Patents by Inventor Masayuki Hachiya
Masayuki Hachiya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20120287425Abstract: An object mounting mechanism includes: a plate member on which an object is mounted. Bumps are arranged on an upper surface of the plate member which faces a reverse face of the object. In addition, the bumps are arranged sparsely in an area of a surrounding part of the plate member and densely toward an area of a center part of the plate member.Type: ApplicationFiled: May 16, 2012Publication date: November 15, 2012Applicant: Hitachi High-Technologies CorporationInventors: Masami OOYAMA, Masayuki HACHIYA, Rieko HACHIYA, Kimiko HACHIYA, Kazuhiro ZAMA, Keiichi NAGASAKI
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Patent number: 8310667Abstract: A wafer surface inspection method and apparatus of high sensitivity, and free from performance degradation in terms of cleanliness, coordinate repeatability of foreign particles and the like. Gas for cooling is sprayed onto a laser irradiation position on the wafer surface to prevent an increase in temperature of the foreign particles and to suppress break-down of the foreign particles.Type: GrantFiled: August 6, 2008Date of Patent: November 13, 2012Assignee: Hitachi High-Technologies CorporationInventors: Kazuhiro Zama, Masayuki Hachiya
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Patent number: 8305568Abstract: Light from a light source becomes two illumination beams by a beam splitter. The beams are irradiated onto a semiconductor wafer from two mutually substantially orthogonal azimuthal angles having substantially equal elevation angles to form illumination spots. When the sum of scattered, diffracted, and reflected lights due to the illumination beams is detected, influence of the anisotropy which a contaminant particle and a defect existing in the wafer itself or thereon have with respect to an illumination direction, can be eliminated.Type: GrantFiled: February 22, 2011Date of Patent: November 6, 2012Assignee: Hitachi High-Technologies CorporationInventors: Shigeru Matsui, Masayuki Hachiya
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Publication number: 20120182547Abstract: A laser beam oscillated from a laser source is folded in its path by first and second plane mirrors and enters a beam expander. The surface of each plane mirror is deteriorated with illumination by the laser beam and the reflectance is reduced. To avoid a light quantity of the laser beam entering the beam expander from being reduced below a reference value, when the laser beam is illuminated over a certain time, a position on each of the first and second plane mirrors at which the laser beam is illuminated is changed by a structure for rotating and/or translating a reflecting surface of each plane mirror on a plane, which includes the plane mirror, while an optical axis is kept same. Thus, the useful life of each plane mirror can be prolonged without displacing the optical axis.Type: ApplicationFiled: March 28, 2012Publication date: July 19, 2012Applicant: Hitachi High-Technologies CorporationInventors: Noriyuki Aizawa, Hiroyuki Kawakami, Kazuhiro Zama, Kazuo Takashi, Yusuke Miyazaki, Shingo Tanaka, Yuuichiro Iijima, Masayuki Hachiya, Rieko Hachiya, Koichi Asami
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Patent number: 8203705Abstract: The invention is directed to detect a warp amount in a real-time manner in a wafer rotating at high speed under inspection.Type: GrantFiled: January 8, 2009Date of Patent: June 19, 2012Assignee: Hitachi-High Technologies CorporationInventors: Masami Ooyama, Masayuki Hachiya, Rieko Hachiya, legal representative, Kimiko Hachiya, legal representative, Kazuhiro Zama, Keiichi Nagasaki
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Patent number: 8184283Abstract: A laser beam oscillated from a laser source is folded in its path by first and second plane mirrors and enters a beam expander. The surface of each plane mirror is deteriorated with illumination by the laser beam and the reflectance is reduced. To avoid a light quantity of the laser beam entering the beam expander from being reduced below a reference value, when the laser beam is illuminated over a certain time, a position on each of the first and second plane mirrors at which the laser beam is illuminated is changed by a structure for rotating and/or translating a reflecting surface of each plane mirror on a plane, which includes the plane mirror, while an optical axis is kept same. Thus, the useful life of each plane mirror can be prolonged without displacing the optical axis.Type: GrantFiled: May 21, 2010Date of Patent: May 22, 2012Assignee: Hitachi High-Technologies CorporationInventors: Yuuichiro Iijima, Masayuki Hachiya, Rieko Hachiya, legal representative, Koichi Asami, Yusuke Miyazaki, Kazuhiro Zama
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Publication number: 20110141461Abstract: Light from a light source becomes two illumination beams by a beam splitter. The beams are irradiated onto a semiconductor wafer from two mutually substantially orthogonal azimuthal angles having substantially equal elevation angles to form illumination spots. When the sum of scattered, diffracted, and reflected lights due to the illumination beams is detected, influence of the anisotropy which a contaminant particle and a defect existing in the wafer itself or thereon have with respect to an illumination direction, can be eliminated.Type: ApplicationFiled: February 22, 2011Publication date: June 16, 2011Applicant: Hitachi High-Technologies CorporationInventors: Shigeru MATSUI, Masayuki Hachiya
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Patent number: 7916287Abstract: Light from a light source becomes two illumination beams by a beam splitter. The beams are irradiated onto a semiconductor wafer from two mutually substantially orthogonal azimuthal angles having substantially equal elevation angles to form illumination spots. When the sum of scattered, diffracted, and reflected lights due to the illumination beams is detected, influence of the anisotropy which a contaminant particle and a defect existing in the wafer itself or thereon have with respect to an illumination direction, can be eliminated.Type: GrantFiled: April 6, 2010Date of Patent: March 29, 2011Assignee: Hitachi High-Technologies CorporationInventors: Shigeru Matsui, Masayuki Hachiya
