Patents by Inventor Masayuki FUSE

Masayuki FUSE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package
    Patent number: 8829632
    Abstract: A semiconductor package includes a wiring board, an electronic component mounted on the wiring board, and an enclosing frame arranged on an upper surface of the electronic component. The enclosing frame includes a basal portion, which has the form of a closed frame and extends along the upper surface of the electronic component, and an adhesion portion, which is wider than the basal portion and is arranged on the upper surface of the basal portion. A cap is adhered to an upper surface of the adhesion portion. A molding resin contacts a lower surface of the adhesion portion and seals the electronic component and the wiring board that are exposed from the enclosing frame.
    Type: Grant
    Filed: June 1, 2012
    Date of Patent: September 9, 2014
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Masayuki Fuse, Satoshi Matsuzawa
  • SEMICONDUCTOR PACKAGE
    Publication number: 20120313203
    Abstract: A semiconductor package includes a wiring board, an electronic component mounted on the wiring board, and an enclosing frame arranged on an upper surface of the electronic component. The enclosing frame includes a basal portion, which has the form of a closed frame and extends along the upper surface of the electronic component, and an adhesion portion, which is wider than the basal portion and is arranged on the upper surface of the basal portion. A cap is adhered to an upper surface of the adhesion portion. A molding resin contacts a lower surface of the adhesion portion and seals the electronic component and the wiring board that are exposed from the enclosing frame.
    Type: Application
    Filed: June 1, 2012
    Publication date: December 13, 2012
    Applicant: Shinko Electric Industries Co., Ltd.
    Inventors: Masayuki FUSE, Satoshi MATSUZAWA