Patents by Inventor Masayuki Akiba

Masayuki Akiba has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Encapsulated stack of dice and support therefor
    Patent number: 7132739
    Abstract: Systems and methods for encapsulating a stack of semiconductor dice are described. A stack of semiconductor dice may be formed, for example by attaching die to flexible printed circuit supports attached to frames and stacking the supports, and then encapsulated by flowing a liquid encapsulant around the stack of dice and solidifying the liquid encapsulant. The die supports may contain encapsulant flow openings, such as rectangular slits, that allow the liquid encapsulant to flow around the stack of dice.
    Type: Grant
    Filed: October 28, 2004
    Date of Patent: November 7, 2006
    Assignee: Intel Corporation
    Inventors: Masayuki Akiba, Kinya Ichikawa, Jiro Kubota, Takashi Kumamoto
  • Encapsulation of a stack of semiconductor dice
    Patent number: 7132311
    Abstract: Systems and methods for encapsulating a stack of semiconductor dice are described. A stack of semiconductor dice may be formed, for example by attaching die to flexible printed circuit supports attached to frames and stacking the supports, and then encapsulated by flowing a liquid encapsulant around the stack of dice and solidifying the liquid encapsulant. The die supports may contain encapsulant flow openings, such as rectangular slits, that allow the liquid encapsulant to flow around the stack of dice.
    Type: Grant
    Filed: July 26, 2002
    Date of Patent: November 7, 2006
    Assignee: Intel Corporation
    Inventors: Masayuki Akiba, Kinya Ichikawa, Jiro Kubota, Takashi Kumamoto
  • Encapsulated stack of dice and support therefor
    Publication number: 20050085034
    Abstract: Systems and methods for encapsulating a stack of semiconductor dice are described. A stack of semiconductor dice may be formed, for example by attaching die to flexible printed circuit supports attached to frames and stacking the supports, and then encapsulated by flowing a liquid encapsulant around the stack of dice and solidifying the liquid encapsulant. The die supports may contain encapsulant flow openings, such as rectangular slits, that allow the liquid encapsulant to flow around the stack of dice.
    Type: Application
    Filed: October 28, 2004
    Publication date: April 21, 2005
    Inventors: Masayuki Akiba, Kinya Ichikawa, Jiro Kubota, Takashi Kumamoto
  • Encapsulation of a stack of semiconductor dice
    Publication number: 20040016939
    Abstract: Systems and methods for encapsulating a stack of semiconductor dice are described. A stack of semiconductor dice may be formed, for example by attaching die to flexible printed circuit supports attached to frames and stacking the supports, and then encapsulated by flowing a liquid encapsulant around the stack of dice and solidifying the liquid encapsulant. The die supports may contain encapsulant flow openings, such as rectangular slits, that allow the liquid encapsulant to flow around the stack of dice.
    Type: Application
    Filed: July 26, 2002
    Publication date: January 29, 2004
    Inventors: Masayuki Akiba, Kinya Ichikawa, Jiro Kubota, Takashi Kumamoto