Abstract: A radiant heater device has an electrode embedded in a substrate part and a plurality of heating parts. The electrodes are formed by material that has low specific resistance. An area occupied by the electrode is restricted. The heating parts are formed by material having high specific resistance in order to generate heat so that radiation is produced. The electrode and the heating part are electrically connected within the substrate part. The plurality of heating parts are arranged in parallel between a pair of electrodes. The electrodes and the heating parts are formed in a film-like shape, and the thermal capacity is reduced. As a result, a temperature of the heating parts rises promptly in response to a turning on of power. In addition, the temperature of the heating parts promptly decreases when an object comes into contact therewith.

Abstract: At a shift device, at a time when a shift position of a lever is a “D” position, a knob is slid toward a right side with respect to a lever main body, and the shift position of the lever is changed to an “M” position. Here, the knob is slid with respect to the lever main body. Therefore, changes in posture of the knob can be restricted, and operability of the knob can be improved.

Abstract: Diversity is provided to an output mode of recommendation information. A terminal apparatus (2) includes a recommendation information acquisition unit (208) that selects a layout at which recommendation information is output, from among a plurality of pieces of layout information (114), and a recommendation screen generation unit (208) that output the recommendation information at the selected layout.

Abstract: A radiant heater device has an electrode embedded in a substrate part and a plurality of heating parts. The electrodes are formed by material that has low specific resistance. An area occupied by the electrode is restricted. The heating parts are formed by material having high specific resistance in order to generate heat so that radiation is produced. The electrode and the heating part are electrically connected within the substrate part. The plurality of heating parts are arranged in parallel between a pair of electrodes. The electrodes and the heating parts are formed in a film-like shape, and the thermal capacity is reduced. As a result, a temperature of the heating parts rises promptly in response to a turning on of power. In addition, the temperature of the heating parts promptly decreases when an object comes into contact therewith.

Abstract: According to one embodiment, a wiring substrate includes a second wiring layer, including a plurality of metal lands provided on a second surface of an insulating base material, and an insulating layer formed on the second surface of the insulating base material and including openings exposing the plurality of metal lands. The metal land includes a center portion with a first height and an outer peripheral portion with a second height lower than the first height, which is provided at least about the periphery of the insulating base. The openings expose the metal lands, such that the center portion of the metal land is exposed and at least a portion of the outer peripheral portion of the metal land is covered with the insulating layer.

Abstract: A pattern (6B) is formed by performing selective exposure and development on a photosensitive resist (6A), and then the pattern (6B) is decolorized by irradiating the pattern with ultraviolet or visible light. Then, a microlens (6) is formed by deforming the shape of the pattern (6B) into a microlens shape by heating. An inequality of h/a?1 is satisfied, where, (h) is the height of the microlens (6), and (2a) is the length of the bottom plane of the microlens (6) in a short side direction when viewed from the upper plane.

Abstract: A multilayer printed circuit board with a built-in capacitor includes a plurality of resin films, each of which is made of thermoplastic resin and has a plurality of via-holes at predetermined positions, a plurality of conductive patterns, which are located on the resin films, and a plurality of conductive pattern interconnecting members, which are located in the via-holes to electrically interconnect the conductive patterns that are electrically separated by the resin films. Two of the conductive patterns are respectively located on two surfaces, which are opposite to each other, of one of the resin films while overlapping. The two of the conductive patterns and the one of the resin films make up a capacitor.

Abstract: A multilayer printed circuit board with a built-in capacitor includes a plurality of resin films, each of which is made of thermoplastic resin and has a plurality of via-holes at predetermined positions, a plurality of conductive patterns, which are located on the resin films, and a plurality of conductive pattern interconnecting members, which are located in the via-holes to electrically interconnect the conductive patterns that are electrically separated by the resin films. Two of the conductive patterns are respectively located on two surfaces, which are opposite to each other, of one of the resin films while overlapping. The two of the conductive patterns and the one of the resin films make up a capacitor.

