Abstract: According to one embodiment, in a semiconductor memory device including a first chip and a second chip. The first chip includes a first stacked body, a first semiconductor film, a second stacked body, a second semiconductor film, a contact plug and a first planar wiring line. The contact plug extends in the third direction between the first stacked body and the second stacked body. The first planar wiring line is disposed on a side opposite to the second chip with respect to the first stacked body, the contact plug, and the second stacked body, the first planar wiring line extending in the first direction and the second direction, covering at least the contact plug, and being connected to the contact plug.

Abstract: An information processing apparatus includes detecting a predetermined object from a captured image, identifying an attribute of the detected object, determining a presentation method of presented information representing the attribute based on a detection state of the detected object, displaying the presented information and the captured image based on the determined presentation method.

Abstract: An information processing apparatus determines luminance of a pattern given as an index to an experience area of a real space, based on a threshold in case of detecting a feature of an image, and generates an image of the pattern of the determined luminance.

Abstract: An information processing apparatus includes detecting a predetermined object from a captured image, identifying an attribute of the detected object, determining a presentation method of presented information representing the attribute based on a detection state of the detected object, displaying the presented information and the captured image based on the determined presentation method.

Abstract: An information processing apparatus acquires an image by imaging an imaging apparatus, detects an occurrence of a factor that influences a position and orientation estimation relating to an image, determines whether or not to register the acquired image based on the detected factor, and constructs an image database for estimating the position and orientation of the imaging apparatus from the image acquired by the acquisition unit using a group of images determined to be registered.

Abstract: A three-dimensional measurement apparatus including: a projection unit configured to project a pattern onto a measurement target object from one or more projection directions; and an image capturing unit configured to obtain one or more captured images by capturing an image of the measurement target object from one or more view points. The three-dimensional measurement apparatus obtains a position of the pattern projected onto the measurement target object based on the one or more captured images obtained by the image capturing unit, and calculates three-dimensional coordinates of a surface of the measurement target object based on the position of the pattern obtained from the one or more captured images and a position of the pattern estimated based on a parameter set that represents internal scattering of the measurement target object.

Abstract: An information processing apparatus acquires an image by imaging an imaging apparatus, detects an occurrence of a factor that influences a position and orientation estimation relating to an image, determines whether or not to register the acquired image based on the detected factor, and constructs an image database for estimating the position and orientation of the imaging apparatus from the image acquired by the acquisition unit using a group of images determined to be registered.

Abstract: An information processing apparatus determines luminance of a pattern given as an index to an experience area of a real space, based on a threshold in case of detecting a feature of an image, and generates an image of the pattern of the determined luminance.

Abstract: A shape of an object is measured using a plurality of space encoding patterns each of which includes a light portion and a dark portion. A first and second pattern sets are obtained. The first set comprises patterns each of which has the light portion of each space encoding pattern masked by a pattern mask. The second set comprises patterns each of which has the light portion of each of the space encoding pattern masked by a mask with varying the mask pattern. Captured images of an object on which the patterns of the first and second sets are sequentially projected are inputted. A correspondence between projection coordinates of the projected pattern and image coordinates of a captured image for the projected pattern is detected. A shape of the object is derived based on correspondences.

Abstract: A first image of a space onto which a first light pattern formed from bright and dark portions and a coordinate-detection pattern projected onto each region of the space divided by the first pattern have been projected is acquired. A second image is acquired of the space onto which a second light pattern having a boundary position between bright and dark portions that is different from that of the first pattern, and a coordinate-detection pattern projected onto each region of the space divided by the second pattern have been projected. One of the first image and the second image is selected to perform three-dimensional shape measurement of an object included in the space based on the selection image.

Abstract: A three-dimensional measurement apparatus including: a projection unit configured to project a pattern onto a measurement target object from one or more projection directions; and an image capturing unit configured to obtain one or more captured images by capturing an image of the measurement target object from one or more view points. The three-dimensional measurement apparatus obtains a position of the pattern projected onto the measurement target object based on the one or more captured images obtained by the image capturing unit, and calculates three-dimensional coordinates of a surface of the measurement target object based on the position of the pattern obtained from the one or more captured images and a position of the pattern estimated based on a parameter set that represents internal scattering of the measurement target object.

Abstract: A shape of an object is measured using a plurality of space encoding patterns each of which includes a light portion and a dark portion. A first and second pattern sets are obtained. The first set comprises patterns each of which has the light portion of each space encoding pattern masked by a pattern mask. The second set comprises patterns each of which has the light portion of each of the space encoding pattern masked by a mask with varying the mask pattern. Captured images of an object on which the patterns of the first and second sets are sequentially projected are inputted. A correspondence between projection coordinates of the projected pattern and image coordinates of a captured image for the projected pattern is detected. A shape of the object is derived based on correspondences.

Abstract: Images are obtained from an imaging device. The images represent patterns projected in a time series by a projection device. Each pattern comprises dashed lines each of which has a predetermined width. A longitudinal direction of each dashed line is substantially perpendicular to a base line defined by a segment connecting optical centers of the projection and imaging devices. Each dashed line repeats light and dark in the longitudinal direction. The dashed lines are discriminated based on combinations of the light and dark in the images. Correspondences between projected coordinates and image coordinates of the dashed lines are detected based on information regarding the patterns and a discrimination result of the dashed lines. A three-dimensional shape of the object is calculated based on the correspondences, and calibration data of the projection and imaging devices.

Abstract: A first image of a space onto which a first light pattern formed from bright and dark portions and a coordinate-detection pattern projected onto each region of the space divided by the first pattern have been projected is acquired. A second image is acquired of the space onto which a second light pattern having a boundary position between bright and dark portions that is different from that of the first pattern, and a coordinate-detection pattern projected onto each region of the space divided by the second pattern have been projected. One of the first image and the second image is selected to perform three-dimensional shape measurement of an object included in the space based on the selection image.

Abstract: A defect inspecting apparatus comprising: an inspection region dividing section which divides a defect inspection region of a wafer on which a circuit pattern is formed into a plurality of inspection subregions; a pattern density calculating section which calculates the pattern density of each of the inspection subregions on the basis of design data of the circuit pattern; an inspection execution region and sensitivity rank setting section which assigns a sensitivity rank based on the pattern density to a plurality of inspection execution regions, each including a plurality of the inspection subregions; and a defect inspecting section which sets an inspection parameter on the basis of sensitivity ranks of the inspection execution regions and inspects the inspection execution regions for a defect.

Abstract: A defect inspecting apparatus comprising: an inspection region dividing section which divides a defect inspection region of a wafer on which a circuit pattern is formed into a plurality of inspection subregions; a pattern density calculating section which calculates the pattern density of each of the inspection subregions on the basis of design data of the circuit pattern; an inspection execution region and sensitivity rank setting section which assigns a sensitivity rank based on the pattern density to a plurality of inspection execution regions, each including a plurality of the inspection subregions; and a defect inspecting section which sets an inspection parameter on the basis of sensitivity ranks of the inspection execution regions and inspects the inspection execution regions for a defect.

Abstract: A revolving block having an inclination correcting mechanism housed therein is adapted to revolvably support a working implement, such as a ladder or boom, mounted on a high place working vehicle.