Patents by Inventor Masayoshi Tsugane

Masayoshi Tsugane has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lead frame and semiconductor device
    Patent number: 5837567
    Abstract: A lead frame for use with a plastic encapsulated semiconductor device includes a tab on which the semiconductor chip is mounted, chip pad supporting leads, inner leads to be electrically coupled with the semiconductor chip, outer leads formed in a monoblock structure together with the inner leads, and a frame for supporting the chip pad supporting leads and outer leads. In the lead frame, there is disposed a dam member only between the outer leads. Alternatively, dummy outer leads are formed between the frame and leads adjacent thereto so as to connect the dummy leads to the outer leads by the dam member. The frame is removed after the semiconductor device is assembled.
    Type: Grant
    Filed: March 31, 1997
    Date of Patent: November 17, 1998
    Assignee: Hitachi, Ltd.
    Inventors: Naotaka Tanaka, Akihiro Yaguchi, Makoto Kitano, Tatsuya Nagata, Tetsuo Kumazawa, Atsushi Nakamura, Hiromichi Suzuki, Masayoshi Tsugane
  • Lead frame and semiconductor device encapsulated by resin
    Patent number: 5637914
    Abstract: A lead frame for use with a plastic encapsulated semiconductor device includes a tab on which the semiconductor chip is mounted, chip pad supporting leads, inner leads to be electrically coupled with the semiconductor chip, outer leads formed in a monoblock structure together with the inner leads, and a frame for supporting the chip pad supporting leads and outer leads. In the lead frame, there is disposed a dam member only between the outer leads. Alternatively, dummy outer leads are formed between the frame and leads adjacent thereto so as to connect the dummy leads to the outer leads by the dam member. The frame is removed after the semiconductor device is assembled.
    Type: Grant
    Filed: May 10, 1995
    Date of Patent: June 10, 1997
    Assignee: Hitachi, Ltd.
    Inventors: Naotaka Tanaka, Akihiro Yaguchi, Makoto Kitano, Tatsuya Nagata, Tetsuo Kumazawa, Atsushi Nakamura, Hiromichi Suzuki, Masayoshi Tsugane