Abstract: A semiconductor device includes a conductive film containing molybdenum and a metal element. The metal element has a melting point lower than the melting point of molybdenum and forms a complete solid solution with molybdenum. The metal element as a material for composing the conductive film is at least one selected from the group consisting of, for example, titanium, vanadium, and niobium.

Abstract: A bearing housing (6) for receiving a rolling contact bearing (3) is formed to be integral with the main frame (4), the outer flange portion (5b) of a clutch housing (5) for receiving the roller clutch (2) and the inner flange portion (6b) of the bearing housing (6) axially engage each other through an annular member (7) of resin or rubber, notch portions (5d) and tooth portions (6c) circumferentially engageable with each other are distributively provided in the clutch housing (5) and the bearing housing (6), and radial and axial clearances (S1) and (S2) are formed for floating the clutch housing (5) relative to the bearing housing (6).