Abstract: Taper portions 151 and 161 are provided in the cavity of a stationary side die 110 and the cavity of a movable side die 120 in an injection molding apparatus, respectively, and a floating mechanism 170 is provided so that one taper portions are able to freely follows the other taper portions while die clamping. This configuration makes it possible to correct axial misalignment in each of the cavities.

Abstract: A method for bonding resin members by laser welding in which melting of a resin member can be prevented on the contact surface with a base or a tool used for bonding. In the bonding method, a resin member (1) is mounted on a base (3) and a surface of the base (3) in contact with the resin member (1) is an optical mirror surface. A surface of the resin member (1) is coated with a light absorbing agent (4), a resin member (2) is placed thereon and then a laser light (10) is irradiated from the resin member (2) side in order to melt the resin on the bonding surface of the resin member (1) and the resin member (2), thereby bonding the resin members together. The laser light (11) penetrated through the bonding surface reaches the contact surface where the resin member (1) and the base (3) are in contact with each other, and since the laser light (11) penetrates the bonding surface without being scattered or absorbed, melting of the resin member can be prevented.

Abstract: Taper portions 151 and 161 are provided in the cavity of a stationary side die 110 and the cavity of a movable side die 120 in an injection molding apparatus, respectively, and a floating mechanism 170 is provided so that one taper portions are able to freely follows the other taper portions while die clamping. This configuration makes it possible to correct axial misalignment in each of the cavities.

Abstract: A method of forming an optical element forming metal mold to form an optical element, having steps of: laminating a heat insulation layer 13 on a surface of the base member 11 where the optical element is formed; laminating an intermediate metal layer 14 on a surface of the heat insulation layer 13 by thermal spraying; laminating a surface forming layer 15, on which a surface shape to be transferred to the optical element is formed, on the intermediate metal layer 14; wherein the intermediate metal layer 14 is laminated in a way that parts of the heat insulation layer 13 are exposed substantially evenly from the intermediate layer 14.

Abstract: Provided is a microchip manufacturing method by which a functional film is formed in a flow path channel and resin microchip substrates are bonded. The manufacturing method has a first step of forming SiO2 films (12, 22) representing the functional films on a surface having a flow path channel (11) of a microchip substrate (10) and on a surface having a flow path channel (21) of a microchip substrate (20) respectively; a second step of exfoliating the SiO2 films formed on the microchip substrates (10, 20) except the SiO2 films formed on the flow path channels (11, 21) by a cohesive member; and a third step of placing the microchip substrates (10, 20) one over another in such a way that the surfaces on which the flow path channels (11, 21) are formed face inside, and bonding the substrates by laser welding, ultrasonic wave welding or thermocompression bonding.

Abstract: Mold releasability of a molding die from a master is improved. The master is a mother body of the molding die. The master has a groove corresponding to a flow channel of a resin molded product, and the cross-section of the bottom surface portion of the groove is in the form of a curved surface.

Abstract: A microchip, including two resin substrates, wherein a groove serving as a channel is formed on a surface of at least one of the two resin substrates, and the surfaces of the two resin substrates are adhered to each other, and the surface carrying the formed groove faces an inner side of the two adhered resin substrates, the microchip is characterized in that a portion of at least one of the two resin substrates structures a portion of a condenser lens to focus light rays, coming from an external section, onto a predetermined position in the groove.

Abstract: Provided is a microchip manufacturing method by which a functional film is formed in a flow path channel and resin microchip substrates are bonded. The manufacturing method has a first step of forming SiO2 films (12, 22) representing the functional films on a surface having a flow path channel (11) of a microchip substrate (10) and on a surface having a flow path channel (21) of a microchip substrate (20) respectively; a second step of exfoliating the SiO2 films formed on the microchip substrates (10, 20) except the SiO2 films formed on the flow path channels (11, 21) by a cohesive member; and a third step of placing the microchip substrates (10, 20) one over another in such a way that the surfaces on which the flow path channels (11, 21) are formed face inside, and bonding the substrates by laser welding, ultrasonic wave welding or thermocompression bonding.

Abstract: In the case where a lens unit where two ore more transparent resin lenses are combined is constituted, at least one transparent resin lens contains infrared absorbent. When the lens unit is assembled, an infrared laser is emitted to a joined portion between the transparent resin lens and the other transparent resin lens. As a result, the emitted infrared ray is absorbed by the infrared absorbent, so that the transparent resin lenses are welded to each other. An opaque lens barrel which holds the entire lens unit and the transparent resin lenses are joined by welding.

Abstract: A method of forming an optical element forming metal mold to form an optical element, having steps of: laminating a heat insulation layer 13 on a surface of the base member 11 where the optical element is formed; laminating an intermediate metal layer 14 on a surface of the heat insulation layer 13 by thermal spraying; laminating a surface forming layer 15, on which a surface shape to be transferred to the optical element is formed, on the intermediate metal layer 14; wherein the intermediate metal layer 14 is laminated in a way that parts of the heat insulation layer 13 are exposed substantially evenly from the intermediate layer 14.

Abstract: In the case where a lens unit where two ore more transparent resin lenses are combined is constituted, at least one transparent resin lens contains infrared absorbent. When the lens unit is assembled, an infrared laser is emitted to a joined portion between the transparent resin lens and the other transparent resin lens. As a result, the emitted infrared ray is absorbed by the infrared absorbent, so that the transparent resin lenses are welded to each other. An opaque lens barrel which holds the entire lens unit and the transparent resin lenses are joined by welding.