Patents by Inventor Masayuki Funakoshi

Masayuki Funakoshi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11410911
    Abstract: A semiconductor module such that warping or distortion is prevented, and reliability can be increased, is obtained. The semiconductor module includes a base configuring a multiple of terminals or wires, a semiconductor switching element mounted on a mounting portion of the terminal, and a molded resin that seals the semiconductor switching element, wherein a wide portion having a width greater than that of the terminal or the wire is formed in one portion of the terminal or the wire in an outer peripheral side end portion of the molded resin, and the wide portion is embedded and fixed in an interior of the molded resin in a state extended toward the interior from the outer peripheral side end portion of the molded resin.
    Type: Grant
    Filed: August 2, 2018
    Date of Patent: August 9, 2022
    Assignee: Mitsubishi Electric Corporation
    Inventors: Kensuke Takeuchi, Masayuki Funakoshi, Takashi Nagao
  • Patent number: 11302597
    Abstract: A semiconductor device is provided with a heat dissipating face side skirt portion, which is a frame-form projection, on a heat dissipating face of a lead frame. Because of this, creepage distance increases with a small increase in an amount of resin, and insulating properties improve. Also, the heat dissipating face side skirt portion is molded via two transfer molding steps, wettability of the second molding resin with respect to a first molding resin and the lead frame increases, and adhesion improves. Furthermore, an end face of an inner lead is exposed in an element sealing portion on a mounting face side, and covered with a second thin molded portion molded using the second molding resin, whereby heat generated in a semiconductor element can efficiently be caused to escape from faces of both a first thin molded portion and the second thin molded portion, because of which heat dissipation improves.
    Type: Grant
    Filed: September 21, 2017
    Date of Patent: April 12, 2022
    Assignee: Mitsubishi Electric Corporation
    Inventors: Takanobu Kajihara, Katsuhiko Omae, Takashi Nagao, Masayuki Funakoshi, Norio Emi, Atsuki Fujita, Yuki Okabe
  • Publication number: 20210217687
    Abstract: A semiconductor module includes a semiconductor switching element, a multiple of bases, on at least one of which the semiconductor switching element is mounted, a molded resin that seals the semiconductor switching element and the multiple of bases, a multiple of terminals formed integrally with each one of the multiple of bases and provided extending from an outer periphery side face of the molded resin, and a recessed portion or a protruding portion having a depth or a height such that creepage distance between the multiple of terminals is secured, and formed so as to cross an interval between the multiple of terminals, in one portion of the outer periphery side face of the molded resin between the multiple of terminals.
    Type: Application
    Filed: August 20, 2018
    Publication date: July 15, 2021
    Applicant: Mitsubishi Electric Corporation
    Inventors: Kensuke TAKEUCHI, Masayuki FUNAKOSHI, Takashi NAGAO
  • Publication number: 20210151362
    Abstract: A semiconductor module (1) such that warping or distortion is prevented, and reliability can be increased, is obtained. The semiconductor module (1) includes a base (10a) configuring a multiple of terminals (C1 to C6, B1, B2, M1, M2) or wires (G1, G2), a semiconductor switching element (T1 to T4) mounted on a mounting portion (21) of the terminal (C1 to C6, B1, B2, M1, M2), and a molded resin (20) that seals the semiconductor switching element (T1 to T4), wherein a wide portion (G10, G20) having a width greater than that of the terminal (C1 to C6, B1, B2, M1, M2) or the wire (G1, G2) is formed in one portion of the terminal (C1 to C6, B1, B2, M1, M2) or the wire (G1, G2) in an outer peripheral side end portion of the molded resin (20), and the wide portion (G10, G20) is embedded and fixed in an interior of the molded resin (20) in a state extended toward the interior from the outer peripheral side end portion of the molded resin (20).
    Type: Application
    Filed: August 2, 2018
    Publication date: May 20, 2021
    Applicant: Mitsubishi Electric Corporation
    Inventors: Kensuke TAKEUCHI, Masayuki FUNAKOSHI, Takashi NAGAO
  • Publication number: 20210125891
    Abstract: A semiconductor device is provided with a heat dissipating face side skirt portion, which is a frame-form projection, on a heat dissipating face of a lead frame. Because of this, creepage distance increases with a small increase in an amount of resin, and insulating properties improve. Also, the heat dissipating face side skirt portion is molded via two transfer molding steps, wettability of the second molding resin with respect to a first molding resin and the lead frame increases, and adhesion improves. Furthermore, an end face of an inner lead is exposed in an element sealing portion on a mounting face side, and covered with a second thin molded portion molded using the second molding resin, whereby heat generated in a semiconductor element can efficiently be caused to escape from faces of both a first thin molded portion and the second thin molded portion, because of which heat dissipation improves.
    Type: Application
    Filed: September 21, 2017
    Publication date: April 29, 2021
    Applicant: Mitsubishi Electric Corporation
    Inventors: Takanobu KAJIHARA, Katsuhiko OMAE, Takashi NAGAO, Masayuki FUNAKOSHI, Norio EMI, Atsuki FUJITA, Yuki OKABE
  • Patent number: 10950560
    Abstract: Lands (11c and 11d) are parts of base plates (104c and 104d), and electrodes of a shunt resistor (103U) are put on and connected to the lands (11c and 11d). Slits (130 and 131) are formed in the lands (11c and 11d) to separate a main electric circuit in which a main current flows and control terminals (123 and 124) with which the electric potentials of the electrodes of the shunt resistor (103U) are detected. Leading end portions of the slits (130 and 131) extend to the vicinity of the electrodes of the shunt resistor (103U).
