Patents by Inventor Masayuki Hiramatsu

Masayuki Hiramatsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11924133
    Abstract: Provided is a radio communication device which can separate propagation paths of antenna ports and improve a channel estimation accuracy even when using virtual antennas. The device includes: a mapping unit which maps a data signal after modulation to a virtual antenna and a virtual antenna; a phase inversion unit which inverts the phase of S0 transmitted from an antenna port in synchronization with a phase inversion unit between the odd-number slot and the even-number slot; the phase inversion unit which inverts the phase of R0 transmitted from the antenna port; a phase inversion unit which inverts the phase of S1 transmitted from an antenna port in synchronization with a phase inversion unit; and the phase inversion unit which inverts the phase of R1 transmitted from an antenna port.
    Type: Grant
    Filed: March 24, 2023
    Date of Patent: March 5, 2024
    Assignee: Sun Patent Trust
    Inventors: Seigo Nakao, Masayuki Hoshino, Atsushi Sumasu, Katsuhiko Hiramatsu
  • Patent number: 9127190
    Abstract: According to the present invention, a cover tape for electronic component packaging is provided which has suitable transparency, and which enables suppression of the charge that occurs during peeling from carrier tape. The cover tape for electronic component packaging of the present invention is provided with a heat sealant layer on top of the base layer, and the aforementioned heat sealant layer contains polyolefin resin and polyether-polyolefin copolymer. The weight ratio of the polyether-polyolefin copolymer in the aforementioned heat sealant layer is 10 weight % or more and 70 weight % or less.
    Type: Grant
    Filed: September 28, 2011
    Date of Patent: September 8, 2015
    Assignee: SUMITOMO BAKELITE, CO., LTD
    Inventors: Ken Masui, Masayuki Hiramatsu
  • Patent number: 8584859
    Abstract: The object of the present invention is to provide a cover tape for electronic part packaging that is more difficult to take on electrostatic charge and has excellent transparency, and to provide a package for an electronic part. A cover tape (100) relating to the present invention includes a plurality of layers including at least a base layer (110) and a heat seal layer (140). At least two layers of these plurality of layers are laminated with an adhesive layer (120) interposed. The adhesive layer (120) contains an antistatic agent in an amount that makes up 10 wt % or more and 70 wt % or less of the adhesive layer (120). The antistatic agent contains an alkylene carbonate and a surfactant as the primary components.
    Type: Grant
    Filed: July 21, 2010
    Date of Patent: November 19, 2013
    Assignee: Sumitomo Bakelite Co., Ltd
    Inventor: Masayuki Hiramatsu
  • Publication number: 20130244027
    Abstract: According to the present invention, a cover tape for electronic component packaging is provided which has suitable transparency, and which enables suppression of the charge that occurs during peeling from carrier tape. The cover tape for electronic component packaging of the present invention is provided with a heat sealant layer on top of the base layer, and the aforementioned heat sealant layer contains polyolefin resin and polyether-polyolefin copolymer. The weight ratio of the polyether-polyolefin copolymer in the aforementioned heat sealant layer is 10 weight % or more and 70 weight % or less.
    Type: Application
    Filed: September 28, 2011
    Publication date: September 19, 2013
    Applicant: SUMITOMO BAKELITE CO., LTD.
    Inventors: Ken Masui, Masayuki Hiramatsu
  • Patent number: 8272515
    Abstract: A packaged article containing an electronic device which comprises an electronic device-packaging carrier tape and an electronic device-packaging cover tape, wherein a layer in the cover tape contacting with the carrier tape contains an adhesive resin (A), an electrically-charged resin. (B) charging opposite to the charging polarity of the adhesive resin (A) generating at the time of friction between the adhesive resin (A) and the electronic device, and a metallic filler and/or carbon, and wherein the packaged article containing an electronic device is capable of preventing the adhesion of the electronic devices to the cover tape (pickup failure) resulting from the static and the part breakage by ESD, by inhibiting the static caused by the friction between the contained electronic devices, particularly small/light weight electronic devices, and the cover tape.
