a plurality of Ag1 each independently represent a hydrolyzable group, and m is an integer of 3 to 5 in accordance with the metal atom M.

Abstract: The present invention aims at providing a coating film excellent in water repellency and oil repellency and further excellent in wear resistance, and a layered body comprising said coating film formed on a base material and a method for manufacturing the same. The present invention provides a coating film having at least an outermost surface layer (M) and a layer (K1) in contact with the layer (M), wherein a density of the layer (M) is 0.7 g/cm3 or more and less than 1.0 g/cm3, and a density of the layer (K1) is 1.0 g/cm3 or more and less than 2.2 g/cm3. The layer (M) preferably has a polydimethylsiloxane skeleton and/or a trialkylsilyl group.

Abstract: The composition of the present invention is a mixed composition including at least one metal compound (G) selected from a metal compound represented by the following formula (G1) and a condensate thereof, a polysilazane (F), and a compound (H) including a siloxane chain. M(Rg10)r(Ag1)m-r (G1) wherein M represents Al, Fe, In, Ge, Hf, Si, Ti, Sn, Zr, or Ta, Rg10 represents a hydrocarbon chain-containing group or a hydrogen atom, r is 0 or 1, a plurality of Ag1 each independently represent a hydrolyzable group, and m is an integer of 3 to 5 in accordance with the metal atom M.

Abstract: A mixed composition containing an organosilicon compound (A) and a silicon compound (B), wherein the organosilicon compound (A) is an organosilicon compound in which at least one trialkylsilyl group-containing molecular chain and at least one hydrolyzable group are bonded to a silicon atom, the silicon compound (B) is one or more silicon compounds selected from the group consisting of a silicon compound (b) represented by the following formula (b) and a condensate (bb) thereof, and in a chromatogram obtained by GPC chromatography of the mixed composition, a weight average molecular weight Mw in terms of standard polystyrene of a compound derived from at least one of the organosilicon compound (A) and the silicon compound (B) is 2000 to 12000, Si(X)p(ORb)4?p??(b) wherein X is an alkyl group having 1 to 6 carbon atoms or a hydrogen atom, Rb is an alkyl group having 1 to 6 carbon atoms, and p is an integer of 0 to 3.

Abstract: A mixed composition including an organosilicon compound (A) in which at least one trialkylsilyl group-containing molecular chain and at least one hydrolyzable group are bonded to a silicon atom, a metal compound (B), an acid (C), and water (D), in which a ratio [D/(A+B)] of a molar amount of the water (D) to a total molar amount of the organosilicon compound (A) and the metal compound (B) is 3.1 to 130.