    Type: Grant
    Filed: May 6, 2019
    Date of Patent: March 16, 2021
    Assignee: Mitsubishi Electric Corporation
    Inventors: Katsuhiko Omae, Masayuki Funakoshi, Kensuke Takeuchi
  • Publication number: 20190371745
    Abstract: Lands (11c and 11d) are parts of base plates (104c and 104d), and electrodes of a shunt resistor (103U) are put on and connected to the lands (11c and 11d). Slits (130 and 131) are formed in the lands (11c and 11d) to separate a main electric circuit in which a main current flows and control terminals (123 and 124) with which the electric potentials of the electrodes of the shunt resistor (103U) are detected. Leading end portions of the slits (130 and 131) extend to the vicinity of the electrodes of the shunt resistor (103U).
    Type: Application
    Filed: May 6, 2019
    Publication date: December 5, 2019
    Applicant: Mitsubishi Electric Corporation
    Inventors: Katsuhiko OMAE, Masayuki FUNAKOSHI, Kensuke TAKEUCHI
  • Patent number: 10164652
    Abstract: A first mode in which to output analog electricity quantities of objects one by one independently to an A/D converter, a second mode in which to output none of the analog electricity quantities of the objects, a third mode in which to output none of the analog electricity quantities of the objects and cause the output to the A/D converter to be resistor, and a fourth mode in which to output to the A/D converter a plurality of the analog electricity quantities of the objects at the same time, are caused to be generated, thus acquiring the A/D conversion values of the objects individually when in the first mode, and detecting an anomaly of the A/D converter itself or a device connected to the A/D converter when in the second mode to the fourth mode.
    Type: Grant
    Filed: November 11, 2015
    Date of Patent: December 25, 2018
    Assignee: Mitsubishi Electric Corporation
    Inventors: Yusuke Kobayashi, Takayasu Narukawa, Masaya Tsuneoka, Masayuki Funakoshi, Norihiro Yamaguchi, Takahiro Okanoue
  • Publication number: 20180241411
    Abstract: A first mode in which to output analog electricity quantities of objects one by one independently to an A/D converter, a second mode in which to output none of the analog electricity quantities of the objects, a third mode in which to output none of the analog electricity quantities of the objects and cause the output to the A/D converter to be resistor, and a fourth mode in which to output to the A/D converter a plurality of the analog electricity quantities of the objects at the same time, are caused to be generated, thus acquiring the A/D conversion values of the objects individually when in the first mode, and detecting an anomaly of the A/D converter itself or a device connected to the A/D converter when in the second mode to the fourth mode.
    Type: Application
    Filed: November 11, 2015
    Publication date: August 23, 2018
    Applicant: Mitsubishi Electric Corporation
    Inventors: Yusuke KOBAYASHI, Takayasu NARUKAWA, Masaya TSUNEOKA, Masayuki FUNAKOSHI, Norihiro YAMAGUCHI, Takahiro OKANOUE
  • Patent number: 9146261
    Abstract: An electronic device includes a current source for applying current, a pull-up resistor or a pull-down resistor configured to be connected to one of a plurality of data terminals, a voltage level detection circuit configured to detect voltage values of the plurality of data terminals, and a connected device determination circuit configured to determine a type of a power source device based on the voltage values of the plurality of data terminals detected by the voltage level detection circuit.
    Type: Grant
    Filed: September 5, 2013
    Date of Patent: September 29, 2015
    Assignee: RICOH ELECTRONIC DEVICES CO., LTD.
    Inventor: Masayuki Funakoshi
  • Publication number: 20140070791
    Abstract: An electronic device includes a current source for applying current, a pull-up resistor or a pull-down resistor configured to be connected to one of a plurality of data terminals, a voltage level detection circuit configured to detect voltage values of the plurality of data terminals, and a connected device determination circuit configured to determine a type of a power source device based on the voltage values of the plurality of data terminals detected by the voltage level detection circuit.
    Type: Application
    Filed: September 5, 2013
    Publication date: March 13, 2014
    Applicant: RICOH COMPANY, LTD.
    Inventor: Masayuki Funakoshi
  • Patent number: 6570614
    Abstract: An electronic still camera in which taken images are recorded onto a memory card has an LCD for image display, a RAM for image storage and a switch for image selection. Photographing is started before a direction to start recording is provided by the user. Photographing is continued even after the direction is provided and a predetermined number of images taken over a period spanning before and after the direction to start recording is provided are stored in the RAM. The images stored in the RAM are successively displayed on the LCD and the images which the user determines to be necessary and specifies by operating the switch are recorded onto the memory card.
    Type: Grant
    Filed: March 6, 1998
    Date of Patent: May 27, 2003
    Assignee: Minolta Co., Ltd.
    Inventors: Hiroaki Kubo, Katsuyuki Nanba, Naohiro Kageyama, Takuya Kishimoto, Masayuki Funakoshi