Abstract: A vehicle display device includes a light emitting device having a light emitting portion that is linear and that is provided at a front side of a vehicle cabin such that direct light that is emitted can be seen by a driver. The light emitting portion is disposed at a height position that is configured to be further toward a lower side than a visual field of the driver in a case in which the driver drives while looking straight ahead.

Abstract: A vehicle display device includes a light emitting device having a light emitting portion that is linear and that is provided at a front side of a vehicle cabin such that direct light that is emitted can be seen by a driver. The light emitting portion is disposed at a height position that is configured to be further toward a lower side than a visual field of the driver in a case in which the driver drives while looking straight ahead.

Abstract: A vehicle instrument panel reinforcement capable of raising ease of vehicle installation is provided. The instrument panel reinforcement is formed with a cross-section profile of square shaped closed cross-section profile from an upper member and a lower member, is disposed along a vehicle width direction at the inside of a vehicle instrument panel. Plural first protruding portions are formed to one end portion of the upper member, and plural first projection portions are formed to another end portion thereof. Similarly, plural second protruding portions are formed to one end portion of the lower member and plural second projection portions are formed to another end portion thereof. The first protruding portions and the second projection portions, and the first projection portions and the second protruding portions, are projection welded together at plural points simultaneously.

Abstract: A yeast including a cell wall having a low mannan content, wherein the yeast has an immunopotentiating capability, and is able to grow in a YPD liquid medium with an osmotic pressure of 300 mOsm, and wherein, when a part of a pre-culture of the yeast grown in a YPDS liquid medium is added to the YPD liquid medium so that OD660 is adjusted to 0.1, followed by incubating at 30° C. for 24 hours, the yeast grows to increase the OD660 of the YPD liquid medium to 1.0 or more.

Abstract: A bead inspection step and a bead inspection apparatus that inspect the quality of a bead are disclosed . . . . The bead inspection apparatus includes a wire-feed-speed measurement device that measures the feed speed of a brazing wire, and an analysis portion that measures and analyzes position coordinate data about surfaces of a first, workpiece, a second workpiece and the bead, and performs a first shape data measurement step of. measuring first shape data before brazing, a second shape data measurement step of measuring second shape data after the brazing, a feature quantity calculation step of calculating predicted values of feature quantities based on the first and second shape data and the brazing wire feed speed, and a throat thickness calculation step of calculating a predicted value of the throat thickness by a regression expression formed based on actual measurements of the feature quantities and of the throat thickness.

Abstract: A vehicle instrument panel reinforcement capable of raising ease of vehicle installation is provided. The instrument panel reinforcement is formed with a cross-section profile of square shaped closed cross-section profile from an upper member and a lower member, is disposed along a vehicle width direction at the inside of a vehicle instrument panel. Plural first protruding portions are formed to one end portion of the upper member, and plural first projection portions are formed to another end portion thereof. Similarly, plural second protruding portions are formed to one end portion of the lower member and plural second projection portions are formed to another end portion thereof. The first protruding portions and the second projection portions, and the first projection portions and the second protruding portions, are projection welded together at plural points simultaneously.

Abstract: There is provided a laser dicing apparatus comprising: a first position detecting device detecting a position of the surface of a wafer at an incident point of laser light; second position detecting device detecting in advance a position of the surface of the wafer; and a control section controlling the position in the thickness direction of a condensing point inside the wafer, wherein the control section, when scanning the laser light from the outside of a periphery of the wafer to the inside of the periphery of the wafer, performs control based on data obtained with the second position detecting device detecting the position of the condensing point at the periphery of the wafer, and after scanning a predetermined distance, switches to perform control based on data obtained by the first position detecting device.

Abstract: A bead inspection step and a bead inspection apparatus that inspect the quality of a bead are disclosed . . . . The bead inspection apparatus includes a wire-feed-speed measurement device that measures the feed speed of a brazing wire, and an analysis portion that measures and analyzes position coordinate data about surfaces of a first, workpiece, a second workpiece and the bead, and performs a first shape data measurement step of. measuring first shape data before brazing, a second shape data measurement step of measuring second shape data after the brazing, a feature quantity calculation step of calculating predicted values of feature quantities based on the first and second shape data and the brazing wire feed speed, and a throat thickness calculation step of calculating a predicted value of the throat thickness by a regression expression formed based on actual measurements of the feature quantities and of the throat thickness.

Abstract: An adhesive sheet (S) is expanded by expanding means (20) with a plate-like article (W) being mounted to a frame (F) after dicing of the plate-like article (W) to increase spacings between individual chips (T), an expanded state of the adhesive sheet (S) is maintained by expansion maintaining means (10), so that the plate-like article (W) is able to be conveyed together with the frame (F) with the spacings between the chips (T) being maintained, thereby preventing adjacent chips (T) from interfering with each other during the conveyance. This allows the plate-like article (W) after the dicing to be conveyed together with the frame (F) without edges of the adjacent chips (T) coming into contact with each other by vibration during the conveyance to cause chipping or microcracks in the edges.

Abstract: An adhesive sheet (S) is expanded by an expanding mechanism (20) with a plate-like article (W) being mounted to a frame (F) after dicing of the plate-like article (W) to increase spacings between individual chips (T), an expanded state of the adhesive sheet (S) is maintained by an expansion maintaining device (10), so that the plate-like article (W) is able to be conveyed together with the frame (F) with the spacings between the chips (T) being maintained, thereby preventing adjacent chips (T) from interfering with each other during the conveyance. This allows the plate-like article (W), after the dicing, to be conveyed together with the frame (F) without edges of the adjacent chips (T) coming into contact with each other by vibration during the conveyance, thereby avoiding the causing of chipping or microcracks in the edges.