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Publication number: 20100188656Abstract: Light from a light source becomes two illumination beams by a beam splitter. The beams are irradiated onto a semiconductor wafer from two mutually substantially orthogonal azimuthal angles having substantially equal elevation angles to form illumination spots. When the sum of scattered, diffracted, and reflected lights due to the illumination beams is detected, influence of the anisotropy which a contaminant particle and a defect existing in the wafer itself or thereon have with respect to an illumination direction, can be eliminated.Type: ApplicationFiled: April 6, 2010Publication date: July 29, 2010Applicant: Hitachi High-Technologies CorporationInventors: Shigeru MATSUI, Masayuki Hachiya
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Patent number: 7719669Abstract: Light from a light source becomes two illumination beams by a beam splitter. The beams are irradiated onto a semiconductor wafer from two mutually substantially orthogonal azimuthal angles having substantially equal elevation angles to form illumination spots. When the sum of scattered, diffracted, and reflected lights due to the illumination beams is detected, influence of the anisotropy which a contaminant particle and a defect existing in the wafer itself or thereon have with respect to an illumination direction, can be eliminated.Type: GrantFiled: July 12, 2007Date of Patent: May 18, 2010Assignee: Hitachi High-Technologies CorporationInventors: Shigeru Matsui, Masayuki Hachiya
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Publication number: 20090187354Abstract: The invention is directed to detect a warp amount in a real-time manner in a wafer rotating at high speed under inspection.Type: ApplicationFiled: January 8, 2009Publication date: July 23, 2009Inventors: Masami Ooyama, Masayuki Hachiya, Rieko Hachiya, Kimiko Hachiya, Kazuhiro Zama, Keiichi Nagasaki
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Publication number: 20080297782Abstract: A wafer surface inspection method and apparatus of high sensitivity, and free from performance degradation in terms of cleanliness, coordinate repeatability of foreign particles and the like. Gas for cooling is sprayed onto a laser irradiation position on the wafer surface to prevent an increase in temperature of the foreign particles and to suppress break-down of the foreign particles.Type: ApplicationFiled: August 6, 2008Publication date: December 4, 2008Applicant: HITACHI HIGH-TECHNOLOGIES CORPORTIONInventors: Kazuhiro Zama, Masayuki Hachiya
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Publication number: 20080297781Abstract: A wafer surface inspection method and apparatus of high sensitivity, and free from performance degradation in terms of cleanliness, coordinate repeatability of foreign particles and the like. Gas for cooling is sprayed onto a laser irradiation position on the wafer surface to prevent an increase in temperature of the foreign particles and to suppress break-down of the foreign particles.Type: ApplicationFiled: August 6, 2008Publication date: December 4, 2008Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATIONInventors: Kazuhiro Zama, Masayuki Hachiya
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Patent number: 7420668Abstract: A wafer surface inspection method and apparatus of high sensitivity, and free from performance degradation in terms of cleanliness, coordinate repeatability of foreign particles and the like. Gas for cooling is sprayed onto a laser irradiation position on the wafer surface to prevent an increase in temperature of the foreign particles and to suppress break-down of the foreign particles.Type: GrantFiled: August 10, 2006Date of Patent: September 2, 2008Assignee: Hitachi High-Technologies CorporationInventors: Kazuhiro Zama, Masayuki Hachiya
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Publication number: 20080013084Abstract: In order to realize a surface inspection apparatus capable of inspecting a contaminant particle and a defect with a uniform sensitivity without depending on a rotation angle in a primary scan direction even in the case where intensity of scattered light, which is generated derived from the contaminant particle and the defect existing on the surface of a semiconductor wafer or adjacent to the surface, has anisotropy which depends on an illumination direction; light from a light source 11 becomes two illumination beams 21 and 22 by a beam splitter 12, the beams being irradiated onto a semiconductor wafer 100 from two mutually substantially orthogonal azimuthal angles having substantially equal elevation angles to form illumination spots 3 and 4.Type: ApplicationFiled: July 12, 2007Publication date: January 17, 2008Applicant: Hitachi High-Technologies CorporationInventors: Shigeru MATSUI, Masayuki HACHIYA
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Publication number: 20070211241Abstract: A laser beam oscillated from a laser source is folded in its path by first and second plane mirrors and enters a beam expander. The surface of each plane mirror is deteriorated with illumination by the laser beam and the reflectance is reduced. To avoid a light quantity of the laser beam entering the beam expander from being reduced below a reference value, when the laser beam is illuminated over a certain time, a position on each of the first and second plane mirrors at which the laser beam is illuminated is changed by a structure for rotating and/or translating a reflecting surface of each plane mirror on a plane, which includes the plane mirror, while an optical axis is kept same.Type: ApplicationFiled: February 23, 2007Publication date: September 13, 2007Inventors: Noriyuki Aizawa, Hiroyuki Kawakami, Kazuhiro Zama, Yuuichiro Iijima, Kazuo Takahashi, Yusuke Miyazaki, Masayuki Hachiya, Koichi Asami, Shingo Tanaka
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Publication number: 20070182957Abstract: A wafer surface inspection method and apparatus of high sensitivity, and free from performance degradation in terms of cleanliness, coordinate repeatability of foreign particles and the like. Gas for cooling is sprayed onto a laser irradiation position on the wafer surface to prevent an increase in temperature of the foreign particles and to suppress break-down of the foreign particles.Type: ApplicationFiled: August 10, 2006Publication date: August 9, 2007Inventors: Kazuhiro Zama, Masayuki Hachiya