    Type: Grant
    Filed: April 9, 2008
    Date of Patent: September 25, 2012
    Assignee: Sumitomo Bakelite Co., Ltd.
    Inventor: Masayuki Hiramatsu
  • Publication number: 20120118789
    Abstract: The object of the present invention is to provide a cover tape for electronic part packaging that is more difficult to take on electrostatic charge and has excellent transparency, and to provide a package for an electronic part. A cover tape (100) relating to the present invention includes a plurality of layers including at least a base layer (110) and a heat seal layer (140), At least two layers of these plurality of layers are laminated with an adhesive layer (120) interposed. The adhesive layer (120) contains an antistatic agent in an amount that makes up 10 wt % or more and 70 wt % or less of the adhesive layer (120). The antistatic agent contains an alkylene carbonate and a surfactant as the primary components.
    Type: Application
    Filed: July 21, 2010
    Publication date: May 17, 2012
    Applicant: SUMITOMO BAKELITE CO., LTD.
    Inventor: Masayuki Hiramatsu
  • Publication number: 20100200457
    Abstract: The present disclosure provides a packaged article containing an electronic device being capable of preventing the adhesion of the electronic devices to the cover tape (pickup failure) resulting from the static and the part breakage caused by ESD, by inhibiting the static caused by the friction between the contained electronic devices (especially small/light weight electronic devices) and the cover tape. A packaged article containing an electronic device which comprises an electronic device-packaging carrier tape and an electronic device-packaging cover tape, wherein a layer in said cover tape contacting with said carrier tape contains an adhesive resin (A) and an electrically-charged resin (B) charging opposite to the charging polarity of said adhesive resin (A) generating at the time of friction between said adhesive resin (A) and said electronic device.
    Type: Application
    Filed: April 9, 2008
    Publication date: August 12, 2010
    Inventor: Masayuki Hiramatsu
  • Patent number: 6787224
    Abstract: A cover tape for packaging electronic components, which can prevent troubles associated with the peeling strength or trouble appearing during mounting of the electronic components, which can be produced at a low cost, and which is transparent; that is, a cover tape has a peeling strength not too high and not too low and small in difference between the maximum value and the minimum value and which has high transparency. Specifically, the cover tape for packaging electronic components, which can be heat-sealed to a plastic-made carrier tape having pockets capable of storing electronic components, formed regularly therein and which is made of (A) a biaxially oriented film layer made of polyester, a polypropylene or a nylon and (B) a thermoplastic resin layer composed of 100 parts by weight of an ethylene copolymer and 10 to 100 parts by weight of polystyrene, laminated to one side of the layer A.
    Type: Grant
    Filed: June 26, 2002
    Date of Patent: September 7, 2004
    Assignee: Sumitomo Bakelite Company Limited
    Inventors: Hisao Nakanishi, Masayuki Hiramatsu
  • Publication number: 20030035946
    Abstract: The present invention provides a cover tape for packaging electronic components, which can prevent troubles associated with the peeling strength or appearing during mounting of the electronic components, which can be produced at a low cost, and which is transparent; that is, a cover tape which has a peeling strength not too high and not too low and small in difference between the maximum value and the minimum value and which has high transparency. Specifically, the present invention provides a cover tape for packaging electronic components, which can be heat-sealed to a plastic-made carrier tape having pockets capable of storing electronic components, formed regularly therein and which comprises (A) a biaxially oriented film layer made of a polyester, a polypropylene or a nylon and (B) a thermoplastic resin layer composed of 100 parts by weight of an ethylene copolymer and 10 to 100 parts by weight of a polystyrene, laminated to one side of the layer A.
    Type: Application
    Filed: June 26, 2002
    Publication date: February 20, 2003
    Inventors: Hisao Nakanishi, Masayuki Hiramatsu