Abstract: A yeast including a cell wall having a low mannan content, wherein the yeast has an immunopotentiating capability, and is able to grow in a YPD liquid medium with an osmotic pressure of 300 mOsm, and wherein, when a part of a pre-culture of the yeast grown in a YPDS liquid medium is added to the YPD liquid medium so that OD660 is adjusted to 0.1, followed by incubating at 30° C. for 24 hours, the yeast grows to increase the OD660 of the YPD liquid medium to 1.0 or more.

Abstract: In a method and an apparatus for dividing a plate-like member related to the present invention, multiple substrates are obtained by forming a linear modified region on a surface of a plate-like member formed from a hard and brittle material or in the interior of the plate-like member and dividing the plate-like member along this modified region. The method for dividing a plate-like member includes a tape sticking step which involves sticking tape on the surface of the plate-like member, a modified region forming step which involves forming a modified region on surface of the plate-like member or in the interior of the plate-like member, and an expanding step which involves elongating the tape by applying a tension thereto after the modified region forming step. In the expanding step, the tape is irradiated with UV rays. As a result of this, it is possible to positively manufacture an ultrathin chip with a good end-face shape in which uncut portions, chipping and breakage do not occur.

Abstract: An adhesive sheet (S) is expanded by an expanding mechanism (20) with a plate-like article (W) being mounted to a frame (F) after dicing of the plate-like article (W) to increase spacings between individual chips (T), an expanded state of the adhesive sheet (S) is maintained by an expansion maintaining device (10), so that the plate-like article (W) is able to be conveyed together with the frame (F) with the spacings between the chips (T) being maintained, thereby preventing adjacent chips (T) from interfering with each other during the conveyance. This allows the plate-like article (W), after the dicing, to be conveyed together with the frame (F) without edges of the adjacent chips (T) coming into contact with each other by vibration during the conveyance, thereby avoiding the causing of chipping or microcracks in the edges.

Abstract: There is provided a dicing apparatus comprising: a dicing section; an expanding section expanding spaces between individual chips which are diced by expanding a dicing sheet; and an inspection device confirming a diced and expanded state of a wafer. Thereby, the processing from the start of the dicing process to the end of the expanding process can be performed in a short period of time, and the dicing processing of subsequent wafer can be performed while the state of the diced wafer is confirmed.

Abstract: In a method and an apparatus for dividing a plate-like member related to the present invention, multiple substrates are obtained by forming a linear modified region on a surface of a plate-like member formed from a hard and brittle material or in the interior of the plate-like member and dividing the plate-like member along this modified region. The method for dividing a plate-like member includes a tape sticking step which involves sticking tape on the surface of the plate-like member, a modified region forming step which involves forming a modified region on surface of the plate-like member or in the interior of the plate-like member, and an expanding step which involves elongating the tape by applying a tension thereto after the modified region forming step. In the expanding step, the tape is irradiated with UV rays. As a result of this, it is possible to positively manufacture an ultrathin chip with a good end-face shape in which uncut portions, chipping and breakage do not occur.

Abstract: There is provided a laser dicing apparatus comprising: a first position detecting device detecting a position of the surface of a wafer at an incident point of laser light; second position detecting device detecting in advance a position of the surface of the wafer; and a control section controlling the position in the thickness direction of a condensing point inside the wafer, wherein the control section, when scanning the laser light from the outside of a periphery of the wafer to the inside of the periphery of the wafer, performs control based on data obtained with the second position detecting device detecting the position of the condensing point at the periphery of the wafer, and after scanning a predetermined distance, switches to perform control based on data obtained by the first position detecting device.

Abstract: A dicing machine including a flange cover which covers the blade and is divided into two such that a first cover is openable. An interlock device is provided so that a blade attaching and detaching device cannot be attached when the first cover is at the closing position, the first cover cannot turn to the closing position when the blade attaching and detaching device is attached, and the processing of the work is not started when detected radiation of a blade breakage detector, attached to the first cover, is not reduced by a predetermined amount. Consequently, the blade and the work are prevented from being damaged by processing the work without applying coolant, the mechanism of the dicing machine and the blade attaching and detaching device are prevented from being damaged without detaching the blade attaching and detaching device, and the work is prevented from being being unprocessed.

Abstract: In the cutting solution supplying and controlling apparatus for a dicing machine, a flow rate adjusting device is provided in addition to a regulator as the pressure adjusting device. The flow rate adjusting device has a flow rate controller, which controls a proportional solenoid valve according to a signal applied from a flow rate sensor as a feedback signal. Thus, even if the pressure of the water supplied from the water supply equipment of the factory changes, the flow rates of the cutting solution and the coolant are maintained. Moreover, the flow rates can be easily adjusted according to the type of work to be processed.

Abstract: The flange cover covering the blade is divided into two. The second cover is turnably connected to the first cover through a shaft parallel with the spindle of the blade, and the second cover is opened and closed in connection with vertical movement of the spindle. When the spindle is moved upward for replacing the blade, the second cover is automatically turned to the opening position, and L-shaped coolant jetting nozzles are moved away from positions below the blade to positions beside the blade. Thus, the blade can be easily replaced, and an automatic blade replacing system can be applied.

Abstract: Two imaging equipment are provided at a pair of cutting blade units, and the two imaging equipment image patterns at first positions in proximity to the center of a wafer at the same time. A controller drives drive mechanisms to align the wafer in such a way that current image patterns at the first positions can match with a reference pattern at the first positions. Then, the two imaging equipment are moved to positions for imaging patterns at second positions at the outer circumference of the wafer to image the patterns at the second positions. The controller drives the drive mecha- nisms to align the wafer in such a way that current image patterns at the second positions can match with a reference pattern at the second positions.