Abstract: An electronic component unit includes an interposer with a plurality of holes and a circuit wiring layer disposed on one surface of the interposer. The electronic component is electrically connected to the circuit wiring layer. A plurality of solder bumps are electrically connected to one surface of the circuit wiring layer through the holes formed in the interposer. The circuit wiring layer is electrically connected to an outside circuit through the solder bumps. A junction interface between the circuit wiring layer and each of the solder bumps is made of ductile metal.

Abstract: In an electronic-component mounting structure, an electronic component (2) has a surface. First electrodes (1) provided on the surface of the electronic component (2) are arranged in a first array. Second electrodes (3) provided on a base board (4) are arranged in a second array corresponding to the first array. The second electrodes (3) correspond to the first electrodes (1) respectively. Solder bumps (9) connect the first electrodes (1) and the second electrodes (3) respectively. The first electrodes (1) include first outermost electrodes (1b) located in an outer area of the first array. The second electrodes (3) include second outermost electrodes (3b, 3c) located in an outer area of the second array. The second outermost electrodes (3b, 3c) correspond to the first outermost electrodes (1b) respectively.

Abstract: A BGA package is mounted on a multi-layer printed wiring board having a plurality of electrodes arranged in a matrix form through a plurality of solder bumps. In the most externally-located electrodes, a lead wire is formed to extend from a portion of the most-externally-located electrode located inside of a polygon formed by connecting each of the centers of adjacent most-externally-located electrodes. Therefore, the solder bumps are prevented from coming off the most-externally-located electrodes because a portion of the most-externally-located electrode to which stress caused by an external shock is intensively applied is located in an outside of the polygon. Thus, a contact failure between the BGA package and the multi-layer printed wiring board is prevented.

Abstract: A BGA package is mounted on a multi-layer printed wiring board having a plurality of electrodes arranged in a matrix form through a plurality of solder bumps. In the most externally-located electrodes, a lead wire is formed to extend from a portion of the most-externally-located electrode located inside of a polygon formed by connecting each of the centers of adjacent most-externally-located electrodes. Therefore, the solder bumps are prevented from coming off the most-externally-located electrodes because a portion of the most-externally-located electrode to which stress caused by an external shock is intensively applied is located in an outside of the polygon. Thus, a contact failure between the BGA package and the multi-layer printed wiring board is prevented.

Abstract: A printed circuit board has a layer including a resin material, which has a tensile breaking strain of approximately 1% or more at a tensile strain rate of 40%/sec at 25° C., and an Izod impact strength of approximately 1 kgf·cm/cm or more at 25° C. Otherwise, the resin material has a peak value of dynamic loss tangent of 0.05 or more in a range of −100° C. to −50° C. by &bgr; relaxation, and a peak value of dynamic loss tangent of 0.02 or more in a range of 0° C. to 100° C. by &bgr;′ relaxation in a dynamic viscoelasticity spectral measurement. Accordingly, thermal shock resistance and drop shock resistance of the printed circuit board can be improved.

Abstract: An aqueous liquid composition for treating the surface of copper-containing metals is a dispersion and/or solution in water and organic solvent, at least one silane coupling agent having a functional moiety selected from vinyl, mercapto, amino and glycidyloxy moieties bonded to one carbon atom in the silane coupling agent and other epoxy moieties bonded to two adjacent carbon atoms in the silane coupling agent and at least one copper inhibitor compound selected from azoles, azines, aromatic secondary amines, and aromatic diacylhydrazides. Treatment with this composition provides excellent migration resistance, an excellent solder resistance, and a very durable adhesiveness to a variety of copper containing metal surfaces.

Abstract: A chromium-free aqueous liquid surface treatment agent that can impart both a good corrosion resistance and a good paint adherence to zinciferous-plated steel sheet contains as its essential components polyhydroxyaryl carboxylic acid and/or depside thereof and silane coupling agent with the formula (YR).sub.m R.sub.n SiX.sub.(4-m-n), in which R denotes alkyl groups; X is the methoxy or ethoxy group; Y is the vinyl, amino, mercapto, glycidoxy, or methacryloxy group; m=1 to 3; and n=0 to (3-m). The total content of said essential components is preferably 1 to 50 weight %.